ATE168820T1 - Vorrichtung zur herstellung von halbleiterschichten mit dynamischer dampfbehandlung und teilchenverflüchtigung - Google Patents

Vorrichtung zur herstellung von halbleiterschichten mit dynamischer dampfbehandlung und teilchenverflüchtigung

Info

Publication number
ATE168820T1
ATE168820T1 AT91911521T AT91911521T ATE168820T1 AT E168820 T1 ATE168820 T1 AT E168820T1 AT 91911521 T AT91911521 T AT 91911521T AT 91911521 T AT91911521 T AT 91911521T AT E168820 T1 ATE168820 T1 AT E168820T1
Authority
AT
Austria
Prior art keywords
processing
bowl
wafers
volatization
particle
Prior art date
Application number
AT91911521T
Other languages
English (en)
Inventor
Eric J Bergman
Timothy J Reardon
Raymon Thompson
Aleksander Owczarz
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/526,243 external-priority patent/US5168887A/en
Priority claimed from US07/526,057 external-priority patent/US5238500A/en
Priority claimed from US07/665,942 external-priority patent/US5235995A/en
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of ATE168820T1 publication Critical patent/ATE168820T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers

Landscapes

  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AT91911521T 1990-05-15 1991-04-19 Vorrichtung zur herstellung von halbleiterschichten mit dynamischer dampfbehandlung und teilchenverflüchtigung ATE168820T1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US52423990A 1990-05-15 1990-05-15
US07/526,243 US5168887A (en) 1990-05-18 1990-05-18 Single wafer processor apparatus
US52605290A 1990-05-21 1990-05-21
US07/526,057 US5238500A (en) 1990-05-15 1990-05-21 Aqueous hydrofluoric and hydrochloric acid vapor processing of semiconductor wafers
US66560991A 1991-03-06 1991-03-06
US07/665,942 US5235995A (en) 1989-03-27 1991-03-06 Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization

Publications (1)

Publication Number Publication Date
ATE168820T1 true ATE168820T1 (de) 1998-08-15

Family

ID=27560099

Family Applications (2)

Application Number Title Priority Date Filing Date
AT91911521T ATE168820T1 (de) 1990-05-15 1991-04-19 Vorrichtung zur herstellung von halbleiterschichten mit dynamischer dampfbehandlung und teilchenverflüchtigung
AT97122754T ATE253257T1 (de) 1990-05-15 1991-05-14 Vorrichtung zur behandlung von wafern

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT97122754T ATE253257T1 (de) 1990-05-15 1991-05-14 Vorrichtung zur behandlung von wafern

Country Status (6)

Country Link
EP (2) EP0528995B1 (de)
JP (1) JP3802554B2 (de)
AT (2) ATE168820T1 (de)
AU (1) AU7961391A (de)
DE (3) DE69129850T2 (de)
WO (1) WO1991017897A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3067245B2 (ja) 1991-04-15 2000-07-17 東京エレクトロン株式会社 基板処理装置
US5348619A (en) * 1992-09-03 1994-09-20 Texas Instruments Incorporated Metal selective polymer removal
KR100735876B1 (ko) 1999-07-30 2007-07-06 동경 엘렉트론 주식회사 기판처리방법 및 기판처리장치
DE19959558A1 (de) * 1999-12-10 2001-06-21 Messer Griesheim Gmbh Reinigung von Materialoberflächen mit Gasen
DE10235020B4 (de) * 2002-07-31 2004-08-26 Christian-Albrechts-Universität Zu Kiel Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben
JP4700536B2 (ja) * 2006-03-22 2011-06-15 東京エレクトロン株式会社 液処理装置並びに液処理装置の処理液供給方法及び処理液供給プログラム。
US9773744B2 (en) 2011-07-12 2017-09-26 Globalfoundries Inc. Solder bump cleaning before reflow

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489608A (en) * 1965-10-26 1970-01-13 Kulicke & Soffa Ind Inc Method and apparatus for treating semiconductor wafers
JPS5882521A (ja) * 1981-07-10 1983-05-18 Hitachi Ltd スピンナ
US4749440A (en) * 1985-08-28 1988-06-07 Fsi Corporation Gaseous process and apparatus for removing films from substrates
JPH0834205B2 (ja) * 1986-11-21 1996-03-29 株式会社東芝 ドライエツチング装置
GB2198810A (en) * 1986-12-19 1988-06-22 Philips Electronic Associated Apparatus suitable for processing semiconductor slices
US4768291A (en) * 1987-03-12 1988-09-06 Monarch Technologies Corporation Apparatus for dry processing a semiconductor wafer
US4857142A (en) * 1988-09-22 1989-08-15 Fsi International, Inc. Method and apparatus for controlling simultaneous etching of front and back sides of wafers

Also Published As

Publication number Publication date
WO1991017897A1 (en) 1991-11-28
AU7961391A (en) 1991-12-10
ATE253257T1 (de) 2003-11-15
DE69133335D1 (de) 2003-12-04
EP0528995B1 (de) 1998-07-22
DE69129850D1 (de) 1998-08-27
EP0528995A1 (de) 1993-03-03
DE853332T1 (de) 1999-03-04
EP0853332B1 (de) 2003-10-29
DE69129850T2 (de) 1998-12-24
JPH05507389A (ja) 1993-10-21
JP3802554B2 (ja) 2006-07-26
EP0853332A1 (de) 1998-07-15
DE69133335T2 (de) 2004-07-22
EP0528995A4 (en) 1993-05-05

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee