ATE133022T1 - Material zum giessen einer gedruckten schaltplatte und gedruckte schaltplatte unter verwendung dieses materials - Google Patents

Material zum giessen einer gedruckten schaltplatte und gedruckte schaltplatte unter verwendung dieses materials

Info

Publication number: ATE133022T1
Authority: AT; Austria
Prior art keywords: circuit board; printed circuit; weight; parts; casting
Prior art date: 1989-09-04

Application number

AT90116625T

Other languages

English (en)

Inventor

Akikazu Nakano

Original Assignee

Idemitsu Kosan Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-09-04

Filing date

1990-08-30

Publication date

1996-01-15

1990-08-30 Application filed by Idemitsu Kosan Co filed Critical Idemitsu Kosan Co

1996-01-15 Application granted granted Critical

1996-01-15 Publication of ATE133022T1 publication Critical patent/ATE133022T1/de

Links

239000000463 material Substances 0.000 title abstract 4
238000005266 casting Methods 0.000 title 1
RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 3
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
239000003063 flame retardant Substances 0.000 abstract 2
229920000642 polymer Polymers 0.000 abstract 2
238000013329 compounding Methods 0.000 abstract 1
239000012765 fibrous filler Substances 0.000 abstract 1
239000011888 foil Substances 0.000 abstract 1
238000000465 moulding Methods 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Compositions Of Macromolecular Compounds (AREA)
Laminated Bodies (AREA)
Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Reinforced Plastic Materials (AREA)

AT90116625T 1989-09-04 1990-08-30 Material zum giessen einer gedruckten schaltplatte und gedruckte schaltplatte unter verwendung dieses materials ATE133022T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1227561A JP2779224B2 (ja)	1989-09-04	1989-09-04	プリント配線板成形用材料及び該材料を用いたプリント配線板

Publications (1)

Publication Number	Publication Date
ATE133022T1 true ATE133022T1 (de)	1996-01-15

Family

ID=16862840

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT90116625T ATE133022T1 (de)	1989-09-04	1990-08-30	Material zum giessen einer gedruckten schaltplatte und gedruckte schaltplatte unter verwendung dieses materials

Country Status (6)

Country	Link
EP (1)	EP0416461B1 (de)
JP (1)	JP2779224B2 (de)
KR (1)	KR970004753B1 (de)
AT (1)	ATE133022T1 (de)
CA (1)	CA2024494C (de)
DE (1)	DE69024722T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3901752B2 (ja) *	1995-07-20	2007-04-04	出光興産株式会社	難燃性ポリスチレン系樹脂組成物及びポリスチレン系樹脂成形体
JP4598903B2 (ja) *	1998-07-24	2010-12-15	出光興産株式会社	電子部品
JP4723775B2 (ja) *	2001-09-27	2011-07-13	ポリマテック株式会社	ダンパー及びその取付構造
JP2003185064A (ja)	2001-12-19	2003-07-03	Ge Plastics Japan Ltd	配管部材
JP2007093730A (ja) *	2005-09-27	2007-04-12	Sharp Corp	ディスプレイ装置
EP4525563A1 (de) *	2023-09-13	2025-03-19	Schleifring GmbH	Grosse leiterplatten für rf-drehverbindungen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1276748C (en) *	1985-07-29	1990-11-20	Michitake Uoi	Styrene polymers
DE3780635T2 (de) *	1987-09-15	1992-12-10	Idemitsu Kosan Co	Harzzusammensetzung auf der basis von polystyrol.

1989
- 1989-09-04 JP JP1227561A patent/JP2779224B2/ja not_active Expired - Fee Related
1990
- 1990-08-30 EP EP90116625A patent/EP0416461B1/de not_active Expired - Lifetime
- 1990-08-30 DE DE69024722T patent/DE69024722T2/de not_active Expired - Fee Related
- 1990-08-30 AT AT90116625T patent/ATE133022T1/de not_active IP Right Cessation
- 1990-08-31 CA CA002024494A patent/CA2024494C/en not_active Expired - Fee Related
- 1990-09-04 KR KR1019900014082A patent/KR970004753B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CA2024494C (en)	2001-03-06
DE69024722D1 (de)	1996-02-22
EP0416461B1 (de)	1996-01-10
JP2779224B2 (ja)	1998-07-23
JPH0391549A (ja)	1991-04-17
EP0416461A3 (en)	1993-01-27
DE69024722T2 (de)	1996-05-23
CA2024494A1 (en)	1991-03-05
KR970004753B1 (ko)	1997-04-03
EP0416461A2 (de)	1991-03-13
KR910007394A (ko)	1991-04-30

Legal Events

Date	Code	Title	Description
1996-07-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
EP0808866A3 (de)	1998-01-14	Laserbeschriftbare Polymerformmassen
ES8404385A1 (es)	1984-05-01	"un procedimiento de preparacion de composiciones acabadas para el moldeo"
NO910693L (no)	1991-08-26	Halvtermoplastisk avstoepningsblanding med varmestabil formhukommelse for avtrykk.
ES479794A1 (es)	1979-12-01	Procedimiento de obtencion de compuestos de moldeo termo- plasticos a base de polioximetilenos.
EP0400935A3 (de)	1991-01-09	Flammengeschützte und glasfaserverstärkte Polyesterharzformmassen
DE50003489D1 (de)	2003-10-02	Füllstoffhaltige thermoplastische formmassen auf basis von polycarbonat und styrolcopolymeren
EP0416518A3 (en)	1993-01-27	Process for producing printed circuit boards and printed circuit boards obtained thereby
ATE133022T1 (de)	1996-01-15	Material zum giessen einer gedruckten schaltplatte und gedruckte schaltplatte unter verwendung dieses materials
ATE133988T1 (de)	1996-02-15	Thermoplastische polymere zusammensetzungen, welche modifikatoren der schmelz-rheologie enthalten
MY109686A (en)	1997-04-30	Flame-retardant resin composition.
ES2040679T1 (es)	1993-11-01	Aglutinantes sobre la base de lignina y resinas sinteticas.
DE68924959D1 (de)	1996-01-11	Verfahren zur Herstellung von Polymeren auf der Basis von Styrol.
GB1526159A (en)	1978-09-27	Arc resistant poly(arylene sulphide)
JPS5416566A (en)	1979-02-07	Flame-retardant polyphenylene ether composition
TW207549B (de)	1993-06-11
ES2150098T3 (es)	2000-11-16	Homopolimeros y copolimeros de propileno injertados y un proceso para su preparacion.
EP0397498A3 (de)	1991-04-10	Polypropylenharzzusammensetzungen
ATE32908T1 (de)	1988-03-15	Thermoplastische massen auf basis von polyphenylenethern und styrol-butadienemulsionspolymerisaten.
KR890701646A (ko)	1989-12-21	스티렌계 중합체의 제조방법
JPS5474852A (en)	1979-06-15	Polyester resin composition
DE3670092D1 (de)	1990-05-10	Thermoplastische formmassen.
ATE85986T1 (de)	1993-03-15	Expandierbare formmassen mit hoher waermebestaendigkeit und verfahren zu ihrer herstellung.
EP0388969A3 (de)	1991-01-09	Verbundwerkstoffe mit verminderter Mikrorissbildung und Verfahren zu ihrer Herstellung
JPS5556150A (en)	1980-04-24	Plastic polymer material*its manufacture and its laminate product
JPS53113851A (en)	1978-10-04	Polyolefin resin composition