ATE126365T1 - Lichtempfindliche semi-wässerig entwickelbare leitfähige kupferzusammensetzung. - Google Patents
Lichtempfindliche semi-wässerig entwickelbare leitfähige kupferzusammensetzung.Info
- Publication number
- ATE126365T1 ATE126365T1 AT90115857T AT90115857T ATE126365T1 AT E126365 T1 ATE126365 T1 AT E126365T1 AT 90115857 T AT90115857 T AT 90115857T AT 90115857 T AT90115857 T AT 90115857T AT E126365 T1 ATE126365 T1 AT E126365T1
- Authority
- AT
- Austria
- Prior art keywords
- conductive copper
- copper composition
- aqueous developable
- developable
- semi
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910021538 borax Inorganic materials 0.000 abstract 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 235000010339 sodium tetraborate Nutrition 0.000 abstract 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/118—Initiator containing with inhibitor or stabilizer
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/396,492 US5047313A (en) | 1989-08-21 | 1989-08-21 | Photosensitive semi-aqueous developable copper conductor composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE126365T1 true ATE126365T1 (de) | 1995-08-15 |
Family
ID=23567401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT90115857T ATE126365T1 (de) | 1989-08-21 | 1990-08-18 | Lichtempfindliche semi-wässerig entwickelbare leitfähige kupferzusammensetzung. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5047313A (de) |
| EP (1) | EP0414168B1 (de) |
| JP (1) | JPH083057B2 (de) |
| KR (1) | KR910005331A (de) |
| CN (1) | CN1050268A (de) |
| AT (1) | ATE126365T1 (de) |
| CA (1) | CA2023601A1 (de) |
| DE (1) | DE69021463T2 (de) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3218767B2 (ja) * | 1992-01-24 | 2001-10-15 | 東レ株式会社 | 感光性導電ペースト |
| US5362806A (en) * | 1993-01-07 | 1994-11-08 | W. R. Grace & Co.-Conn. | Toughened photocurable polymer composition for processible flexographic printing plates |
| JP3239847B2 (ja) * | 1994-11-17 | 2001-12-17 | 東レ株式会社 | 感光性導電ペーストおよび電極の製造方法 |
| WO1998043268A1 (en) * | 1997-03-25 | 1998-10-01 | E.I. Du Pont De Nemours And Company | Field emitter cathode backplate structures for display panels |
| JP3947287B2 (ja) * | 1997-12-27 | 2007-07-18 | 大日本印刷株式会社 | 感光性導体ペーストおよびこれを用いた転写シート |
| US6569602B1 (en) * | 1998-10-05 | 2003-05-27 | E. I. Du Pont De Nemours And Company | Ionization radiation imageable photopolymer compositions |
| DE69910335T2 (de) * | 1998-12-11 | 2004-07-01 | E.I. Du Pont De Nemours And Co., Wilmington | Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band |
| US20060208621A1 (en) * | 1999-09-21 | 2006-09-21 | Amey Daniel I Jr | Field emitter cathode backplate structures for display panels |
| US6783914B1 (en) * | 2000-02-25 | 2004-08-31 | Massachusetts Institute Of Technology | Encapsulated inorganic resists |
| US7005229B2 (en) * | 2002-10-02 | 2006-02-28 | 3M Innovative Properties Company | Multiphoton photosensitization method |
| US7381516B2 (en) * | 2002-10-02 | 2008-06-03 | 3M Innovative Properties Company | Multiphoton photosensitization system |
| US7265161B2 (en) * | 2002-10-02 | 2007-09-04 | 3M Innovative Properties Company | Multi-photon reactive compositions with inorganic particles and method for fabricating structures |
| KR20020078113A (ko) * | 2001-04-04 | 2002-10-18 | 아이키솔루션(주) | 음성, 문자 동시 응답 시스템과 그 제어방법 |
| JP3757886B2 (ja) * | 2002-01-25 | 2006-03-22 | 株式会社村田製作所 | 光反応性樹脂組成物、それを用いた回路基板およびセラミック多層基板の製造方法 |
| US7232650B2 (en) * | 2002-10-02 | 2007-06-19 | 3M Innovative Properties Company | Planar inorganic device |
| US7074349B2 (en) * | 2003-01-24 | 2006-07-11 | E. I. Du Pont De Nemours And Company | Terminal electrode compositions for multilayer ceramic capacitors |
| JP3975932B2 (ja) * | 2003-02-12 | 2007-09-12 | 株式会社村田製作所 | 光反応性樹脂組成物、回路基板の製造方法、およびセラミック多層基板の製造方法 |
| US7303854B2 (en) * | 2003-02-14 | 2007-12-04 | E.I. Du Pont De Nemours And Company | Electrode-forming composition for field emission type of display device, and method using such a composition |
| US20110083874A1 (en) | 2009-10-09 | 2011-04-14 | E. I. Du Pont De Nemours And Company | Electrode and method for manufacturing the same |
| US8129088B2 (en) * | 2009-07-02 | 2012-03-06 | E.I. Du Pont De Nemours And Company | Electrode and method for manufacturing the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3443944A (en) * | 1963-10-23 | 1969-05-13 | United Aircraft Corp | Method of depositing conductive patterns on a substrate |
| US3833384A (en) * | 1972-04-26 | 1974-09-03 | Eastman Kodak Co | Photopolymerizable compositions and elements and uses thereof |
| US3923504A (en) * | 1973-01-29 | 1975-12-02 | Xerox Corp | Migration imaging member and method |
| US4032698A (en) * | 1973-02-02 | 1977-06-28 | E. I. Du Pont De Nemours And Company | Polymeric materials with substituted urea end groups |
| JPH0642073B2 (ja) * | 1984-04-10 | 1994-06-01 | 三菱レイヨン株式会社 | 光重合性樹脂組成物 |
| US4598037A (en) * | 1984-12-21 | 1986-07-01 | E. I. Du Pont De Nemours And Company | Photosensitive conductive metal composition |
| US4613560A (en) * | 1984-12-28 | 1986-09-23 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic coating composition |
| US4693959A (en) * | 1986-03-07 | 1987-09-15 | E.I. Du Pont De Nemours And Company | Adhesion promotion in photoresist lamination and processing |
| JPS63154773A (ja) * | 1986-12-17 | 1988-06-28 | Toyobo Co Ltd | 光硬化型導電性焼成ペ−スト |
| JPS63265979A (ja) * | 1987-04-23 | 1988-11-02 | Toyobo Co Ltd | 光硬化型導電性焼成ペ−スト |
| US4908296A (en) * | 1988-05-31 | 1990-03-13 | E. I. Du Pont De Nemours And Company | Photosensitive semi-aqueous developable ceramic coating composition |
-
1989
- 1989-08-21 US US07/396,492 patent/US5047313A/en not_active Expired - Fee Related
-
1990
- 1990-08-18 EP EP90115857A patent/EP0414168B1/de not_active Expired - Lifetime
- 1990-08-18 DE DE69021463T patent/DE69021463T2/de not_active Expired - Fee Related
- 1990-08-18 AT AT90115857T patent/ATE126365T1/de not_active IP Right Cessation
- 1990-08-20 CA CA002023601A patent/CA2023601A1/en not_active Abandoned
- 1990-08-20 KR KR1019900012798A patent/KR910005331A/ko not_active Ceased
- 1990-08-21 JP JP2218293A patent/JPH083057B2/ja not_active Expired - Lifetime
- 1990-08-21 CN CN90107934A patent/CN1050268A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0414168B1 (de) | 1995-08-09 |
| JPH083057B2 (ja) | 1996-01-17 |
| EP0414168A2 (de) | 1991-02-27 |
| KR910005331A (ko) | 1991-03-30 |
| CN1050268A (zh) | 1991-03-27 |
| US5047313A (en) | 1991-09-10 |
| DE69021463T2 (de) | 1996-02-22 |
| EP0414168A3 (en) | 1991-04-24 |
| JPH03205462A (ja) | 1991-09-06 |
| DE69021463D1 (de) | 1995-09-14 |
| CA2023601A1 (en) | 1991-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |