ATE220794T1 - Anordnung zum prüfen von oberflächen und verfahren zum prüfen der oberfläche eines werkstücks - Google Patents

Anordnung zum prüfen von oberflächen und verfahren zum prüfen der oberfläche eines werkstücks

Info

Publication number
ATE220794T1
ATE220794T1 AT96907176T AT96907176T ATE220794T1 AT E220794 T1 ATE220794 T1 AT E220794T1 AT 96907176 T AT96907176 T AT 96907176T AT 96907176 T AT96907176 T AT 96907176T AT E220794 T1 ATE220794 T1 AT E220794T1
Authority
AT
Austria
Prior art keywords
workpiece
material path
along
light beam
testing
Prior art date
Application number
AT96907176T
Other languages
English (en)
Inventor
Lee D Clementi
Michael E Fossey
Original Assignee
Ade Optical Syst Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ade Optical Syst Corp filed Critical Ade Optical Syst Corp
Application granted granted Critical
Publication of ATE220794T1 publication Critical patent/ATE220794T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
AT96907176T 1995-03-06 1996-03-04 Anordnung zum prüfen von oberflächen und verfahren zum prüfen der oberfläche eines werkstücks ATE220794T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/399,962 US5712701A (en) 1995-03-06 1995-03-06 Surface inspection system and method of inspecting surface of workpiece
PCT/US1996/002913 WO1996027786A1 (en) 1995-03-06 1996-03-04 Surface inspection system and method of inspecting surface of workpiece

Publications (1)

Publication Number Publication Date
ATE220794T1 true ATE220794T1 (de) 2002-08-15

Family

ID=23581646

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96907176T ATE220794T1 (de) 1995-03-06 1996-03-04 Anordnung zum prüfen von oberflächen und verfahren zum prüfen der oberfläche eines werkstücks

Country Status (9)

Country Link
US (1) US5712701A (de)
EP (1) EP0815436B1 (de)
JP (1) JP3801635B2 (de)
KR (1) KR19980702809A (de)
CN (1) CN1181135A (de)
AT (1) ATE220794T1 (de)
AU (1) AU5092196A (de)
DE (1) DE69622384T2 (de)
WO (1) WO1996027786A1 (de)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6271916B1 (en) * 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
US5883710A (en) 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
US6118525A (en) 1995-03-06 2000-09-12 Ade Optical Systems Corporation Wafer inspection system for distinguishing pits and particles
US5834889A (en) * 1995-09-22 1998-11-10 Gl Displays, Inc. Cold cathode fluorescent display
WO1997046865A1 (en) * 1996-06-04 1997-12-11 Tencor Instruments Optical scanning system for surface inspection
JPH10160683A (ja) * 1996-11-29 1998-06-19 Matsushita Electric Ind Co Ltd 異物検査方法とその装置
TW482898B (en) * 1996-12-04 2002-04-11 Ade Optical Syst Corp A surface inspection system and method for distinguishing between particle defects and pit defects on a surface of a workpiece.
US5965896A (en) * 1997-02-26 1999-10-12 Marton & Associates, Inc. Apparatus and method for scratch wear testing of thin films
AU6942998A (en) * 1997-03-31 1998-10-22 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
US20040057045A1 (en) * 2000-12-21 2004-03-25 Mehdi Vaez-Iravani Sample inspection system
US6956644B2 (en) * 1997-09-19 2005-10-18 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US6201601B1 (en) 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
WO1999032879A1 (en) * 1997-12-22 1999-07-01 Ade Optical Systems Corporation Method and apparatus for reducing roughness scatter as a noise source in wafer scanning systems
JPH11243041A (ja) * 1998-02-26 1999-09-07 Mitsubishi Electric Corp 品質管理システムおよび記録媒体
US6295474B1 (en) * 1998-03-13 2001-09-25 Intermedics Inc. Defibrillator housing with conductive polymer coating
US6169601B1 (en) 1998-06-23 2001-01-02 Ade Optical Systems Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light
US6256093B1 (en) * 1998-06-25 2001-07-03 Applied Materials, Inc. On-the-fly automatic defect classification for substrates using signal attributes
US6320609B1 (en) 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
US7295314B1 (en) 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US20050134841A1 (en) * 1998-09-18 2005-06-23 Mehdi Vacz-Iravani Sample inspection system
AU1212000A (en) 1998-10-16 2000-05-08 Ade Optical Systems Corporation Method and apparatus for mapping surface topography of a substrate
US6122047A (en) * 1999-01-14 2000-09-19 Ade Optical Systems Corporation Methods and apparatus for identifying the material of a particle occurring on the surface of a substrate
US6529270B1 (en) 1999-03-31 2003-03-04 Ade Optical Systems Corporation Apparatus and method for detecting defects in the surface of a workpiece
IL130087A0 (en) 1999-05-24 2000-02-29 Nova Measuring Instr Ltd Optical inspection method and system
US6373565B1 (en) * 1999-05-27 2002-04-16 Spectra Physics Lasers, Inc. Method and apparatus to detect a flaw in a surface of an article
US6822978B2 (en) * 1999-05-27 2004-11-23 Spectra Physics, Inc. Remote UV laser system and methods of use
US6734387B2 (en) 1999-05-27 2004-05-11 Spectra Physics Lasers, Inc. Method and apparatus for micro-machining of articles that include polymeric materials
US6366352B1 (en) * 1999-06-10 2002-04-02 Applied Materials, Inc. Optical inspection method and apparatus utilizing a variable angle design
US6088092A (en) * 1999-06-21 2000-07-11 Phase Metrics, Inc. Glass substrate inspection apparatus
JP3664134B2 (ja) * 1999-10-14 2005-06-22 三菱住友シリコン株式会社 半導体ウェーハ表面の検査方法
US6574359B1 (en) * 2000-02-03 2003-06-03 Advanced Micro Devices, Inc. Method and apparatus for inspecting wafer defects
JP3996728B2 (ja) * 2000-03-08 2007-10-24 株式会社日立製作所 表面検査装置およびその方法
EP1136815A1 (de) * 2000-03-20 2001-09-26 ADE Optical Systems Corporation Verfahren und Vorrichtung zur Materialerkennung von einer Partikel auf der Oberfläche eines Substrats
US6731384B2 (en) * 2000-10-10 2004-05-04 Hitachi, Ltd. Apparatus for detecting foreign particle and defect and the same method
US6760100B2 (en) 2001-03-12 2004-07-06 Ade Corporation Method and apparatus for classifying defects occurring at or near a surface of a smooth substrate
KR100452317B1 (ko) * 2001-07-11 2004-10-12 삼성전자주식회사 포토리소그래피 공정시스템 및 그 방법
DE10151332B4 (de) * 2001-10-22 2007-12-06 Jenoptik Surface Inspection Gmbh Vorrichtung zur optischen Messung von Oberflächeneigenschaften
US6973832B2 (en) * 2002-02-08 2005-12-13 Metscan Technologies, Llc Acoustic coupling with a fluid bath
US6981418B1 (en) 2002-02-08 2006-01-03 Metscan Technologies, Llc Scanning acoustic microscopy
US6768965B2 (en) * 2002-04-18 2004-07-27 Seh America, Inc. Methods and computer program products for characterizing a crystalline structure
US6819844B2 (en) * 2002-06-20 2004-11-16 The Boeing Company Fiber-optic based surface spectroscopy
US7369233B2 (en) * 2002-11-26 2008-05-06 Kla-Tencor Technologies Corporation Optical system for measuring samples using short wavelength radiation
US6815675B1 (en) 2003-04-30 2004-11-09 Kla-Tencor Technologies Corporation Method and system for e-beam scanning
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
US7280200B2 (en) * 2003-07-18 2007-10-09 Ade Corporation Detection of a wafer edge using collimated light
CN100520376C (zh) * 2003-10-21 2009-07-29 大发工业株式会社 表面缺陷检查方法及装置
JP2005167208A (ja) * 2003-10-24 2005-06-23 Ade Corp ノッチ化／フラット化２００ｍｍウエーハエッジグリップエンドエフェクタ
JP3926362B2 (ja) * 2003-10-24 2007-06-06 エーディーイー コーポレーション 半導体ウエーハ検査システムにおける半導体ウエーハ表面上の欠陥のサイズを判定する方法
US7302360B2 (en) * 2003-10-24 2007-11-27 Ade Corporation Defect size projection
US7539584B2 (en) * 2003-10-24 2009-05-26 Kla-Tencor Corporation Volume based extended defect sizing system
US7224471B2 (en) * 2003-10-28 2007-05-29 Timbre Technologies, Inc. Azimuthal scanning of a structure formed on a semiconductor wafer
US7110106B2 (en) * 2003-10-29 2006-09-19 Coretech Optical, Inc. Surface inspection system
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
US7433031B2 (en) * 2003-10-29 2008-10-07 Core Tech Optical, Inc. Defect review system with 2D scanning and a ring detector
WO2006066137A2 (en) 2004-12-19 2006-06-22 Ade Corporation System and method for inspecting a workpiece surface using polarization of scattered light
US20060236792A1 (en) * 2005-04-22 2006-10-26 Mectron Engineering Company Workpiece inspection system
US7609373B2 (en) * 2005-05-31 2009-10-27 Kla-Tencor Technologies Corporation Reducing variations in energy reflected from a sample due to thin film interference
FR2887028B1 (fr) * 2005-06-14 2007-12-21 Vai Sias Soc Par Actions Simpl Procede et dispositif optiques de detection de defauts de surface et de structure d'un produit long en defilememnt
US7586599B2 (en) * 2005-08-08 2009-09-08 Applied Materials, Isreal, Ltd. Method and system for detecting defects
US7241991B1 (en) 2005-08-30 2007-07-10 Kla-Tencor Technologies Corporation Region-of-interest based electron beam metrology
US8284394B2 (en) * 2006-02-09 2012-10-09 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of a wafer
JP4843399B2 (ja) 2006-07-31 2011-12-21 株式会社日立ハイテクノロジーズ 検査装置及び検査方法
CN101196481B (zh) * 2006-12-08 2011-01-05 同方威视技术股份有限公司 可变裂缝测试装置及其测试方法
JP2008216054A (ja) * 2007-03-05 2008-09-18 Hitachi High-Technologies Corp 被検査物の検査装置及び被検査物の検査方法
JP2009053132A (ja) * 2007-08-29 2009-03-12 Hitachi High-Technologies Corp 欠陥検査方法および欠陥検査装置
US7912658B2 (en) * 2008-05-28 2011-03-22 Kla-Tencor Corp. Systems and methods for determining two or more characteristics of a wafer
WO2009155502A2 (en) * 2008-06-19 2009-12-23 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
US8269960B2 (en) * 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
JP5341440B2 (ja) * 2008-09-10 2013-11-13 株式会社日立ハイテクノロジーズ 検査装置
JP5332478B2 (ja) * 2008-10-06 2013-11-06 株式会社Ｓｕｍｃｏ レーザー散乱式欠陥検査装置及びレーザー散乱式欠陥検査方法
DE102009033110A1 (de) * 2009-07-15 2011-02-03 Byk Gardner Gmbh Vorrichtung zum Untersuchen strukturierter Oberflächen
CN101672801B (zh) * 2009-09-23 2011-04-06 中国科学院上海光学精密机械研究所 具有缺陷分类能力的硅片表面缺陷检测仪及缺陷分类方法
JP5405956B2 (ja) * 2009-09-24 2014-02-05 株式会社日立ハイテクノロジーズ 欠陥検査装置
DE102010032958A1 (de) * 2010-07-30 2012-02-02 Messer Cutting & Welding Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten eines Werkstücks mittels Laserstrahl
JP2012150024A (ja) * 2011-01-20 2012-08-09 Hitachi High-Technologies Corp 表面欠陥検査装置及び方法
US8629407B2 (en) * 2011-04-13 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Contamination inspection
CN102353680B (zh) * 2011-07-08 2013-02-13 中国科学院宁波材料技术与工程研究所 小型工件表面缺陷的评估方法以及检测不合格工件的流程
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US9250178B2 (en) 2011-10-07 2016-02-02 Kla-Tencor Corporation Passivation of nonlinear optical crystals
JP5820735B2 (ja) * 2012-01-27 2015-11-24 昭和電工株式会社 表面検査方法及び表面検査装置
KR101438157B1 (ko) * 2012-11-12 2014-09-05 주식회사 고영테크놀러지 기판 검사방법
CN104567735A (zh) * 2013-10-16 2015-04-29 北京航天计量测试技术研究所 动态小角度分辨力测试方法
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
FR3026485B1 (fr) * 2014-09-29 2016-09-23 Altatech Semiconductor Procede et systeme d'inspection de plaquettes pour l'electronique, l'optique ou l'optoelectronique
CN104332426A (zh) * 2014-11-18 2015-02-04 天津中环领先材料技术有限公司 非接触式扫描抛光片表面粗糙度的检测设备和检测方法
CN105181712A (zh) * 2015-07-29 2015-12-23 李天华 脆性涂层映射结构表面裂缝平板扫描检测系统及检测方法
DE102015114065A1 (de) * 2015-08-25 2017-03-02 Brodmann Technologies GmbH Verfahren und Einrichtung zur berührungslosen Beurteilung der Oberflächenbeschaffenheit eines Wafers
WO2017048674A1 (en) * 2015-09-14 2017-03-23 University Of Florida Research Foundation, Inc. Method for measuring bi-directional reflectance distribution function (brdf) and associated device
CN105699396A (zh) * 2016-03-29 2016-06-22 同高先进制造科技（太仓）有限公司 基于光扫描的焊接激光头保护镜污染检测装置及方法
CN108956610B (zh) * 2017-05-18 2020-09-15 南京原觉信息科技有限公司 工业视觉探伤系统及工业视觉探伤方法
CN108152294A (zh) * 2017-12-26 2018-06-12 华中光电技术研究所（中国船舶重工集团公司第七七研究所） 一种超光滑镜片疵病检测装置及其方法
CN108489937A (zh) * 2018-03-30 2018-09-04 哈尔滨工业大学 一种固体材料双向反射分布函数测量装置
CN108663484A (zh) * 2018-05-09 2018-10-16 安徽知之信息科技有限公司 一种电动汽车覆盖件的表面质量检测流水线
US10290091B1 (en) 2018-07-06 2019-05-14 Arevo, Inc. Filament inspection system
CN109613008B (zh) * 2018-12-26 2021-10-22 武汉科技大学 一种利用机器视觉实现白酒微孔膜滤片质量检测的仪器
CN109724995A (zh) * 2019-01-21 2019-05-07 上海精测半导体技术有限公司 量测设备及其表面检测模块和检测方法
KR102248379B1 (ko) * 2019-06-20 2021-05-06 주식회사 이솔 반도체 소자의 결함 검사장치.
US11883837B2 (en) * 2020-05-01 2024-01-30 Tokyo Electron Limited System and method for liquid dispense and coverage control
TWI779357B (zh) * 2020-09-23 2022-10-01 南亞科技股份有限公司 偵測物品表面缺陷的方法及其系統
CN112903702A (zh) * 2021-01-22 2021-06-04 张四民 一种用于五金件的裂痕检测装置
CN116772757B (zh) * 2023-08-21 2023-10-24 国镓芯科(成都)半导体科技有限公司 一种用于半导体加工成品测量系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4314763A (en) * 1979-01-04 1982-02-09 Rca Corporation Defect detection system
JPS57161640A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for surface
JPS57161641A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for defect of surface
US4441124A (en) * 1981-11-05 1984-04-03 Western Electric Company, Inc. Technique for inspecting semiconductor wafers for particulate contamination
US4541712A (en) * 1981-12-21 1985-09-17 Tre Semiconductor Equipment Corporation Laser pattern generating system
US4630276A (en) * 1984-10-09 1986-12-16 Aeronca Electronics, Inc. Compact laser scanning system
US4902131A (en) * 1985-03-28 1990-02-20 Kabushiki Kaisha Toshiba Surface inspection method and apparatus therefor
US4740708A (en) * 1987-01-06 1988-04-26 International Business Machines Corporation Semiconductor wafer surface inspection apparatus and method
US4889998A (en) * 1987-01-29 1989-12-26 Nikon Corporation Apparatus with four light detectors for checking surface of mask with pellicle
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
JPH0820371B2 (ja) * 1988-01-21 1996-03-04 株式会社ニコン 欠陥検査装置及び欠陥検査方法
US4875780A (en) * 1988-02-25 1989-10-24 Eastman Kodak Company Method and apparatus for inspecting reticles
KR0136603B1 (ko) * 1988-02-29 1998-11-16 고다까 토시오 레이저 주사 시스템
US5127726A (en) * 1989-05-19 1992-07-07 Eastman Kodak Company Method and apparatus for low angle, high resolution surface inspection
JP3142852B2 (ja) * 1990-02-20 2001-03-07 株式会社日立製作所 表面欠陥検査装置
CH681495A5 (de) * 1990-03-05 1993-03-31 Tet Techno Investment Trust
JPH0695075B2 (ja) * 1990-03-16 1994-11-24 工業技術院長 表面性状検出方法
US5177559A (en) * 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
US5189481A (en) * 1991-07-26 1993-02-23 Tencor Instruments Particle detector for rough surfaces
KR930009220B1 (ko) * 1991-08-20 1993-09-24 주식회사 금성사 광학기기의 옵티컬 픽-업장치
US5191466A (en) * 1991-08-26 1993-03-02 Optrotech Ltd. High resolution two-directional optical scanner
US5329351A (en) * 1992-11-24 1994-07-12 Estek Corporation Particle detection system with coincident detection
JPH0743313A (ja) * 1993-07-29 1995-02-14 Canon Inc 異物検査装置及びそれを用いた半導体デバイスの 製造方法

Also Published As

Publication number Publication date
DE69622384T2 (de) 2003-03-27
DE69622384D1 (de) 2002-08-22
AU5092196A (en) 1996-09-23
EP0815436B1 (de) 2002-07-17
JPH11501727A (ja) 1999-02-09
WO1996027786A1 (en) 1996-09-12
CN1181135A (zh) 1998-05-06
EP0815436A1 (de) 1998-01-07
US5712701A (en) 1998-01-27
JP3801635B2 (ja) 2006-07-26
KR19980702809A (ko) 1998-08-05

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