ATE19564T1 - Gehaeuse mit kunststoffkappe fuer halbleiterbauelemente. - Google Patents

Gehaeuse mit kunststoffkappe fuer halbleiterbauelemente.

Info

Publication number
ATE19564T1
ATE19564T1 AT83401143T AT83401143T ATE19564T1 AT E19564 T1 ATE19564 T1 AT E19564T1 AT 83401143 T AT83401143 T AT 83401143T AT 83401143 T AT83401143 T AT 83401143T AT E19564 T1 ATE19564 T1 AT E19564T1
Authority
AT
Austria
Prior art keywords
housing
hood
frame
base
semiconductor components
Prior art date
Application number
AT83401143T
Other languages
English (en)
Inventor
Maurice Doutey
Original Assignee
Silicium Semiconducteur Ssc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicium Semiconducteur Ssc filed Critical Silicium Semiconducteur Ssc
Application granted granted Critical
Publication of ATE19564T1 publication Critical patent/ATE19564T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Light Receiving Elements (AREA)
  • Packging For Living Organisms, Food Or Medicinal Products That Are Sensitive To Environmental Conditiond (AREA)
AT83401143T 1982-06-15 1983-06-03 Gehaeuse mit kunststoffkappe fuer halbleiterbauelemente. ATE19564T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8210404A FR2528658A1 (fr) 1982-06-15 1982-06-15 Boitier a capot plastique pour composants semi-conducteurs
EP83401143A EP0097087B1 (de) 1982-06-15 1983-06-03 Gehäuse mit Kunststoffkappe für Halbleiterbauelemente

Publications (1)

Publication Number Publication Date
ATE19564T1 true ATE19564T1 (de) 1986-05-15

Family

ID=9275014

Family Applications (1)

Application Number Title Priority Date Filing Date
AT83401143T ATE19564T1 (de) 1982-06-15 1983-06-03 Gehaeuse mit kunststoffkappe fuer halbleiterbauelemente.

Country Status (5)

Country Link
EP (1) EP0097087B1 (de)
JP (1) JPS5963748A (de)
AT (1) ATE19564T1 (de)
DE (1) DE3363263D1 (de)
FR (1) FR2528658A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010030891A1 (de) * 2010-07-02 2012-01-05 Zf Friedrichshafen Ag Steuergerätbaugruppe

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61260657A (ja) * 1985-05-15 1986-11-18 Mitsubishi Electric Corp 半導体装置
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
DE10137666A1 (de) * 2001-08-01 2003-02-27 Infineon Technologies Ag Schutzvorrichtung für Baugruppen und Verfahren zu ihrer Herstellung
FR2939562B1 (fr) * 2008-12-10 2011-01-21 Astrium Sas Circuit integre hyperfrequence encapsule dans un boitier.
JPWO2013047533A1 (ja) * 2011-09-29 2015-03-26 シャープ株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2332896B2 (de) * 1973-06-28 1978-12-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit einem scheibenförmigen Gehäuse für ein Dioden- oder Thyristorelement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010030891A1 (de) * 2010-07-02 2012-01-05 Zf Friedrichshafen Ag Steuergerätbaugruppe

Also Published As

Publication number Publication date
EP0097087A1 (de) 1983-12-28
EP0097087B1 (de) 1986-04-30
JPS5963748A (ja) 1984-04-11
FR2528658A1 (fr) 1983-12-16
DE3363263D1 (en) 1986-06-05
FR2528658B1 (de) 1985-02-22

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee