ATE146333T1 - Hochfrequenzschaltung und verfahren zur deren herstellung - Google Patents

Hochfrequenzschaltung und verfahren zur deren herstellung

Info

Publication number
ATE146333T1
ATE146333T1 AT93202495T AT93202495T ATE146333T1 AT E146333 T1 ATE146333 T1 AT E146333T1 AT 93202495 T AT93202495 T AT 93202495T AT 93202495 T AT93202495 T AT 93202495T AT E146333 T1 ATE146333 T1 AT E146333T1
Authority
AT
Austria
Prior art keywords
earth plane
production
high frequency
frequency circuit
face
Prior art date
Application number
AT93202495T
Other languages
English (en)
Inventor
Pierre Chanteau
Original Assignee
Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics Nv filed Critical Philips Electronics Nv
Application granted granted Critical
Publication of ATE146333T1 publication Critical patent/ATE146333T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Burglar Alarm Systems (AREA)
  • Structure Of Receivers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
AT93202495T 1992-09-02 1993-08-25 Hochfrequenzschaltung und verfahren zur deren herstellung ATE146333T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9210480A FR2695290A1 (fr) 1992-09-02 1992-09-02 Circuit pour des fréquences élevées, et procédé pour le réaliser.

Publications (1)

Publication Number Publication Date
ATE146333T1 true ATE146333T1 (de) 1996-12-15

Family

ID=9433147

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93202495T ATE146333T1 (de) 1992-09-02 1993-08-25 Hochfrequenzschaltung und verfahren zur deren herstellung

Country Status (6)

Country Link
US (1) US5408207A (de)
EP (1) EP0586010B1 (de)
JP (1) JP3456724B2 (de)
AT (1) ATE146333T1 (de)
DE (1) DE69306507T2 (de)
FR (1) FR2695290A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3240804B2 (ja) * 1994-02-18 2001-12-25 株式会社村田製作所 回路モジュールの製造方法
US5863141A (en) * 1996-07-22 1999-01-26 Hewlett-Packard Company Image-related device with printed-circuit assembly cantilevered from sheet-metal base & with clip fastenings
JP3897506B2 (ja) * 2000-01-20 2007-03-28 日本電産サンキョー株式会社 ブラシレスモータ
JP3929250B2 (ja) * 2001-03-08 2007-06-13 株式会社ルネサステクノロジ 半導体装置
US7898810B2 (en) * 2008-12-19 2011-03-01 Raytheon Company Air cooling for a phased array radar
DE102011056743A1 (de) * 2011-12-21 2013-06-27 Conti Temic Microelectronic Gmbh Masseverbindung einer Leiterplatte in einem Steuergerät

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721312A (en) * 1951-06-30 1955-10-18 Itt Microwave cable
US3621478A (en) * 1970-04-13 1971-11-16 Bell Telephone Labor Inc Suspended substrate transmission lines having coupled center conductors
US4184133A (en) 1977-11-28 1980-01-15 Rockwell International Corporation Assembly of microwave integrated circuits having a structurally continuous ground plane
JPS59221002A (ja) * 1983-05-28 1984-12-12 Toshiba Corp マイクロストリツプ線路ユニツト
FR2589650A1 (fr) * 1985-11-05 1987-05-07 Radiotechnique Circuit a ligne microbande resonnante
IT8819772A0 (it) * 1988-03-15 1988-03-15 Honeywell Bull Spa Dispositivo selettivo a terra per apparecchiature elettroniche.
GB2219892B (en) * 1988-06-16 1992-07-15 Plessey Co Plc A circuit board laminate and method of providing same
IT1231457B (it) * 1989-04-03 1991-12-07 Selenia Spazio Spa Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali
DE8911412U1 (de) * 1989-09-25 1989-11-16 Siemens AG, 1000 Berlin und 8000 München Leiterplatte für die elektrische Nachrichtentechnik, die mit integrierten Schaltkreisen bestückt ist
US5319329A (en) * 1992-08-21 1994-06-07 Trw Inc. Miniature, high performance MMIC compatible filter

Also Published As

Publication number Publication date
FR2695290A1 (fr) 1994-03-04
EP0586010B1 (de) 1996-12-11
JP3456724B2 (ja) 2003-10-14
DE69306507T2 (de) 1997-06-05
US5408207A (en) 1995-04-18
EP0586010A1 (de) 1994-03-09
JPH06224571A (ja) 1994-08-12
DE69306507D1 (de) 1997-01-23

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee