ATE202364T1 - Einkapselungsharz, verfahren und apparat - Google Patents

Einkapselungsharz, verfahren und apparat

Info

Publication number
ATE202364T1
ATE202364T1 AT96906322T AT96906322T ATE202364T1 AT E202364 T1 ATE202364 T1 AT E202364T1 AT 96906322 T AT96906322 T AT 96906322T AT 96906322 T AT96906322 T AT 96906322T AT E202364 T1 ATE202364 T1 AT E202364T1
Authority
AT
Austria
Prior art keywords
radiation
formulation
encapsulating resin
initialing
photopolymerization
Prior art date
Application number
AT96906322T
Other languages
English (en)
Inventor
Andrew G Bachmann
Original Assignee
Dymax Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dymax Corp filed Critical Dymax Corp
Application granted granted Critical
Publication of ATE202364T1 publication Critical patent/ATE202364T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/122—Incoherent waves
    • B01J19/123—Ultraviolet light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/122—Incoherent waves
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S522/913—Numerically specified distinct wavelength

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymerisation Methods In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
AT96906322T 1995-03-20 1996-02-07 Einkapselungsharz, verfahren und apparat ATE202364T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40650695A 1995-03-20 1995-03-20
PCT/US1996/001678 WO1996029352A1 (en) 1995-03-20 1996-02-07 Encapsulation formulation, method, and apparatus

Publications (1)

Publication Number Publication Date
ATE202364T1 true ATE202364T1 (de) 2001-07-15

Family

ID=23608275

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96906322T ATE202364T1 (de) 1995-03-20 1996-02-07 Einkapselungsharz, verfahren und apparat

Country Status (10)

Country Link
US (2) US5672393A (de)
EP (1) EP0815146B1 (de)
JP (1) JPH10510578A (de)
KR (1) KR19980703112A (de)
AT (1) ATE202364T1 (de)
AU (1) AU4974196A (de)
BR (1) BR9607693A (de)
CA (1) CA2215597C (de)
DE (1) DE69613462D1 (de)
WO (1) WO1996029352A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099783A (en) * 1995-06-06 2000-08-08 Board Of Trustees Operating Michigan State University Photopolymerizable compositions for encapsulating microelectronic devices
JPH09171953A (ja) * 1995-12-20 1997-06-30 Sony Corp 基板加熱装置、基板加熱方法および半導体集積回路装置、フォトマスクならびに液晶表示装置
US6075065A (en) * 1996-12-20 2000-06-13 Takeda Chemical Industries, Ltd. Photocurable resin composition and a method for producing the same
US5980637A (en) * 1996-12-20 1999-11-09 Steag Rtp Systems, Inc. System for depositing a material on a substrate using light energy
US6218446B1 (en) 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US6174651B1 (en) 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
FR2793069B1 (fr) * 1999-04-28 2003-02-14 Gemplus Card Int Procede de fabrication de dispositif electronique portable a circuit integre protege par resine photosensible
US6461689B1 (en) 2000-08-31 2002-10-08 Domco Tarkett Inc. Method of controlling specular gloss characteristics
US6551863B2 (en) * 2001-08-30 2003-04-22 Micron Technology, Inc. Flip chip dip coating encapsulant
US20030069082A1 (en) * 2001-10-09 2003-04-10 Sullivan Michael J. Golf ball with polysulfide rubber layer
US6632147B2 (en) 2001-10-09 2003-10-14 Acushnet Company Golf ball with vapor barrier layer and method of making same
US7951015B2 (en) 2001-10-09 2011-05-31 Acushnet Company Multilayer golf ball containing at least three core layers, at least one intermediate barrier layer, and at least one cover layer
US7004854B2 (en) * 2001-10-09 2006-02-28 Acushnet Company Golf ball with vapor barrier layer and method of making same
US20030069085A1 (en) 2001-10-09 2003-04-10 Hogge Matthew F. Golf ball with vapor barrier layer and method of making same
US20060128505A1 (en) * 2001-10-09 2006-06-15 Sullivan Michael J Golf ball layers having improved barrier properties
US20070155542A1 (en) * 2002-05-08 2007-07-05 Sullivan Michael J Gold ball having a foamed layer created by infrared radiation
US7670542B2 (en) * 2002-05-08 2010-03-02 Acushnet Company Infrared heating method for creating cure gradients in golf balls and golf ball cores
US6855070B2 (en) 2002-05-08 2005-02-15 Acushnet Company Infrared heating method for creating cure gradients in golf balls and golf balls cores
EP1502922A1 (de) * 2003-07-30 2005-02-02 Loctite (R & D) Limited Vernetzbare Zusammensetzungen für Verkapselungen
EP2586804B1 (de) * 2005-12-28 2014-04-02 Kaneka Corporation Photoradikal und Wärmeradikal härtbare Zusammensetzung
TWI370525B (en) * 2008-04-25 2012-08-11 Ind Tech Res Inst Encapsulant composition and method for fabricating encapsulant material
JP5402225B2 (ja) * 2008-11-26 2014-01-29 Ｊｓｒ株式会社 電線止水材用キット、電線止水材、止水部材、止水処理された電線および止水処理方法
GB2466251B (en) * 2008-12-16 2011-03-09 Ind Tech Res Inst Encapsulant compositions and method for fabricating encapsulant materials
US20100183820A1 (en) * 2009-01-16 2010-07-22 Ford Global Technologies, Llc Methods for curing uv-curable coatings
US8513321B2 (en) 2010-11-05 2013-08-20 Ppg Industries Ohio, Inc. Dual cure coating compositions, methods of coating a substrate, and related coated substrates
US8901198B2 (en) 2010-11-05 2014-12-02 Ppg Industries Ohio, Inc. UV-curable coating compositions, multi-component composite coatings, and related coated substrates
WO2020085413A1 (ja) * 2018-10-25 2020-04-30 積水化学工業株式会社 光反応性組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
US4223115A (en) * 1978-04-24 1980-09-16 Lord Corporation Structural adhesive formulations
US4222835A (en) * 1978-05-25 1980-09-16 Westinghouse Electric Corp. In depth curing of resins induced by UV radiation
US4348503A (en) * 1980-06-04 1982-09-07 Bachmann Andrew G Adhesive composition
US4605465A (en) * 1982-04-26 1986-08-12 W. R. Grace & Co. UV and thermally curable, thermoplastic-containing compositions
IT1177945B (it) * 1984-07-31 1987-08-26 Siv Soc Italiana Vetro Procedimento per la produzione di un nastro continuo composito comprendente una pellicola a base acrilica,adatta per l'uso in lastre di vetro laminato di sicurezza e procedotto cosi' ottenuto
US5151453A (en) * 1989-04-06 1992-09-29 Den-Mat Corporation Light-curable ionomer dental cement
JPH0698628B2 (ja) * 1989-09-01 1994-12-07 株式会社総合歯科医療研究所 可視光重合型レジンの連続硬化方法及び装置
JPH04234422A (ja) * 1990-10-31 1992-08-24 Internatl Business Mach Corp <Ibm> 二重硬化エポキシバックシール処方物

Also Published As

Publication number Publication date
US5672393A (en) 1997-09-30
CA2215597A1 (en) 1996-09-26
EP0815146A1 (de) 1998-01-07
EP0815146B1 (de) 2001-06-20
JPH10510578A (ja) 1998-10-13
DE69613462D1 (de) 2001-07-26
AU4974196A (en) 1996-10-08
CA2215597C (en) 2000-05-02
US5677362A (en) 1997-10-14
BR9607693A (pt) 1999-11-30
WO1996029352A1 (en) 1996-09-26
EP0815146A4 (de) 1998-02-11
KR19980703112A (ko) 1998-10-15

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties