ATE134726T1 - Platin- oder platinlegierung-plattierungsbad - Google Patents

Platin- oder platinlegierung-plattierungsbad

Info

Publication number
ATE134726T1
ATE134726T1 AT89308558T AT89308558T ATE134726T1 AT E134726 T1 ATE134726 T1 AT E134726T1 AT 89308558 T AT89308558 T AT 89308558T AT 89308558 T AT89308558 T AT 89308558T AT E134726 T1 ATE134726 T1 AT E134726T1
Authority
AT
Austria
Prior art keywords
platinum
plating bath
alloy plating
bath
acid
Prior art date
Application number
AT89308558T
Other languages
English (en)
Inventor
John Michael Albon
Wendy Jane Davis
Peter Eric Skinner
Stephen Geoffrey Warren
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Application granted granted Critical
Publication of ATE134726T1 publication Critical patent/ATE134726T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Glass Compositions (AREA)
AT89308558T 1988-09-07 1989-08-23 Platin- oder platinlegierung-plattierungsbad ATE134726T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888821005A GB8821005D0 (en) 1988-09-07 1988-09-07 Improvements in plating

Publications (1)

Publication Number Publication Date
ATE134726T1 true ATE134726T1 (de) 1996-03-15

Family

ID=10643207

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89308558T ATE134726T1 (de) 1988-09-07 1989-08-23 Platin- oder platinlegierung-plattierungsbad

Country Status (9)

Country Link
US (1) US5102509A (de)
EP (1) EP0358375B1 (de)
JP (1) JP2859316B2 (de)
AT (1) ATE134726T1 (de)
CA (1) CA1339116C (de)
DE (1) DE68925768T2 (de)
GB (1) GB8821005D0 (de)
IE (1) IE75696B1 (de)
ZA (1) ZA896403B (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU648316B2 (en) * 1990-06-29 1994-04-21 Electroplating Engineers Of Japan, Limited Platinum electoforming and platinum electroplating
GB9212831D0 (en) * 1992-06-17 1992-07-29 Johnson Matthey Plc Improvements in plating baths
US5639564A (en) * 1993-02-05 1997-06-17 Baldwin Hardware Corporation Multi-layer coated article
US5641579A (en) * 1993-02-05 1997-06-24 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5626972A (en) * 1994-06-02 1997-05-06 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5478659A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5478660A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5484663A (en) * 1994-11-30 1996-01-16 Baldwin Hardware Corporation Article having a coating simulating brass
US5482788A (en) * 1994-11-30 1996-01-09 Baldwin Hardware Corporation Article having a protective coating simulating brass
EP0737760B1 (de) * 1995-04-15 2000-04-19 Degussa-Hüls Aktiengesellschaft Galvanisches Platinbad
US5667904A (en) * 1995-05-22 1997-09-16 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
CA2176892C (en) * 1995-05-22 2002-10-29 Stephen R. Moysan, Iii Article having a decorative and protective coating simulating brass
US5552233A (en) * 1995-05-22 1996-09-03 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5654108A (en) * 1995-05-22 1997-08-05 Baldwin Hardware Corporation Article having a protective coating simulating brass
US5783313A (en) * 1995-12-22 1998-07-21 Baldwin Hardware Corporation Coated Article
US5693427A (en) * 1995-12-22 1997-12-02 Baldwin Hardware Corporation Article with protective coating thereon
US5788823A (en) * 1996-07-23 1998-08-04 Howmet Research Corporation Platinum modified aluminide diffusion coating and method
US5948548A (en) * 1997-04-30 1999-09-07 Masco Corporation Coated article
US6106958A (en) * 1997-04-30 2000-08-22 Masco Corporation Article having a coating
US5989730A (en) * 1997-04-30 1999-11-23 Masco Corporation Article having a decorative and protective multi-layer coating
US6033790A (en) * 1997-04-30 2000-03-07 Masco Corporation Article having a coating
US5985468A (en) * 1997-04-30 1999-11-16 Masco Corporation Article having a multilayer protective and decorative coating
US5952111A (en) * 1997-04-30 1999-09-14 Masco Corporation Article having a coating thereon
US6004684A (en) * 1997-04-30 1999-12-21 Masco Corporation Article having a protective and decorative multilayer coating
US5879532A (en) * 1997-07-09 1999-03-09 Masco Corporation Of Indiana Process for applying protective and decorative coating on an article
US6268060B1 (en) 1997-08-01 2001-07-31 Mascotech Coatings, Inc. Chrome coating having a silicone top layer thereon
DE19906417C1 (de) 1999-02-16 2000-06-29 Heraeus Gmbh W C Stützstruktur
US20020000380A1 (en) * 1999-10-28 2002-01-03 Lyndon W. Graham Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece
US6306277B1 (en) * 2000-01-14 2001-10-23 Honeywell International Inc. Platinum electrolyte for use in electrolytic plating
US20040253386A1 (en) * 2003-06-13 2004-12-16 Sarojini Deevi Preparation of intermetallics by metallo-organic decomposition
JP4566667B2 (ja) * 2004-01-16 2010-10-20 キヤノン株式会社 めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US20060042932A1 (en) * 2004-08-25 2006-03-02 Rosenzweig Mark A Apparatus and method for electroplating a workpiece
US7494576B2 (en) * 2004-08-26 2009-02-24 General Electric Company Electroplating apparatus and method for making an electroplating anode assembly
DE102007050349B4 (de) 2007-10-11 2018-06-07 Kaco Gmbh + Co. Kg Dichtungsanordnung für den Hochdruckbereich
US20100055422A1 (en) * 2008-08-28 2010-03-04 Bob Kong Electroless Deposition of Platinum on Copper
FR2958300B1 (fr) * 2010-03-31 2012-05-04 Snecma Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique.
GB201100447D0 (en) * 2011-01-12 2011-02-23 Johnson Matthey Plc Improvements in coating technology
GB201200482D0 (en) * 2012-01-12 2012-02-22 Johnson Matthey Plc Improvements in coating technology
FR2989694B1 (fr) * 2012-04-19 2015-02-27 Snecma Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique
US9840918B2 (en) 2013-04-26 2017-12-12 Howmet Corporation Internal airfoil component electroplating
CA2866479C (en) 2013-12-20 2021-08-17 Will N. Kirkendall Internal turbine component electroplating
CN104152953A (zh) * 2014-08-29 2014-11-19 昆明贵金属研究所 磷酸槽电镀铂用的主盐及其合成方法
JP6336890B2 (ja) * 2014-10-31 2018-06-06 石福金属興業株式会社 無電解白金めっき浴
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions
IT202100003281A1 (it) 2021-02-15 2022-08-15 Bluclad S P A Lega pt-ni elettrodepositata anallergica e relativi bagno e ciclo galvanico
CN114182315B (zh) * 2022-02-14 2022-05-17 深圳市顺信精细化工有限公司 一种耐腐蚀组合电镀层及电镀方法
GB202217304D0 (en) * 2022-11-18 2023-01-04 Johnson Matthey Plc High efficiency platinum electroplating solutions
CN117263151B (zh) * 2023-09-12 2025-07-22 云南贵金属实验室有限公司 一种q盐中间体、制备方法、制备q盐和p盐的方法及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE371542A (de) * 1929-07-02
US1991995A (en) * 1932-10-03 1935-02-19 Int Nickel Co Platinum metal ammino cyanide plating bath and process for electrodeposition of platinum metal therefrom
NL123540C (de) * 1958-08-06
GB897690A (en) * 1959-09-30 1962-05-30 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of platinum or palladium
US4427502A (en) * 1981-11-16 1984-01-24 Bell Telephone Laboratories, Incorporated Platinum and platinum alloy electroplating baths and processes
JPS5967388A (ja) * 1982-09-09 1984-04-17 エンゲルハ−ド・コ−ポレ−シヨン パラジウムメツキ浴
US4493754A (en) * 1983-12-30 1985-01-15 At&T Bell Laboratories Electrodes for palladium electroplating process

Also Published As

Publication number Publication date
EP0358375B1 (de) 1996-02-28
CA1339116C (en) 1997-07-29
GB8821005D0 (en) 1988-10-05
US5102509A (en) 1992-04-07
DE68925768D1 (de) 1996-04-04
JPH02107794A (ja) 1990-04-19
ZA896403B (en) 1990-11-28
IE892857L (en) 1990-03-07
DE68925768T2 (de) 1996-07-25
IE75696B1 (en) 1997-09-10
JP2859316B2 (ja) 1999-02-17
EP0358375A1 (de) 1990-03-14

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties