ATE140581T1 - Verfahren zur herstellung von einer gedruckten leiterplatte - Google Patents

Verfahren zur herstellung von einer gedruckten leiterplatte

Info

Publication number
ATE140581T1
ATE140581T1 AT91906887T AT91906887T ATE140581T1 AT E140581 T1 ATE140581 T1 AT E140581T1 AT 91906887 T AT91906887 T AT 91906887T AT 91906887 T AT91906887 T AT 91906887T AT E140581 T1 ATE140581 T1 AT E140581T1
Authority
AT
Austria
Prior art keywords
circuit board
producing
printed circuit
printed
transversing
Prior art date
Application number
AT91906887T
Other languages
English (en)
Inventor
John Michael Rowe
Original Assignee
Ferguson Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferguson Ltd filed Critical Ferguson Ltd
Application granted granted Critical
Publication of ATE140581T1 publication Critical patent/ATE140581T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AT91906887T 1990-03-27 1991-03-21 Verfahren zur herstellung von einer gedruckten leiterplatte ATE140581T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB909006855A GB9006855D0 (en) 1990-03-27 1990-03-27 Method of producing a printed circuit board

Publications (1)

Publication Number Publication Date
ATE140581T1 true ATE140581T1 (de) 1996-08-15

Family

ID=10673358

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91906887T ATE140581T1 (de) 1990-03-27 1991-03-21 Verfahren zur herstellung von einer gedruckten leiterplatte

Country Status (11)

Country Link
EP (1) EP0521982B1 (de)
JP (1) JPH05506962A (de)
KR (1) KR100226555B1 (de)
CN (1) CN1039566C (de)
AT (1) ATE140581T1 (de)
AU (1) AU7573691A (de)
DE (1) DE69120937T2 (de)
ES (1) ES2090322T3 (de)
GB (2) GB9006855D0 (de)
HK (1) HK131197A (de)
WO (1) WO1991015100A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476847A (en) * 1994-06-29 1995-12-19 Schering Corporation Derivatives of phosphinic acid useful as endothelin converting enzyme inhibitors
US5539156A (en) * 1994-11-16 1996-07-23 International Business Machines Corporation Non-annular lands
JP2006041409A (ja) * 2004-07-30 2006-02-09 Toshiba Corp 配線基板及び磁気ディスク装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
CA1197325A (en) * 1984-06-04 1985-11-26 Beverley W. Gumb Masking of holes in circuit patterns on circuit boards prior to flow soldering
US4851614A (en) * 1987-05-22 1989-07-25 Compaq Computer Corporation Non-occluding mounting hole with solder pad for printed circuit boards

Also Published As

Publication number Publication date
CN1039566C (zh) 1998-08-19
WO1991015100A1 (en) 1991-10-03
EP0521982A1 (de) 1993-01-13
CN1056793A (zh) 1991-12-04
GB9006855D0 (en) 1990-05-23
DE69120937D1 (de) 1996-08-22
JPH05506962A (ja) 1993-10-07
KR100226555B1 (ko) 1999-10-15
AU7573691A (en) 1991-10-21
GB2242384A (en) 1991-10-02
HK131197A (en) 1997-09-26
ES2090322T3 (es) 1996-10-16
EP0521982B1 (de) 1996-07-17
GB9106552D0 (en) 1991-05-15
DE69120937T2 (de) 1996-11-28

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties