ATE153454T1 - Verfahren zur positionierung eines ersten substrats auf ein zweites und so hergestellte mikromechanische positioniervorrichtung - Google Patents

Verfahren zur positionierung eines ersten substrats auf ein zweites und so hergestellte mikromechanische positioniervorrichtung

Info

Publication number
ATE153454T1
ATE153454T1 AT92810691T AT92810691T ATE153454T1 AT E153454 T1 ATE153454 T1 AT E153454T1 AT 92810691 T AT92810691 T AT 92810691T AT 92810691 T AT92810691 T AT 92810691T AT E153454 T1 ATE153454 T1 AT E153454T1
Authority
AT
Austria
Prior art keywords
substrate
bearing surfaces
positioning
conjugate
micromechanical
Prior art date
Application number
AT92810691T
Other languages
English (en)
Inventor
Olivier Parriaux
Johan Wilhelm Bergqvist
Original Assignee
Suisse Electronique Microtech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suisse Electronique Microtech filed Critical Suisse Electronique Microtech
Application granted granted Critical
Publication of ATE153454T1 publication Critical patent/ATE153454T1/de

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Control Of Position Or Direction (AREA)
AT92810691T 1991-09-10 1992-09-10 Verfahren zur positionierung eines ersten substrats auf ein zweites und so hergestellte mikromechanische positioniervorrichtung ATE153454T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2656/91A CH685522A5 (fr) 1991-09-10 1991-09-10 Procédé pour positionner un premier substrat sur un second substrat et dispositif micromécanique de positionnement obtenu.

Publications (1)

Publication Number Publication Date
ATE153454T1 true ATE153454T1 (de) 1997-06-15

Family

ID=4238653

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92810691T ATE153454T1 (de) 1991-09-10 1992-09-10 Verfahren zur positionierung eines ersten substrats auf ein zweites und so hergestellte mikromechanische positioniervorrichtung

Country Status (4)

Country Link
EP (1) EP0532469B1 (de)
AT (1) ATE153454T1 (de)
CH (1) CH685522A5 (de)
DE (1) DE69219842T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997002501A1 (en) * 1995-06-30 1997-01-23 The Whitaker Corporation Passive alignment frame using monocrystalline material
US6085007A (en) * 1998-02-27 2000-07-04 Jiang; Ching-Long Passive alignment member for vertical surface emitting/detecting device
US5981975A (en) * 1998-02-27 1999-11-09 The Whitaker Corporation On-chip alignment fiducials for surface emitting devices
GB2373063A (en) * 2001-03-09 2002-09-11 Bookham Technology Plc Optical coupling for mounting an optical fibre on a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009476A (en) * 1984-01-16 1991-04-23 Texas Instruments Incorporated Semiconductor layer with optical communication between chips disposed therein
EP0253886A1 (de) * 1986-01-21 1988-01-27 AT&T Corp. Verbindungen für den zusammenbau von gesamtscheiben integrierter schaltungen
DE59003592D1 (de) * 1989-09-29 1994-01-05 Siemens Ag Verfahren zur Herstellung eines Körpers aus Silizium.

Also Published As

Publication number Publication date
DE69219842T2 (de) 1998-01-02
EP0532469B1 (de) 1997-05-21
DE69219842D1 (de) 1997-06-26
EP0532469A1 (de) 1993-03-17
CH685522A5 (fr) 1995-07-31

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Legal Events

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