ATE125065T1 - Vorrichtung zum transfer von scheiben, insbesondere silicon-scheiben. - Google Patents

Vorrichtung zum transfer von scheiben, insbesondere silicon-scheiben.

Info

Publication number
ATE125065T1
ATE125065T1 AT92402314T AT92402314T ATE125065T1 AT E125065 T1 ATE125065 T1 AT E125065T1 AT 92402314 T AT92402314 T AT 92402314T AT 92402314 T AT92402314 T AT 92402314T AT E125065 T1 ATE125065 T1 AT E125065T1
Authority
AT
Austria
Prior art keywords
support
plates
discs
destination
original support
Prior art date
Application number
AT92402314T
Other languages
English (en)
Inventor
Franck Dalban-Moreynas
Original Assignee
Photowatt Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photowatt Int filed Critical Photowatt Int
Application granted granted Critical
Publication of ATE125065T1 publication Critical patent/ATE125065T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412Batch transfer of wafers

Landscapes

  • Specific Conveyance Elements (AREA)
  • Chain Conveyers (AREA)
  • Pile Receivers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Registering Or Overturning Sheets (AREA)
  • Silicon Polymers (AREA)
  • Silicon Compounds (AREA)
  • Laminated Bodies (AREA)
  • Warehouses Or Storage Devices (AREA)
AT92402314T 1991-08-20 1992-08-20 Vorrichtung zum transfer von scheiben, insbesondere silicon-scheiben. ATE125065T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9110447A FR2680503B1 (fr) 1991-08-20 1991-08-20 Dispositif de transfert de plaques, notamment de plaques de silicium.

Publications (1)

Publication Number Publication Date
ATE125065T1 true ATE125065T1 (de) 1995-07-15

Family

ID=9416278

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92402314T ATE125065T1 (de) 1991-08-20 1992-08-20 Vorrichtung zum transfer von scheiben, insbesondere silicon-scheiben.

Country Status (5)

Country Link
EP (1) EP0528736B1 (de)
AT (1) ATE125065T1 (de)
DE (1) DE69203411T2 (de)
ES (1) ES2074347T3 (de)
FR (1) FR2680503B1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3075771A1 (fr) * 2017-12-21 2019-06-28 Commissariat A L'energie Atomique Et Aux Energies Alternatives Systeme de transfert de plusieurs plaques entre deux paniers
TWI680526B (zh) * 2018-06-06 2019-12-21 環球晶圓股份有限公司 晶圓轉換裝置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58178535A (ja) * 1982-04-13 1983-10-19 Nec Kyushu Ltd 半導体基板の移し替え装置

Also Published As

Publication number Publication date
FR2680503A1 (fr) 1993-02-26
FR2680503B1 (fr) 1997-07-11
DE69203411D1 (de) 1995-08-17
EP0528736B1 (de) 1995-07-12
ES2074347T3 (es) 1995-09-01
DE69203411T2 (de) 1995-12-21
EP0528736A1 (de) 1993-02-24

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties