ATE209402T1 - Verbindungsvorrichtung mit gesteuertem impedanzverhalten - Google Patents

Verbindungsvorrichtung mit gesteuertem impedanzverhalten

Info

Publication number
ATE209402T1
ATE209402T1 AT96401497T AT96401497T ATE209402T1 AT E209402 T1 ATE209402 T1 AT E209402T1 AT 96401497 T AT96401497 T AT 96401497T AT 96401497 T AT96401497 T AT 96401497T AT E209402 T1 ATE209402 T1 AT E209402T1
Authority
AT
Austria
Prior art keywords
contacts
connection device
controlled impedance
impedance behavior
shielding
Prior art date
Application number
AT96401497T
Other languages
English (en)
Inventor
David A Johnson
Eric V Kline
Original Assignee
Johnstech Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnstech Int Corp filed Critical Johnstech Int Corp
Application granted granted Critical
Publication of ATE209402T1 publication Critical patent/ATE209402T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/941—Crosstalk suppression

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Networks Using Active Elements (AREA)
  • Connecting Device With Holders (AREA)
  • Programmable Controllers (AREA)
  • Multi-Conductor Connections (AREA)
AT96401497T 1995-07-07 1996-07-08 Verbindungsvorrichtung mit gesteuertem impedanzverhalten ATE209402T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94295P 1995-07-07 1995-07-07

Publications (1)

Publication Number Publication Date
ATE209402T1 true ATE209402T1 (de) 2001-12-15

Family

ID=21693659

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96401497T ATE209402T1 (de) 1995-07-07 1996-07-08 Verbindungsvorrichtung mit gesteuertem impedanzverhalten

Country Status (11)

Country Link
US (1) US6203329B1 (de)
EP (1) EP0752741B1 (de)
JP (1) JP3415362B2 (de)
KR (1) KR100273173B1 (de)
CN (1) CN1133239C (de)
AT (1) ATE209402T1 (de)
CA (1) CA2180578A1 (de)
DE (1) DE69617113T2 (de)
ES (1) ES2168451T3 (de)
SG (1) SG65613A1 (de)
TW (1) TW320788B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6439931B1 (en) 1998-05-13 2002-08-27 Molex Incorporated Method and structure for tuning the impedance of electrical terminals
US6394823B1 (en) 2000-05-26 2002-05-28 Molex Incorporated Connector with terminals having increased capacitance
US6506077B2 (en) 2000-07-21 2003-01-14 The Siemon Company Shielded telecommunications connector
US6877992B2 (en) * 2002-11-01 2005-04-12 Airborn, Inc. Area array connector having stacked contacts for improved current carrying capacity
US7053640B2 (en) * 2002-12-27 2006-05-30 Agilent Technologies, Inc. System and method for providing high RF signal isolation and low common ground inductance in an RF circuit testing environment
US20040156676A1 (en) * 2003-02-12 2004-08-12 Brent Boudreaux Fastener for variable mounting
JP4542525B2 (ja) * 2005-07-07 2010-09-15 山一電機株式会社 ケーブル用コネクタ
JP2009043591A (ja) 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Ｉｃソケット
US8278955B2 (en) 2008-03-24 2012-10-02 Interconnect Devices, Inc. Test interconnect
US20090289647A1 (en) 2008-05-01 2009-11-26 Interconnect Devices, Inc. Interconnect system
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
TW201027849A (en) * 2009-01-13 2010-07-16 Yi-Zhi Yang Connector
US7896692B2 (en) * 2009-05-15 2011-03-01 Leviton Manufacturing Co., Inc. Method of improving isolation between circuits on a printed circuit board
US8002581B1 (en) * 2010-05-28 2011-08-23 Tyco Electronics Corporation Ground interface for a connector system
US8123536B1 (en) * 2011-02-09 2012-02-28 Itt Manufacturing Enterprises, Inc. Connector with isolated grounds
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
CN202930669U (zh) * 2012-04-10 2013-05-08 番禺得意精密电子工业有限公司 电连接器
JP5863041B2 (ja) * 2012-06-01 2016-02-16 アルプス電気株式会社 電子部品用ソケット
US9059545B2 (en) * 2012-07-11 2015-06-16 Tyco Electronics Corporations Socket connectors and methods of assembling socket connectors
US10794933B1 (en) * 2013-03-15 2020-10-06 Johnstech International Corporation Integrated circuit contact test apparatus with and method of construction
KR20170134612A (ko) * 2015-04-01 2017-12-06 엑세라 코포레이션 패러데이 케이지 배경을 가진 집적 회로(ic) 테스트 소켓
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
US9680268B1 (en) 2016-05-18 2017-06-13 Itt Manufacturing Enterprises Llc Genderless electrical connectors
WO2019060877A1 (en) * 2017-09-25 2019-03-28 Johnstech International Corporation HIGH TEST PIN INSULATION SWITCH AND INTEGRATED CIRCUIT TEST HOUSING
CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器
JP7307312B2 (ja) * 2019-03-18 2023-07-12 山一電機株式会社 フレキシブル配線基板用コネクタ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961709A (en) * 1989-02-13 1990-10-09 Burndy Corporation Vertical action contact spring
ES2070283T3 (es) * 1989-10-10 1995-06-01 Whitaker Corp Conectador a contraplano con impedancias adaptadas.
US4969826A (en) * 1989-12-06 1990-11-13 Amp Incorporated High density connector for an IC chip carrier
US5069629A (en) 1991-01-09 1991-12-03 Johnson David A Electrical interconnect contact system
US5207584A (en) 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5171290A (en) 1991-09-03 1992-12-15 Microelectronics And Computer Technology Corporation Testing socket for tab tape
US5169320A (en) 1991-09-27 1992-12-08 Hercules Defense Electronics Systems, Inc. Shielded and wireless connector for electronics
US5309630A (en) * 1992-03-16 1994-05-10 Molex Incorporated Impedance and inductance control in electrical connectors
US5302923A (en) 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths

Also Published As

Publication number Publication date
EP0752741A1 (de) 1997-01-08
US6203329B1 (en) 2001-03-20
JPH09167663A (ja) 1997-06-24
KR970009496A (ko) 1997-02-24
CN1148742A (zh) 1997-04-30
KR100273173B1 (ko) 2000-12-01
CA2180578A1 (en) 1997-01-08
EP0752741B1 (de) 2001-11-21
ES2168451T3 (es) 2002-06-16
DE69617113T2 (de) 2002-04-18
JP3415362B2 (ja) 2003-06-09
DE69617113D1 (de) 2002-01-03
SG65613A1 (en) 1999-06-22
CN1133239C (zh) 2003-12-31
TW320788B (en) 1997-11-21

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee