ATE182427T1 - Kühlung eines grossen mikroprozessors in einer kleinen baugruppe - Google Patents

Kühlung eines grossen mikroprozessors in einer kleinen baugruppe

Info

Publication number
ATE182427T1
ATE182427T1 AT95901925T AT95901925T ATE182427T1 AT E182427 T1 ATE182427 T1 AT E182427T1 AT 95901925 T AT95901925 T AT 95901925T AT 95901925 T AT95901925 T AT 95901925T AT E182427 T1 ATE182427 T1 AT E182427T1
Authority
AT
Austria
Prior art keywords
functional modules
heat
docked
modules
sink structures
Prior art date
Application number
AT95901925T
Other languages
English (en)
Inventor
Dan Kikinis
Original Assignee
Elonex I P Holdings Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elonex I P Holdings Limited filed Critical Elonex I P Holdings Limited
Application granted granted Critical
Publication of ATE182427T1 publication Critical patent/ATE182427T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1632—External expansion units, e.g. docking stations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H05K5/0265—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of PCMCIA type
    • H05K5/0273—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of PCMCIA type having extensions for peripherals, e.g. LAN, antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H05K5/0291—Receptacles therefor, e.g. card slots, module sockets, card groundings for multiple cards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/247—Telephone sets including user guidance or feature selection means facilitating their use
    • H04M1/2473—Telephone terminals interfacing a personal computer, e.g. using an API (Application Programming Interface)
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/725—Cordless telephones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M3/00—Automatic or semi-automatic exchanges
    • H04M3/42—Systems providing special services or facilities to subscribers
    • H04M3/42314—Systems providing special services or facilities to subscribers in private branch exchanges
    • H04M3/42323—PBX's with CTI arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0008—Connection or combination of a still picture apparatus with another apparatus
    • H04N2201/0034—Details of the connection, e.g. connector, interface
    • H04N2201/0048—Type of connection
    • H04N2201/0049—By wire, cable or the like
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0008—Connection or combination of a still picture apparatus with another apparatus
    • H04N2201/0034—Details of the connection, e.g. connector, interface
    • H04N2201/0048—Type of connection
    • H04N2201/0051—Card-type connector, e.g. PCMCIA card interface
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/0008—Connection or combination of a still picture apparatus with another apparatus
    • H04N2201/0034—Details of the connection, e.g. connector, interface
    • H04N2201/0048—Type of connection
    • H04N2201/0053—Optical, e.g. using an infrared link

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
AT95901925T 1993-11-12 1994-11-14 Kühlung eines grossen mikroprozessors in einer kleinen baugruppe ATE182427T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/152,431 US5473506A (en) 1993-11-12 1993-11-12 Cooling a large microprocessor in a small module

Publications (1)

Publication Number Publication Date
ATE182427T1 true ATE182427T1 (de) 1999-08-15

Family

ID=22542891

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95901925T ATE182427T1 (de) 1993-11-12 1994-11-14 Kühlung eines grossen mikroprozessors in einer kleinen baugruppe

Country Status (6)

Country Link
US (1) US5473506A (de)
EP (1) EP0728375B1 (de)
JP (1) JPH09509281A (de)
AT (1) ATE182427T1 (de)
DE (1) DE69419619T2 (de)
WO (1) WO1995013640A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016883A1 (fr) * 1992-02-26 1993-09-02 Seiko Epson Corporation Dispositif electronique additionnel et systeme electronique
US8213431B2 (en) * 2008-01-18 2012-07-03 The Boeing Company System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments
WO1993023825A1 (fr) * 1992-05-20 1993-11-25 Seiko Epson Corporation Cartouche destinee a un appareil electronique
DE69529532T2 (de) * 1994-11-07 2003-11-06 Elonex I.P. Holdings Ltd., London Tragbarer modularer computer
US6072777A (en) * 1996-06-28 2000-06-06 Mci Communications Corporation System and method for unreported root cause analysis
JPH10116133A (ja) 1996-10-11 1998-05-06 Fujitsu Ltd 携帯情報機器
JPH10124182A (ja) 1996-10-24 1998-05-15 Fujitsu Ltd 増設バッテリを装着可能な携帯型コンピュータ装置
US6216185B1 (en) * 1998-05-01 2001-04-10 Acqis Technology, Inc. Personal computer peripheral console with attached computer module
US6345330B2 (en) 1998-05-01 2002-02-05 Acqis Technology, Inc. Communication channel and interface devices for bridging computer interface buses
US6321335B1 (en) 1998-10-30 2001-11-20 Acqis Technology, Inc. Password protected modular computer method and device
US6311268B1 (en) 1998-11-06 2001-10-30 Acqis Technology, Inc. Computer module device and method for television use
US6643777B1 (en) 1999-05-14 2003-11-04 Acquis Technology, Inc. Data security method and device for computer modules
US6718415B1 (en) 1999-05-14 2004-04-06 Acqis Technology, Inc. Computer system and method including console housing multiple computer modules having independent processing units, mass storage devices, and graphics controllers
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US6882533B2 (en) * 2001-02-22 2005-04-19 Hewlett-Packard Development Company, L.P. Thermal connector for cooling electronics
US6628522B2 (en) * 2001-08-29 2003-09-30 Intel Corporation Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations
JP3651677B2 (ja) * 2002-07-12 2005-05-25 株式会社東芝 発熱素子冷却装置及び電子機器
US7240500B2 (en) 2003-09-17 2007-07-10 Hewlett-Packard Development Company, L.P. Dynamic fluid sprayjet delivery system
US7133285B2 (en) * 2004-01-23 2006-11-07 Yamaichi Electronics U.S.A., Inc. Electronics connector with heat sink
US7800910B2 (en) * 2005-06-02 2010-09-21 Koninklijke Philips Electronics N V Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module
US7529085B2 (en) * 2006-06-30 2009-05-05 Lenovo (Singapore) Pte. Ltd. Thermal docking fansink
US7990724B2 (en) 2006-12-19 2011-08-02 Juhasz Paul R Mobile motherboard
CN101861070B (zh) * 2009-04-08 2014-07-16 富瑞精密组件（昆山）有限公司 便携式电子装置及其可插式散热模组与固定装置
US9910231B2 (en) * 2016-01-04 2018-03-06 Infinera Corporation Stacked cage optical module heat relay system
US10874032B2 (en) 2018-10-31 2020-12-22 Hewlett Packard Enterprise Development Lp Rotatable cold plate assembly for cooling pluggable modules
US10539753B1 (en) 2018-10-31 2020-01-21 Hewlett Packard Enterprise Development Lp Liquid-cooled assembly
US10765038B1 (en) 2019-07-30 2020-09-01 Hewlett Packard Enterprise Development Lp Floating liquid-cooled cold plate
US10955883B1 (en) 2019-10-15 2021-03-23 Hewlett Packard Enterprise Development Lp Power supply dry disconnect liquid cooling
JP7821955B2 (ja) * 2021-12-08 2026-03-02 パナソニックＩｐマネジメント株式会社 電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825337A (en) * 1988-05-17 1989-04-25 Prime Computer, Inc. Circuit board thermal contact device
JP3017837B2 (ja) * 1991-05-31 2000-03-13 株式会社日立製作所 電子機器装置

Also Published As

Publication number Publication date
WO1995013640A1 (en) 1995-05-18
EP0728375A1 (de) 1996-08-28
DE69419619T2 (de) 1999-12-02
US5473506A (en) 1995-12-05
DE69419619D1 (de) 1999-08-26
EP0728375A4 (de) 1997-03-26
JPH09509281A (ja) 1997-09-16
EP0728375B1 (de) 1999-07-21

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee