ATE165668T1 - Leiterplattentestanordnung mit testadapter und methode zum ausrichten dessen - Google Patents
Leiterplattentestanordnung mit testadapter und methode zum ausrichten dessenInfo
- Publication number
- ATE165668T1 ATE165668T1 AT95910516T AT95910516T ATE165668T1 AT E165668 T1 ATE165668 T1 AT E165668T1 AT 95910516 T AT95910516 T AT 95910516T AT 95910516 T AT95910516 T AT 95910516T AT E165668 T1 ATE165668 T1 AT E165668T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit board
- test
- adapters
- printed circuit
- contact elements
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
- G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Time-Division Multiplex Systems (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4406538A DE4406538A1 (de) | 1994-02-28 | 1994-02-28 | Leiterplatten-Prüfeinrichtung mit Prüfadapter und Verfahren zum Einstellen desselben |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE165668T1 true ATE165668T1 (de) | 1998-05-15 |
Family
ID=6511433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT95910516T ATE165668T1 (de) | 1994-02-28 | 1995-02-23 | Leiterplattentestanordnung mit testadapter und methode zum ausrichten dessen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6191597B1 (de) |
| EP (1) | EP0748450B2 (de) |
| JP (1) | JPH10501331A (de) |
| AT (1) | ATE165668T1 (de) |
| CA (1) | CA2180642A1 (de) |
| DE (2) | DE4406538A1 (de) |
| WO (1) | WO1995023340A1 (de) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1282617B1 (it) * | 1996-02-13 | 1998-03-31 | Circuit Line Spa | Metodo e dispositivo per l'eliminazione dell'errore di centraggio nella fase di test elettrico di circuiti stampati |
| DE19644725C1 (de) * | 1996-10-28 | 1998-04-02 | Atg Test Systems Gmbh | Vorrichtung und Verfahren zum Prüfen von Leiterplatten |
| TW360790B (en) | 1996-10-28 | 1999-06-11 | Atg Test Systems Gmbh | Printed circuit board test apparatus and method |
| IT1290345B1 (it) * | 1997-02-18 | 1998-10-22 | Circuit Line Spa | Metodo e dispositivo per la correzione dell'errore di allineamento fra aghi di test e punti di test nella fase di test elettrico di |
| IT1291643B1 (it) * | 1997-04-22 | 1999-01-19 | Circuit Line Spa | Metodo di regolazione automatica per l'eliminazione dell'errore di centraggio in fase di test elettrico di circuiti stampati |
| DE19957286A1 (de) * | 1999-11-29 | 2001-07-05 | Atg Test Systems Gmbh | Verfahren und Vorrichtung zum Testen von Leiterplatten |
| DE19961791C2 (de) * | 1999-12-21 | 2002-11-28 | Infineon Technologies Ag | Anordnung zum Testen von Chips mittels einer gedruckten Schaltungsplatte |
| DE10043726C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens |
| DE10043728C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens |
| US6885205B2 (en) * | 2000-12-13 | 2005-04-26 | Seagate Technology Llc | Test fixture assembly for printed circuit boards |
| DE10223867B4 (de) * | 2002-05-29 | 2006-07-06 | Elco Europe Gmbh | Leiterplatten-Prüfeinheit |
| DE10320381B4 (de) * | 2003-05-06 | 2010-11-04 | Scorpion Technologies Ag | Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln |
| KR100546410B1 (ko) * | 2004-05-18 | 2006-01-26 | 삼성전자주식회사 | 고속 시스템 레벨 테스트에 사용되는 테스트 보드 |
| US20060022692A1 (en) * | 2004-07-28 | 2006-02-02 | Lameres Brock J | Backside attach probe, components thereof, and methods for making and using same |
| US20080088330A1 (en) * | 2006-09-11 | 2008-04-17 | Zhiming Mei | Nonconductive substrate with imbedded conductive pin(s) for contacting probe(s) |
| DE102009004555A1 (de) | 2009-01-14 | 2010-09-30 | Atg Luther & Maelzer Gmbh | Verfahren zum Prüfen von Leiterplatten |
| US8648616B2 (en) * | 2009-12-22 | 2014-02-11 | Ltx-Credence Corporation | Loaded printed circuit board test fixture and method for manufacturing the same |
| KR101692277B1 (ko) | 2010-11-23 | 2017-01-04 | 주식회사 고영테크놀러지 | 검사방법 |
| US11619665B2 (en) * | 2020-01-07 | 2023-04-04 | International Business Machines Corporation | Electrical apparatus having tin whisker sensing and prevention |
| US12174241B2 (en) | 2022-12-29 | 2024-12-24 | International Business Machines Corporation | Apparatus and method for tin whisker isolation and detection |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE233427C (de) | ||||
| DE2628428C3 (de) † | 1976-06-24 | 1979-02-15 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Adapter zum Verbinden von Anschluß- und/oder Prüfpunkten einer Baugruppe mit einer Mefischaltung |
| DE2933862A1 (de) | 1979-08-21 | 1981-03-12 | Paul Mang | Vorrichtung zur elektronischen pruefung von leiterplatten. |
| DE3142817A1 (de) | 1980-10-30 | 1982-07-08 | Everett/Charles, Inc., 91730 Rancho Cucamonga, Calif. | Uebertragungseinrichtung, test-spannvorrichtung mit uebertragungseinrichtung und verfahren zur bildung einer uebertragungseinrichtung |
| DE3110056C2 (de) | 1981-03-16 | 1986-02-27 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH, 6384 Schmitten | Kontaktanordnung mit einer Vielzahl von in einer Kontaktebene angeordneten Kontakten |
| DE3311977A1 (de) * | 1983-03-31 | 1984-10-04 | Siemens AG, 1000 Berlin und 8000 München | Anordnung zum elektrischen abtasten einer baugruppe |
| JPS6138575A (ja) | 1984-07-31 | 1986-02-24 | Kyoei Sangyo Kk | プリント配線板検査機用アダプタユニツト |
| JPS6176367A (ja) | 1984-09-25 | 1986-04-18 | Mitsubishi Heavy Ind Ltd | レ−ザ製版装置 |
| JPS62240871A (ja) | 1986-04-14 | 1987-10-21 | Fujitsu Ltd | プリント板測定装置のプロービング方法 |
| JPS63151872A (ja) | 1986-12-16 | 1988-06-24 | Hitachi Electronics Eng Co Ltd | 基板導通自動検査装置 |
| GB8700754D0 (en) | 1987-01-14 | 1987-02-18 | Int Computers Ltd | Test apparatus for printed circuit boards |
| EP0283545B1 (de) | 1987-03-27 | 1991-10-16 | Ibm Deutschland Gmbh | Kontaktsonden-Anordnung zur elektrischen Verbindung einer Prüfeinrichtung mit den kreisförmigen Anschlussflächen eines Prüflings |
| DE3722485A1 (de) * | 1987-07-03 | 1989-01-12 | Deutsche Telephonwerk Kabel | Federnde kontaktnadel und kontaktiereinrichtung |
| JPS6425069A (en) | 1987-07-21 | 1989-01-27 | Nec Corp | Wiring testing apparatus for printed wiring board |
| US4963822A (en) * | 1988-06-01 | 1990-10-16 | Manfred Prokopp | Method of testing circuit boards and the like |
| DE3909284A1 (de) * | 1989-03-21 | 1990-09-27 | Nixdorf Computer Ag | Steckkontaktanordnung |
| WO1991019392A1 (en) | 1990-05-25 | 1991-12-12 | Everett/Charles Contact Products, Inc. | Test fixture alignment system |
| US5206820A (en) * | 1990-08-31 | 1993-04-27 | At&T Bell Laboratories | Metrology system for analyzing panel misregistration in a panel manufacturing process and providing appropriate information for adjusting panel manufacturing processes |
| DE4107387A1 (de) * | 1991-03-08 | 1992-09-10 | Protech Automation Gmbh | Pruefvorrichtung fuer elektrische komponenten |
| EP0508561B1 (de) * | 1991-04-11 | 1996-07-17 | METHODE ELECTRONICS, Inc. | Gerät zum elektronischen Testen von gedruckten Leiterplatten oder ähnlichem |
| JP2720688B2 (ja) | 1992-01-31 | 1998-03-04 | ジェイエスアール株式会社 | 回路基板の検査方法 |
| JPH05215773A (ja) * | 1992-02-04 | 1993-08-24 | Nhk Spring Co Ltd | 多点測定用導電性接触子ユニット |
| US5225777A (en) * | 1992-02-04 | 1993-07-06 | International Business Machines Corporation | High density probe |
| US5575076A (en) * | 1994-07-13 | 1996-11-19 | Methode Electronics, Inc. | Circuit board testing fixture with registration plate |
| US5898313A (en) * | 1997-03-14 | 1999-04-27 | Cugini; Mario A. | Test fixture for two sided circuit boards |
-
1994
- 1994-02-28 DE DE4406538A patent/DE4406538A1/de not_active Withdrawn
-
1995
- 1995-02-23 EP EP95910516A patent/EP0748450B2/de not_active Expired - Lifetime
- 1995-02-23 CA CA002180642A patent/CA2180642A1/en not_active Abandoned
- 1995-02-23 WO PCT/EP1995/000662 patent/WO1995023340A1/en not_active Ceased
- 1995-02-23 JP JP7522131A patent/JPH10501331A/ja active Pending
- 1995-02-23 US US08/619,662 patent/US6191597B1/en not_active Expired - Fee Related
- 1995-02-23 AT AT95910516T patent/ATE165668T1/de not_active IP Right Cessation
- 1995-02-23 DE DE69502276T patent/DE69502276T3/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO1995023340A1 (en) | 1995-08-31 |
| EP0748450B1 (de) | 1998-04-29 |
| DE4406538A1 (de) | 1995-08-31 |
| JPH10501331A (ja) | 1998-02-03 |
| EP0748450A1 (de) | 1996-12-18 |
| US6191597B1 (en) | 2001-02-20 |
| DE69502276D1 (de) | 1998-06-04 |
| DE69502276T2 (de) | 1998-08-20 |
| DE69502276T3 (de) | 2005-07-07 |
| EP0748450B2 (de) | 2004-10-20 |
| CA2180642A1 (en) | 1995-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |