ATE163796T1 - Schaltungsschutzeinrichtung - Google Patents

Schaltungsschutzeinrichtung

Info

Publication number
ATE163796T1
ATE163796T1 AT93917069T AT93917069T ATE163796T1 AT E163796 T1 ATE163796 T1 AT E163796T1 AT 93917069 T AT93917069 T AT 93917069T AT 93917069 T AT93917069 T AT 93917069T AT E163796 T1 ATE163796 T1 AT E163796T1
Authority
AT
Austria
Prior art keywords
main part
electrode
resistive element
protection device
leg
Prior art date
Application number
AT93917069T
Other languages
English (en)
Inventor
Gregory A Graves
Michael Zhang
Daniel Chandler
Chi-Ming Chang
Shou-Mean Fang
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25429551&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE163796(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of ATE163796T1 publication Critical patent/ATE163796T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003Thick film resistors
    • H01C7/005Polymer thick films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10022Non-printed resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10469Asymmetrically mounted component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10643Disc shaped leadless component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10666Plated through-hole for surface mounting on PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Details Of Resistors (AREA)
  • Fuses (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Amplifiers (AREA)
  • Air Bags (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Developing Agents For Electrophotography (AREA)
AT93917069T 1992-07-09 1993-07-08 Schaltungsschutzeinrichtung ATE163796T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US91095092A 1992-07-09 1992-07-09

Publications (1)

Publication Number Publication Date
ATE163796T1 true ATE163796T1 (de) 1998-03-15

Family

ID=25429551

Family Applications (2)

Application Number Title Priority Date Filing Date
AT97202527T ATE250274T1 (de) 1992-07-09 1993-07-08 Elektrische bauelemente
AT93917069T ATE163796T1 (de) 1992-07-09 1993-07-08 Schaltungsschutzeinrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT97202527T ATE250274T1 (de) 1992-07-09 1993-07-08 Elektrische bauelemente

Country Status (8)

Country Link
EP (3) EP0649562B1 (de)
JP (1) JPH07509347A (de)
KR (1) KR100275161B1 (de)
AT (2) ATE250274T1 (de)
CA (1) CA2139330C (de)
DE (2) DE69333211T2 (de)
ES (1) ES2114062T3 (de)
WO (1) WO1994001876A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852397A (en) 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
US5451921A (en) * 1993-10-04 1995-09-19 Raychem Corporation Electrical devices
DE69504333T2 (de) * 1994-05-16 1999-05-12 Raychem Corp., Menlo Park, Calif. Elektrisches bauteil mit einem ptc-widerstandselement
US5582770A (en) * 1994-06-08 1996-12-10 Raychem Corporation Conductive polymer composition
EP0764333B1 (de) 1994-06-08 1999-12-01 Raychem Corporation Leitfähige polymere enthaltende elektrische vorrichtungen
EP0766867B1 (de) 1994-06-09 2002-11-20 Tyco Electronics Corporation Elektrische bauelemente
US5691688A (en) * 1994-07-20 1997-11-25 Therm-O-Disc, Incorporated PTC device
JP3930904B2 (ja) * 1995-03-22 2007-06-13 レイケム・コーポレイション 電気デバイス
CA2215903A1 (en) * 1995-03-22 1996-10-03 Raychem Corporation Conductive polymer composition and device
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
US5884391A (en) * 1996-01-22 1999-03-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5900800A (en) * 1996-01-22 1999-05-04 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US6215388B1 (en) * 1996-09-27 2001-04-10 Therm-Q-Disc, Incorporated Parallel connected PTC elements
CN1135570C (zh) 1997-06-04 2004-01-21 泰科电子有限公司 电路保护器件
US6782604B2 (en) 1997-07-07 2004-08-31 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chip PTC thermistor
US6606023B2 (en) 1998-04-14 2003-08-12 Tyco Electronics Corporation Electrical devices
DE69940849D1 (de) * 1998-05-18 2009-06-18 Tyco Electronics Raychem Kk Ptc-element, ptc-element-montierte pcb-platte, sekundärzellenschutzkreisvorrichtung und sekundärzellenaufbau
US6300859B1 (en) 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
US6854176B2 (en) 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
TW487272U (en) * 2001-03-20 2002-05-11 Polytronics Technology Corp Multilayer circuit boards
CN100350606C (zh) 2002-04-08 2007-11-21 力特保险丝有限公司 使用压变材料的装置
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
US7931124B2 (en) 2007-12-12 2011-04-26 United Technologies Corporation On-demand lubrication system and method for improved flow management and containment

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497859A (en) * 1968-05-28 1970-02-24 Stackpole Carbon Co Electrical resistors for printed circuits
GB1415454A (en) * 1973-05-04 1975-11-26 Welwyn Electric Ltd Mounting means of electrical components
JPS5545629A (en) * 1978-09-28 1980-03-31 Nippon Soda Co Ltd Preparation of 4-aminopyridine
US4237441A (en) * 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
US4475138A (en) * 1980-04-21 1984-10-02 Raychem Corporation Circuit protection devices comprising PTC element
JPS59147430A (ja) * 1983-02-10 1984-08-23 Oki Electric Ind Co Ltd 微細回路の形成方法
JPS6443038A (en) * 1987-08-06 1989-02-15 Sawafuji Electric Co Ltd On-vehicle load power supplying circuit
FR2620561B1 (fr) * 1987-09-15 1992-04-24 Europ Composants Electron Thermistance ctp pour le montage en surface
JPH01143203A (ja) * 1987-11-27 1989-06-05 Murata Mfg Co Ltd 有機正特性サーミスタ
AU637370B2 (en) * 1989-05-18 1993-05-27 Fujikura Ltd. Ptc thermistor and manufacturing method for the same
US5122775A (en) * 1990-02-14 1992-06-16 Raychem Corporation Connection device for resistive elements
JPH0448701A (ja) * 1990-06-15 1992-02-18 Daito Tsushinki Kk 自己復帰形過電流保護素子

Also Published As

Publication number Publication date
CA2139330A1 (en) 1994-01-20
ES2114062T3 (es) 1998-05-16
EP0811993B1 (de) 2003-09-17
WO1994001876A1 (en) 1994-01-20
JPH07509347A (ja) 1995-10-12
EP1347470A1 (de) 2003-09-24
EP0649562A1 (de) 1995-04-26
ATE250274T1 (de) 2003-10-15
DE69317288T2 (de) 1998-11-12
KR100275161B1 (ko) 2000-12-15
EP0811993A3 (de) 1998-11-25
EP0811993A2 (de) 1997-12-10
DE69333211T2 (de) 2004-07-01
EP0649562B1 (de) 1998-03-04
HK1020388A1 (en) 2000-04-14
HK1009305A1 (en) 1999-05-28
DE69317288D1 (de) 1998-04-09
KR950702738A (ko) 1995-07-29
DE69333211D1 (de) 2003-10-23
CA2139330C (en) 2004-10-12

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