ATE162749T1 - Verfahren und vorrichtung zum schneiden der deckfolie eines laminierten folienmaterials - Google Patents

Verfahren und vorrichtung zum schneiden der deckfolie eines laminierten folienmaterials

Info

Publication number
ATE162749T1
ATE162749T1 AT94107239T AT94107239T ATE162749T1 AT E162749 T1 ATE162749 T1 AT E162749T1 AT 94107239 T AT94107239 T AT 94107239T AT 94107239 T AT94107239 T AT 94107239T AT E162749 T1 ATE162749 T1 AT E162749T1
Authority
AT
Austria
Prior art keywords
cutting
sheet
laminated film
film material
cover film
Prior art date
Application number
AT94107239T
Other languages
English (en)
Inventor
Peter Ing Bechmann
Original Assignee
Bechmann Peter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bechmann Peter filed Critical Bechmann Peter
Application granted granted Critical
Publication of ATE162749T1 publication Critical patent/ATE162749T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/02—Means for moving the cutting member into its operative position for cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0348—Active means to control depth of score
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
    • Y10T83/148—Including means to correct the sensed operation

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Cutting Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Nonmetal Cutting Devices (AREA)
AT94107239T 1993-05-10 1994-05-09 Verfahren und vorrichtung zum schneiden der deckfolie eines laminierten folienmaterials ATE162749T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4315539A DE4315539C2 (de) 1993-05-10 1993-05-10 Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten Folienmaterials

Publications (1)

Publication Number Publication Date
ATE162749T1 true ATE162749T1 (de) 1998-02-15

Family

ID=6487702

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94107239T ATE162749T1 (de) 1993-05-10 1994-05-09 Verfahren und vorrichtung zum schneiden der deckfolie eines laminierten folienmaterials

Country Status (4)

Country Link
US (1) US5515758A (de)
EP (1) EP0624438B1 (de)
AT (1) ATE162749T1 (de)
DE (2) DE4315539C2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100429326B1 (ko) * 1994-12-21 2004-07-14 킹 짐(주) 점착시트의박리방법및그장치
JPH08229887A (ja) * 1994-12-27 1996-09-10 Seiko Epson Corp 積層シートのカット方法およびその装置
AUPN653695A0 (en) * 1995-11-14 1995-12-07 Tangential Technologies Pty. Limited Method and apparatus for distinguishing a boundary between two layers
EP0841131A1 (de) * 1996-11-07 1998-05-13 Bullmer Spezialmaschinen GmbH Schneidvorrichtung mit Hubregelung
WO2002022296A2 (en) 2000-09-11 2002-03-21 Allison Advanced Development Company Mechanically grooved sheet and method of manufacture
SE517931C2 (sv) * 2000-11-10 2002-08-06 Ericsson Telefon Ab L M Anordning för att kapa en optisk fiber
DE10135180A1 (de) * 2001-07-19 2003-02-06 Koenig & Bauer Ag Vorrichtung und Verfahren zum Durchtrennen eines Klebebandes
JP2008229789A (ja) * 2007-03-22 2008-10-02 Nec Corp 凹部形成方法、凹部形成装置、及び凹部形成用材料
FR2998823B1 (fr) * 2012-11-30 2015-06-05 Oberthur Technologies Dispositif de decoupe pour test de delaminage
JP2018171669A (ja) * 2017-03-31 2018-11-08 ブラザー工業株式会社 切断装置
DE102019215077A1 (de) * 2019-09-30 2021-04-01 Hegla Gmbh & Co. Kg Schneidverfahren und Schneideinrichtung zum Ritzen von Bauteilen aus Glas oder Keramik sowie Verfahren zum Aufteilen von Bauteilen aus Glas oder Keramik

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1390455A (en) * 1971-03-19 1975-04-16 Amada Co Ltd Vertical band sawing machine
US3880028A (en) * 1974-02-25 1975-04-29 Ppg Industries Inc Method and apparatus for monitoring and controlling glass cutting
US3897659A (en) * 1974-08-30 1975-08-05 Us Energy Ultrasonic-acoustic grinding wheel setting station for automatic numerically-controlled machines
ES498824A0 (es) * 1981-01-26 1983-05-01 Investronica Sa Sistema mejorado para corregir flexiones de la cuchilla en una maquina automatica de corte
NZ208780A (en) * 1983-07-05 1988-02-29 Univ Western Australia Contact sensing device
US4624169A (en) * 1985-04-08 1986-11-25 Aerochem, Inc. Apparatus for automated cutting of thin films
US4736625A (en) * 1986-11-05 1988-04-12 The Warner & Swasey Company Method and apparatus for monitoring the cutting condition of a machine tool during machining of a workpiece
DE3729208C1 (de) * 1987-08-29 1988-12-22 Rotring Werke Riepe Kg Schneidvorrichtung
US4920495A (en) * 1988-07-15 1990-04-24 Gfm Holdings Ag Sheet cutting machine
US5038654A (en) * 1989-04-04 1991-08-13 Ppg Industries, Inc. Apparatus for scoring a glass sheet
US5136817A (en) * 1990-02-28 1992-08-11 Nihon Dempa Kogyo Co., Ltd. Automatic lapping apparatus for piezoelectric materials
US5222329A (en) * 1992-03-26 1993-06-29 Micron Technology, Inc. Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials

Also Published As

Publication number Publication date
DE4315539A1 (de) 1994-11-17
DE4315539C2 (de) 1995-03-23
DE59405145D1 (de) 1998-03-05
EP0624438A1 (de) 1994-11-17
EP0624438B1 (de) 1998-01-28
US5515758A (en) 1996-05-14

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee