ATE194242T1 - Kombinierte chipkarte - Google Patents

Kombinierte chipkarte

Info

Publication number
ATE194242T1
ATE194242T1 AT97936722T AT97936722T ATE194242T1 AT E194242 T1 ATE194242 T1 AT E194242T1 AT 97936722 T AT97936722 T AT 97936722T AT 97936722 T AT97936722 T AT 97936722T AT E194242 T1 ATE194242 T1 AT E194242T1
Authority
AT
Austria
Prior art keywords
integrated circuit
conductive areas
link
chip card
blind holes
Prior art date
Application number
AT97936722T
Other languages
English (en)
Inventor
Benoit Thevenot
Pascal Billebaud
Thierry Bitschnau
Christophe Fletout
Original Assignee
Schlumberger Systems & Service
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR9609802A external-priority patent/FR2752077B1/fr
Priority claimed from FR9611488A external-priority patent/FR2753819B1/fr
Application filed by Schlumberger Systems & Service filed Critical Schlumberger Systems & Service
Application granted granted Critical
Publication of ATE194242T1 publication Critical patent/ATE194242T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Inspection Of Paper Currency And Valuable Securities (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT97936722T 1996-08-02 1997-07-31 Kombinierte chipkarte ATE194242T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9609802A FR2752077B1 (fr) 1996-08-02 1996-08-02 Carte a circuit integre a connexion mixte et module a circuit integre correspondant
FR9611488A FR2753819B1 (fr) 1996-09-20 1996-09-20 Carte a circuit integre a connexion mixte
PCT/FR1997/001434 WO1998006063A1 (fr) 1996-08-02 1997-07-31 Carte a circuit integre a connexion mixte

Publications (1)

Publication Number Publication Date
ATE194242T1 true ATE194242T1 (de) 2000-07-15

Family

ID=26232905

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97936722T ATE194242T1 (de) 1996-08-02 1997-07-31 Kombinierte chipkarte

Country Status (8)

Country Link
US (1) US6301119B1 (de)
EP (1) EP0917688B1 (de)
CN (1) CN1116655C (de)
AT (1) ATE194242T1 (de)
AU (1) AU3944597A (de)
DE (1) DE69702399T2 (de)
ES (1) ES2149000T3 (de)
WO (1) WO1998006063A1 (de)

Families Citing this family (31)

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DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
DE29706016U1 (de) * 1997-04-04 1998-08-06 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Elektronisches Gerät, insbesondere Chipkarte mit Nietverbindung
CZ284764B6 (cs) * 1997-04-22 1999-02-17 Lubomír Ing. Csc. Slunský Plastová čipová karta s připájeným čipovým modulem a způsob její výroby
FR2764414B1 (fr) * 1997-06-10 1999-08-06 Gemplus Card Int Procede de fabrication de carte a puce sans contact
CN1265213A (zh) * 1997-07-28 2000-08-30 卡尔－海因茨·文迪施 芯片模件、模件和制造模件的方法以及芯片卡
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
FR2795846B1 (fr) * 1999-07-01 2001-08-31 Schlumberger Systems & Service PROCEDE DE FABRICATION DE CARTES LAMINEES MUNIES D'UNE COUCHE INTERMEDIAIRES DE petg
JP2001024145A (ja) 1999-07-13 2001-01-26 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
FR2817374B1 (fr) * 2000-11-28 2003-02-21 Schlumberger Systems & Service Support electronique d'informations
DE10117994A1 (de) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten
FR2826153B1 (fr) † 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
JP2003100980A (ja) * 2001-09-27 2003-04-04 Hamamatsu Photonics Kk 半導体装置及びその製造方法
EP1485867A4 (de) * 2001-12-24 2012-02-22 L 1 Secure Credentialing Inc Kontakt-chipkarten mit einem dokumentkern, kontaktlose chipkarten mit identifikationsdokument mehrschichtiger struktur auf pet-basis und verfahren zu ihrer herstellung
FR2838850B1 (fr) * 2002-04-18 2005-08-05 Framatome Connectors Int Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
FR2850490A1 (fr) * 2003-01-24 2004-07-30 Framatome Connectors Int Antenne et procede de fabrication
US8232621B2 (en) * 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7838976B2 (en) * 2006-07-28 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a semiconductor chip enclosed by a body structure and a base
KR101478810B1 (ko) 2006-07-28 2015-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 축전 장치
EP2386986A1 (de) * 2010-04-29 2011-11-16 Gemalto SA Verfahren zur Verbindung einer elektronischen Komponente mit Hilfe einer Spule aus geschweißtem Draht, und erhaltene Vorrichtung
EP2618292A1 (de) * 2012-01-17 2013-07-24 Assa Abloy Ab Doppelschnittstellenkarte mit Metalleinsatzverbindung
EP2677476A1 (de) * 2012-06-21 2013-12-25 Gemalto SA Verbindungsverfahren mit Hilfe einer Spule aus mit leitendem Material ummanteltem, geschweißtem Draht, und so erhaltene Vorrichtung
EP2892012A1 (de) * 2014-01-06 2015-07-08 Gemalto SA Elektronisches Modul, sein Herstellungsverfahren und dieses Modul umfassende elektronische Vorrichtung
DE102014204553A1 (de) 2014-03-12 2015-09-17 Bundesdruckerei Gmbh Verfahren zum Austauschen von Daten zwischen einem Wert- oder Sicherheitsdokument einer Datenaustausch-Vorrichtung und Wert- oder Sicherheitsdokument
DE102014204552A1 (de) 2014-03-12 2015-09-17 Bundesdruckerei Gmbh In einen Rohling eines Wert- oder Sicherheitsdokuments integrierbares Anzeigemodul, Wert- oder Sicherheitsdokument mit dem Anzeigemodul und Verfahren zum Verifizieren des Wert- oder Sicherheitsdokuments
FR3026529B1 (fr) * 2014-09-30 2017-12-29 Linxens Holding Procede de fabrication de carte a puce et carte a puce obtenue par ce procede.
RU2685973C2 (ru) * 2015-02-20 2019-04-23 Нид Са Способ изготовления устройства, содержащего по меньшей мере один электронный элемент, связанный с подложкой и антенной
MY186313A (en) * 2015-06-23 2021-07-08 Linxens Holding Smart card blank with at least one interface for contactless transmission of information

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DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
JP2746801B2 (ja) * 1992-08-27 1998-05-06 三菱電機株式会社 Ｉｃカード及びｉｃカードの暗証番号照合方法
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
CN1108811A (zh) * 1994-10-19 1995-09-20 胡斌 集成电路电子信息储存卡及其封装方法
FR2726106B1 (fr) 1994-10-21 1996-11-29 Solaic Sa Carte electronique utilisable avec un lecteur de cartes sans contact et un lecteur de cartes a contacts
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
DE19505245C1 (de) * 1995-02-16 1996-04-25 Karl Heinz Wendisch Ausweischipkarte mit Antennenwicklung
WO1997005569A1 (de) 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers
US6115255A (en) * 1996-10-10 2000-09-05 Samsung Electronics Co., Ltd. Hybrid high-power integrated circuit
KR100255108B1 (en) * 1997-06-18 2000-05-01 Samsung Electronics Co Ltd Chip card
US6025995A (en) * 1997-11-05 2000-02-15 Ericsson Inc. Integrated circuit module and method
US5889655A (en) * 1997-11-26 1999-03-30 Intel Corporation Integrated circuit package substrate with stepped solder mask openings
US6052287A (en) * 1997-12-09 2000-04-18 Sandia Corporation Silicon ball grid array chip carrier
US5999415A (en) * 1998-11-18 1999-12-07 Vlsi Technology, Inc. BGA package using PCB and tape in a die-down configuration

Also Published As

Publication number Publication date
EP0917688B1 (de) 2000-06-28
DE69702399D1 (de) 2000-08-03
US6301119B1 (en) 2001-10-09
DE69702399T2 (de) 2001-02-15
CN1116655C (zh) 2003-07-30
AU3944597A (en) 1998-02-25
ES2149000T3 (es) 2000-10-16
WO1998006063A1 (fr) 1998-02-12
CN1226986A (zh) 1999-08-25
EP0917688A1 (de) 1999-05-26

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEFA Change of the company name
REN Ceased due to non-payment of the annual fee