ATE171560T1 - Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen musters - Google Patents
Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen mustersInfo
- Publication number
- ATE171560T1 ATE171560T1 AT94200526T AT94200526T ATE171560T1 AT E171560 T1 ATE171560 T1 AT E171560T1 AT 94200526 T AT94200526 T AT 94200526T AT 94200526 T AT94200526 T AT 94200526T AT E171560 T1 ATE171560 T1 AT E171560T1
- Authority
- AT
- Austria
- Prior art keywords
- pattern
- conductive polymer
- solution
- metalization
- producing
- Prior art date
Links
- 229920001940 conductive polymer Polymers 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000001465 metallisation Methods 0.000 title 1
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000004528 spin coating Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP93200665 | 1993-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE171560T1 true ATE171560T1 (de) | 1998-10-15 |
Family
ID=8213682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT94200526T ATE171560T1 (de) | 1993-03-09 | 1994-03-02 | Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen musters |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5447824A (de) |
| JP (1) | JP3530565B2 (de) |
| AT (1) | ATE171560T1 (de) |
| DE (1) | DE69413436T2 (de) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5549851A (en) * | 1994-01-25 | 1996-08-27 | Shin-Etsu Chemical Co., Ltd. | Conductive polymer composition |
| DE19507413A1 (de) * | 1994-05-06 | 1995-11-09 | Bayer Ag | Leitfähige Beschichtungen |
| US6022669A (en) * | 1995-05-02 | 2000-02-08 | Symetrix Corporation | Method of fabricating an integrated circuit using self-patterned thin films |
| DE19524132A1 (de) * | 1995-07-03 | 1997-01-09 | Bayer Ag | Kratzfeste leitfähige Beschichtungen |
| EP1007349B1 (de) * | 1995-11-22 | 2004-09-29 | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY | Leitende gemusterte polymeroberfläche, verfahren zu ihrer herstellung und diese enthaltende anordnungen |
| EP0968537B1 (de) | 1997-08-22 | 2012-05-02 | Creator Technology B.V. | Feld-effekt-transistor, der im wesentlichen aus organischen materialien besteht |
| DE69937485T2 (de) | 1998-01-28 | 2008-08-21 | Thin Film Electronics Asa | Methode zur herstellung zwei- oder dreidimensionaler elektrisch leitender oder halbleitender strukturen, eine löschmethode derselben und ein generator/modulator eines elektrischen feldes zum gebrauch in der herstellungsmethode |
| DE19841804A1 (de) * | 1998-09-12 | 2000-03-16 | Bayer Ag | Leiterbahnen aus Polyalkylendioxythiophen |
| EP1138091B1 (de) | 1999-09-10 | 2007-01-17 | Koninklijke Philips Electronics N.V. | Leitende struktur basierend auf poly-3,4-alkendioxythiophen (pedot) und polystyrolsulfonsäure (pss) |
| EP1085319B1 (de) * | 1999-09-13 | 2005-06-01 | Interuniversitair Micro-Elektronica Centrum Vzw | Vorrichtung auf Basis von organischem Material zur Erfassung eines Probenanalyts |
| US6893887B2 (en) | 2001-01-18 | 2005-05-17 | Semiconductor Energy Laboratory Co., Ltd. | Process for producing a light emitting device |
| US6720198B2 (en) | 2001-02-19 | 2004-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
| SG143945A1 (en) | 2001-02-19 | 2008-07-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
| DE10124631C1 (de) * | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
| JP2003046257A (ja) * | 2001-07-30 | 2003-02-14 | Toppan Forms Co Ltd | 導電性高分子を用いた多層回路を備えたプリント配線紙 |
| US6649327B2 (en) * | 2001-10-25 | 2003-11-18 | The United States Of America As Represented By The Secretary Of The Navy | Method of patterning electrically conductive polymers |
| JP4294489B2 (ja) * | 2002-02-05 | 2009-07-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 感光性組成物 |
| SG130013A1 (en) * | 2002-07-25 | 2007-03-20 | Semiconductor Energy Lab | Method of fabricating light emitting device |
| EP1532640A1 (de) * | 2002-08-22 | 2005-05-25 | Agfa-Gevaert | Verfahren zur herstellung einer im wesentlichen transparenten leitfähigen schicht |
| US7118836B2 (en) * | 2002-08-22 | 2006-10-10 | Agfa Gevaert | Process for preparing a substantially transparent conductive layer configuration |
| US7026079B2 (en) * | 2002-08-22 | 2006-04-11 | Agfa Gevaert | Process for preparing a substantially transparent conductive layer configuration |
| AU2003260959A1 (en) * | 2002-09-11 | 2004-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting apparatus and fabrication method of the same |
| DE10244197A1 (de) * | 2002-09-23 | 2004-04-08 | Infineon Technologies Ag | Zusammensetzung, die eine elektrisch leitfähige Lackschicht bildet und ein Verfahren zur Strukturierung eines Fotoresists unter Verwendung der Lackschicht |
| US8062734B2 (en) * | 2003-04-28 | 2011-11-22 | Eastman Kodak Company | Article comprising conductive conduit channels |
| DE10324533A1 (de) * | 2003-05-28 | 2004-12-16 | H.C. Starck Gmbh | Stabile Lösungen von organischen halbleitenden Verbindungen |
| FR2858222A1 (fr) * | 2003-07-16 | 2005-02-04 | Oreal | Composition comprenant un polymere conducteur et un agent oxydant,procede de deformation permanente la mettant en oeuvre |
| US7083885B2 (en) * | 2003-09-23 | 2006-08-01 | Eastman Kodak Company | Transparent invisible conductive grid |
| US7320813B2 (en) * | 2003-12-15 | 2008-01-22 | The United States Of America As Represented By The Secretary Of The Navy | Synthesis of highly conducting and transparent thin polymer films |
| US7449758B2 (en) * | 2004-08-17 | 2008-11-11 | California Institute Of Technology | Polymeric piezoresistive sensors |
| JP4583917B2 (ja) * | 2004-12-27 | 2010-11-17 | 株式会社フジクラ | 電子デバイスの製造方法および透明導電回路基板の製造方法 |
| EP1835513A4 (de) * | 2004-12-27 | 2011-11-09 | Fujikura Ltd | Elektronische einrichtung und verfahren zu ihrer herstellung |
| JP2006185675A (ja) * | 2004-12-27 | 2006-07-13 | Fujikura Ltd | 電子デバイスおよびその製造方法 |
| JP2006185673A (ja) * | 2004-12-27 | 2006-07-13 | Fujikura Ltd | 電子デバイスの製造方法 |
| JP2008532206A (ja) * | 2004-12-30 | 2008-08-14 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 照射を使用するデバイスのパターニング |
| JP5241997B2 (ja) * | 2005-03-08 | 2013-07-17 | 信越ポリマー株式会社 | 導電性高分子溶液および導電性塗膜 |
| WO2006103605A1 (en) * | 2005-04-01 | 2006-10-05 | Koninklijke Philips Electronics N.V. | Method of manufacturing an electrophoretic display device and an electrophoretic display device |
| KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| ES2272172B1 (es) * | 2005-07-29 | 2008-04-01 | Consejo Superior Investig. Cientificas | Procedimiento para la obtencion de patrones en un sustrato organico conductor y material de naturaleza organica asi obtenido. |
| KR20080043772A (ko) * | 2005-08-01 | 2008-05-19 | 플렉스트로닉스, 인크 | 전도성 중합체의 잠재성 도핑 |
| US20070085061A1 (en) * | 2005-10-14 | 2007-04-19 | Elder Delwin L | Conductivity enhancement of conductive polymers by solvent exposure |
| GB0523437D0 (en) | 2005-11-17 | 2005-12-28 | Imp College Innovations Ltd | A method of patterning a thin film |
| CN103456626B (zh) * | 2006-09-29 | 2016-06-08 | 东亚合成株式会社 | 导电性高分子用蚀刻液、及将导电性高分子图案化的方法 |
| US8066840B2 (en) * | 2007-01-22 | 2011-11-29 | Solopower, Inc. | Finger pattern formation for thin film solar cells |
| EP2222755B1 (de) * | 2007-12-07 | 2016-10-05 | Agfa-Gevaert N.V. | Schichtaufbau mit verbesserter stabilität gegenüber der einwirkung von sonnenlicht |
| EP2224795A1 (de) * | 2009-02-26 | 2010-09-01 | ZYRUS Beteiligungsgesellschaft mbH & Co. Patente I KG | Verfahren zur Herstellung einer Metallstruktur auf einem Substrat |
| KR20130030494A (ko) * | 2011-09-19 | 2013-03-27 | 삼성전기주식회사 | 도금패턴 및 그 제조방법 |
| EP2602357A1 (de) | 2011-12-05 | 2013-06-12 | Atotech Deutschland GmbH | Neuartiges Haftmittel zur Metallisierung von Substratoberflächen |
| EP2644744A1 (de) | 2012-03-29 | 2013-10-02 | Atotech Deutschland GmbH | Verfahren zur Förderung der Haftung zwischen dielektrischen Substraten und Metallschichten |
| KR101294229B1 (ko) * | 2012-12-10 | 2013-08-07 | 와이엠티 주식회사 | 인쇄회로기판의 쓰루 홀 또는 비아 홀 내벽에 전도성폴리머층을 형성하는 방법 |
| US8709194B1 (en) * | 2013-02-25 | 2014-04-29 | Eastman Kodak Company | Assembling an electrode device |
| WO2015062068A1 (zh) * | 2013-11-01 | 2015-05-07 | 深圳市海富莱电子有限公司 | 一种形成导电功能图案的图形化方法与应用 |
| DE102015103651B4 (de) * | 2015-03-12 | 2017-11-16 | Osram Oled Gmbh | Verfahren zur Herstellung von elektrisch leitenden Strukturen und organische Leuchtdiode |
| JP6686244B2 (ja) * | 2015-03-17 | 2020-04-22 | 国立大学法人東北大学 | 電極素子及び電極の生産方法、並びに、当該電極を用いる測定システムの作製 |
| KR20180089486A (ko) * | 2015-12-03 | 2018-08-08 | 마이크로닉 아베 | 중합체 층을 이용하여 공작물을 제조하기 위한 방법 및 시스템 |
| CN117296115A (zh) * | 2021-05-31 | 2023-12-26 | 帝化株式会社 | 导电性高分子用掺杂剂溶液、导电性高分子制造用单体液、导电性组合物及其制造方法、以及电解电容器及其制造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306443A (en) * | 1989-03-27 | 1994-04-26 | Nippon Soda Co., Ltd. | Method for the preparation of conductive polymer film |
| US5198153A (en) * | 1989-05-26 | 1993-03-30 | International Business Machines Corporation | Electrically conductive polymeric |
-
1994
- 1994-03-02 DE DE69413436T patent/DE69413436T2/de not_active Expired - Fee Related
- 1994-03-02 AT AT94200526T patent/ATE171560T1/de not_active IP Right Cessation
- 1994-03-07 JP JP03594994A patent/JP3530565B2/ja not_active Expired - Fee Related
- 1994-03-07 US US08/207,560 patent/US5447824A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06318775A (ja) | 1994-11-15 |
| DE69413436T2 (de) | 1999-05-20 |
| US5447824A (en) | 1995-09-05 |
| JP3530565B2 (ja) | 2004-05-24 |
| DE69413436D1 (de) | 1998-10-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| REN | Ceased due to non-payment of the annual fee |