ATE158111T1 - Vorrichtung zur überprüfung von drahtzufuhr und - verbrauch - Google Patents

Vorrichtung zur überprüfung von drahtzufuhr und - verbrauch

Info

Publication number
ATE158111T1
ATE158111T1 AT91301765T AT91301765T ATE158111T1 AT E158111 T1 ATE158111 T1 AT E158111T1 AT 91301765 T AT91301765 T AT 91301765T AT 91301765 T AT91301765 T AT 91301765T AT E158111 T1 ATE158111 T1 AT E158111T1
Authority
AT
Austria
Prior art keywords
wire
bonding
lever
consumption
wire supply
Prior art date
Application number
AT91301765T
Other languages
English (en)
Inventor
Farhad Farassat
Original Assignee
F&K Delvotec Bondtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F&K Delvotec Bondtechnik Gmbh filed Critical F&K Delvotec Bondtechnik Gmbh
Application granted granted Critical
Publication of ATE158111T1 publication Critical patent/ATE158111T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Unwinding Of Filamentary Materials (AREA)
AT91301765T 1990-03-16 1991-03-04 Vorrichtung zur überprüfung von drahtzufuhr und - verbrauch ATE158111T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9006000A GB9006000D0 (en) 1990-03-16 1990-03-16 Device for monitoring wire supply and consumption

Publications (1)

Publication Number Publication Date
ATE158111T1 true ATE158111T1 (de) 1997-09-15

Family

ID=10672757

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91301765T ATE158111T1 (de) 1990-03-16 1991-03-04 Vorrichtung zur überprüfung von drahtzufuhr und - verbrauch

Country Status (5)

Country Link
EP (1) EP0447085B1 (de)
JP (1) JPH0774201A (de)
AT (1) ATE158111T1 (de)
DE (1) DE69127563T2 (de)
GB (1) GB9006000D0 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104085728A (zh) * 2014-07-09 2014-10-08 新兴铸管股份有限公司 天车钢丝绳更换装置
KR101674029B1 (ko) * 2015-04-10 2016-11-09 (주) 인선 박스 봉합기용 와이어 풀림 장치 및 이를 구비한 박스 봉합기
CN104827174B (zh) * 2015-04-29 2016-10-05 张家港市东航机械有限公司 一种工字轮焊接装置
CN106185451B (zh) * 2016-07-20 2019-05-31 诺克威特种导体（常州）有限公司 一种无机械阻力放线装置
CN106629448B (zh) * 2017-01-20 2019-03-26 广州吉物保贸易有限公司 自动张力缠缆机
CN109761104A (zh) * 2019-03-21 2019-05-17 福建浔兴拉链科技股份有限公司 一种可收放的拉链码装自动送料装置
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3485426A (en) * 1967-10-11 1969-12-23 Anthony Apicella Web tensioning device
US3587959A (en) * 1969-06-02 1971-06-28 Formaster Ltd Web feeding devices
US4572421A (en) * 1983-09-19 1986-02-25 Storage Technology Partners Apparatus for feeding wire to a wire bonding mechanism
US4763826A (en) * 1986-05-14 1988-08-16 Kulicke And Soffa Ind., Inc. Automatic wire feed system

Also Published As

Publication number Publication date
GB9006000D0 (en) 1990-05-09
JPH0774201A (ja) 1995-03-17
EP0447085A2 (de) 1991-09-18
DE69127563T2 (de) 1998-04-02
DE69127563D1 (de) 1997-10-16
EP0447085A3 (en) 1994-05-18
EP0447085B1 (de) 1997-09-10

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee