ATE188233T1 - Schleifmittelzusammensetzung mit elektrolytischem wasser und polierverfahren unter anwendung derselben - Google Patents

Schleifmittelzusammensetzung mit elektrolytischem wasser und polierverfahren unter anwendung derselben

Info

Publication number
ATE188233T1
ATE188233T1 AT94305523T AT94305523T ATE188233T1 AT E188233 T1 ATE188233 T1 AT E188233T1 AT 94305523 T AT94305523 T AT 94305523T AT 94305523 T AT94305523 T AT 94305523T AT E188233 T1 ATE188233 T1 AT E188233T1
Authority
AT
Austria
Prior art keywords
abrasive composition
electrolytic water
same
polishing method
water abrasive
Prior art date
Application number
AT94305523T
Other languages
English (en)
Inventor
Masatsume Kobayashi
Koji Takemasa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE188233T1 publication Critical patent/ATE188233T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT94305523T 1993-07-28 1994-07-26 Schleifmittelzusammensetzung mit elektrolytischem wasser und polierverfahren unter anwendung derselben ATE188233T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20447893A JP3098661B2 (ja) 1993-07-28 1993-07-28 研磨剤組成物及びそれを用いる研磨方法

Publications (1)

Publication Number Publication Date
ATE188233T1 true ATE188233T1 (de) 2000-01-15

Family

ID=16491194

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94305523T ATE188233T1 (de) 1993-07-28 1994-07-26 Schleifmittelzusammensetzung mit elektrolytischem wasser und polierverfahren unter anwendung derselben

Country Status (6)

Country Link
US (1) US5735729A (de)
EP (1) EP0637619B1 (de)
JP (1) JP3098661B2 (de)
AT (1) ATE188233T1 (de)
DE (1) DE69422344T2 (de)
TW (1) TW337535B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186116A (ja) * 1995-12-27 1997-07-15 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
US5962343A (en) * 1996-07-30 1999-10-05 Nissan Chemical Industries, Ltd. Process for producing crystalline ceric oxide particles and abrasive
US6290735B1 (en) 1997-10-31 2001-09-18 Nanogram Corporation Abrasive particles for surface polishing
US6099798A (en) 1997-10-31 2000-08-08 Nanogram Corp. Ultraviolet light block and photocatalytic materials
JP4113282B2 (ja) * 1998-05-07 2008-07-09 スピードファム株式会社 研磨組成物及びそれを用いたエッジポリッシング方法
FR2781922B1 (fr) 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
JP3693847B2 (ja) * 1999-03-26 2005-09-14 Ｎｅｃエレクトロニクス株式会社 研磨後ウェハの保管方法および装置
US6251150B1 (en) * 1999-05-27 2001-06-26 Ekc Technology, Inc. Slurry composition and method of chemical mechanical polishing using same
US6773337B1 (en) 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
US6722950B1 (en) 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6905526B1 (en) 2000-11-07 2005-06-14 Planar Labs Corporation Fabrication of an ion exchange polish pad
JP4919446B2 (ja) * 2001-08-09 2012-04-18 学校法人東京電機大学 微細溝加工方法及びその装置
JP4598328B2 (ja) * 2001-09-10 2010-12-15 新日本製鐵株式会社 不定形耐火物の混練方法
JP2003234473A (ja) * 2002-02-06 2003-08-22 Canon Inc 有機半導体素子の製造方法
US20050272595A1 (en) * 2002-10-16 2005-12-08 Canon Kabushi Kaisha Manufacturing process for fuel cell, and fuel cell apparatus
JP2005149796A (ja) * 2003-11-12 2005-06-09 Canon Inc 固体高分子電解質膜および固体高分子型燃料電池
JP2005255770A (ja) * 2004-03-10 2005-09-22 Shinko Electric Ind Co Ltd 機械加工用クーラント及び金属材の機械加工方法
JP2007160496A (ja) * 2005-11-15 2007-06-28 Shinshu Univ ワーク研磨装置およびワーク研磨方法
US9744645B2 (en) * 2012-09-25 2017-08-29 G.D.O. Inc. Abrasive entrainment waterjet cutting
US9815175B2 (en) * 2012-09-25 2017-11-14 G.D.O. Inc Abrasive entrainment waterjet cutting
WO2014052397A1 (en) * 2012-09-25 2014-04-03 G.D.O Inc. Abrasive waterjet cutting system for subsea operations
CN106164208A (zh) * 2014-04-04 2016-11-23 福吉米株式会社 硬质材料的研磨用组合物
JP6522377B2 (ja) * 2015-03-12 2019-05-29 Ntn株式会社 研削クーラント供給装置・研削設備・研削方法
US10077966B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc. Abrasive entrainment waterjet cutting
US10076821B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc Abrasive entrainment waterjet cutting
KR102384497B1 (ko) * 2020-03-14 2022-04-07 이인상 하이드로늄이온 용존수를 이용한 나노필터 제조방법 및 이에 따라 제조된 나노필터
CN115245866A (zh) * 2022-08-16 2022-10-28 西安建筑科技大学 一种电解改性水强化生石膏超细磨效果的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4124471A (en) * 1977-08-22 1978-11-07 Diamond Shamrock Corporation Controlling silica sol particle size
EP0031204B1 (de) * 1979-11-29 1984-06-06 Rhone-Poulenc Industries Verfahren zum Polieren mineralischer und organischer Werkstoffe
US4631184A (en) * 1984-01-10 1986-12-23 W. R. Grace & Co. Dialytic silica dentifrice
SE464565B (sv) * 1987-02-09 1991-05-13 Jgc Corp Foerfarande foer slipning med anvaendning av ett magnetiskt fluidum och anordning daerfoer
JPH0763696B2 (ja) * 1987-07-06 1995-07-12 龍夫 岡崎 連続式電解イオン水生成装置
JP2794036B2 (ja) * 1989-06-30 1998-09-03 日本インテック株式会社 連続式電解水生成装置
SU1712393A1 (ru) * 1989-10-26 1992-02-15 Институт сверхтвердых материалов АН УССР Смазочно-охлаждающа жидкость дл механической обработки металлов
JP2903166B2 (ja) * 1990-02-14 1999-06-07 清水建設株式会社 健康飲用水の製造方法及びその製造装置
JP2909645B2 (ja) * 1990-05-28 1999-06-23 コニカ株式会社 ハロゲン化銀カラー写真感光材料
US5044128A (en) * 1990-06-27 1991-09-03 Priority Co., Ltd. Magnetically-polishing machine and process
JPH0641108B2 (ja) * 1991-03-28 1994-06-01 富士ゼロックス株式会社 湿式ホーニング用研磨材懸濁液及びそれを用いた表面処理方法
DE69306542T2 (de) * 1993-01-08 1997-05-15 Nippon Electric Co Verfahren und Vorrichtung zur Nassbehandlung von festen Oberflächen
CN1100982A (zh) * 1993-06-24 1995-04-05 株式会社今桥制作所 桶式磁精整机
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
US5599438A (en) * 1994-03-25 1997-02-04 Nec Corporation Method for producing electrolyzed water
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法

Also Published As

Publication number Publication date
DE69422344D1 (de) 2000-02-03
US5735729A (en) 1998-04-07
EP0637619B1 (de) 1999-12-29
DE69422344T2 (de) 2000-05-18
JPH0741754A (ja) 1995-02-10
EP0637619A1 (de) 1995-02-08
TW337535B (en) 1998-08-01
JP3098661B2 (ja) 2000-10-16

Similar Documents

Publication Publication Date Title
DE69422344D1 (de) Schleifmittelzusammensetzung mit elektrolytischem Wasser und Polierverfahren unter Anwendung derselben
ATE220711T1 (de) Suspension zum gemisch-mechanisch polieren von metallschichten
TW324834B (en) Method for forming membrane
KR970018170A (ko) 연마용 슬러리 및 이 연마용 슬러리를 사용하는 연마방법
DK0844920T3 (da) Fremgangsmåde og apparat til formgivning af en åbning med en slibemiddelopslæmning
BR9205596A (pt) Artigo abrasivo revestido e processo para sua produçao
DE69503408D1 (de) Vorrichtung zum chemisch-mechanischen Polieren mit verbesserter Verteilung der Polierzusammensetzung
ATE193488T1 (de) Druckmedium und tintenstrahldruckverfahren sowie bildherstellungsverfahren unter verwendung derselben
NO179801C (no) Pressvalse for en papirmaskin
MY126994A (en) Method and apparatus for cutting a rare earth alloy
GB9624615D0 (en) Chrystallisation process
FR2520631B1 (de)
AU4543789A (en) Dampening roller and method for producing the same and dampening systems for a printing apparatus employing the dampening roller
EP0739686A3 (de) Verfahren und Vorrichtung zum Polieren von metalllöslichen Materialen z.B. Diamant
ATE82895T1 (de) Verfahren zum kopierschleifen von zylindrischen und sphaerischen oberflaechen und vorrichtung zur durchfuehrung des verfahrens.
DE69518658D1 (de) Verfahren zur tränkung einer komponente in einem flüssigkristall-kompositmaterial und vorrichtungen, die dieses material verwenden
DE69323178D1 (de) Polierverfahren, hierzu bestimmte vorrichtung und schwabbel-/polierscheibe
FI94320B (fi) Hiomakivi
ATE132396T1 (de) Verfahren zur zerkleinerung von sprödem mahlgut mit einer selektiven desagglomeration, durchführung des verfahrens sowie anlage zur durchführung des verfahrens
DE59400123D1 (de) Verfahren zum Ausfugen von Pflastersteinanordnungen
ATE205126T1 (de) Verfahren und vorrichtung zum schärfen der oberfläche der schleifsteine eines holzschleifers
GB2302630A (en) Image transfer method for telecine
IT1273903B (it) Procedimento ed impianto per la fabbricazione di manufatti in lastre e blocchi con effetto venato.
AU693485B2 (en) Method for colouring pieces of rock by laser rays
JPS6462649A (en) Method for regenerating electrophotographic sensitive body

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties