ATE230201T1 - Tiefdruckverfahren, tiefdrucker, verfahren zur herstellung von höckern oder leitermustern, vorrichtung dafür, höckerelektrode und gedruckte leiterplatte - Google Patents

Tiefdruckverfahren, tiefdrucker, verfahren zur herstellung von höckern oder leitermustern, vorrichtung dafür, höckerelektrode und gedruckte leiterplatte

Info

Publication number
ATE230201T1
ATE230201T1 AT98103046T AT98103046T ATE230201T1 AT E230201 T1 ATE230201 T1 AT E230201T1 AT 98103046 T AT98103046 T AT 98103046T AT 98103046 T AT98103046 T AT 98103046T AT E230201 T1 ATE230201 T1 AT E230201T1
Authority
AT
Austria
Prior art keywords
gravure
bump electrode
circuit board
printed circuit
conductor patterns
Prior art date
Application number
AT98103046T
Other languages
English (en)
Inventor
Makoto Kinoshita
Original Assignee
Ricoh Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Microelectronics Co Ltd filed Critical Ricoh Microelectronics Co Ltd
Application granted granted Critical
Publication of ATE230201T1 publication Critical patent/ATE230201T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/285—Alignment aids, e.g. alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/161—Aligning
    • H10W80/168—Aligning using guiding structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Methods (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
AT98103046T 1997-02-21 1998-02-20 Tiefdruckverfahren, tiefdrucker, verfahren zur herstellung von höckern oder leitermustern, vorrichtung dafür, höckerelektrode und gedruckte leiterplatte ATE230201T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5394897 1997-02-21

Publications (1)

Publication Number Publication Date
ATE230201T1 true ATE230201T1 (de) 2003-01-15

Family

ID=12956953

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98103046T ATE230201T1 (de) 1997-02-21 1998-02-20 Tiefdruckverfahren, tiefdrucker, verfahren zur herstellung von höckern oder leitermustern, vorrichtung dafür, höckerelektrode und gedruckte leiterplatte

Country Status (6)

Country Link
US (2) US6109175A (de)
EP (1) EP0861018B1 (de)
KR (1) KR19980071549A (de)
AT (1) ATE230201T1 (de)
DE (1) DE69810170D1 (de)
TW (1) TW340296B (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW374287B (en) 1997-02-21 1999-11-11 Ricoh Microelectronics Co Ltd Gravure printing method and the device as well as the contact plate
DE69819740T2 (de) 1997-02-24 2004-09-30 Superior Micropowders Llc, Albuquerque Aerosolverfahren und -gerät, teilchenförmige produkte, und daraus hergestellte elektronische geräte
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US7819301B2 (en) 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US6293456B1 (en) * 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US7007833B2 (en) 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
US6609652B2 (en) 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US6225205B1 (en) * 1998-01-22 2001-05-01 Ricoh Microelectronics Company, Ltd. Method of forming bump electrodes
JPH11312711A (ja) * 1998-04-30 1999-11-09 Murata Mfg Co Ltd 電子部品の接続方法
TW409490B (en) * 1998-12-31 2000-10-21 World Wiser Electronics Inc The equipment for plug hole process and the method thereof
KR100338329B1 (ko) * 2000-02-25 2002-05-27 백승준 반도체 소자의 금속 배선 형성 방법
US6354213B1 (en) * 2000-04-03 2002-03-12 Jerome D. Jenkins Method and apparatus for cleaning a metering roll of a printing press
EP1162654A1 (de) * 2000-06-06 2001-12-12 I-Ming Chen Verfahren zum Montieren eines Halbleiterchips auf einem Substrat und Halbleitervorrichtung geeignet für das Montieren auf einem Substrat
US6676991B2 (en) * 2001-10-29 2004-01-13 Hewlett-Packard Development Company, L.P. Etch resist using printer technology
US6586843B2 (en) * 2001-11-08 2003-07-01 Intel Corporation Integrated circuit device with covalently bonded connection structure
DE10159539A1 (de) * 2001-12-05 2003-06-26 Hueck Folien Gmbh & Co Kg Verfahren zur Herstellung eines Druckwerkzeugs, Druckwerkzeug und dessen Verwendung zum Verdrucken von insbesondere hochviskosen und/oder hochpigmentierten Lacken und Farben
US6897089B1 (en) * 2002-05-17 2005-05-24 Micron Technology, Inc. Method and system for fabricating semiconductor components using wafer level contact printing
US7082876B2 (en) * 2002-06-07 2006-08-01 Obducat Ab Method for transferring a pattern
US6981318B2 (en) * 2002-10-22 2006-01-03 Jetta Company Limited Printed circuit board manufacturing method
WO2004054339A1 (ja) * 2002-12-06 2004-06-24 Tamura Corporation はんだ供給方法
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8033016B2 (en) * 2005-04-15 2011-10-11 Panasonic Corporation Method for manufacturing an electrode and electrode component mounted body
JP4637781B2 (ja) * 2006-03-31 2011-02-23 昭和電工株式会社 ＧａＮ系半導体発光素子の製造方法
KR100746361B1 (ko) * 2006-07-11 2007-08-06 삼성전기주식회사 인쇄회로기판 제조방법
KR100792525B1 (ko) * 2006-08-11 2008-01-09 삼성전기주식회사 인쇄회로기판 제조방법
JP4961897B2 (ja) * 2006-08-29 2012-06-27 ソニー株式会社 レーザー照射装置、レーザー照射方法、薄膜半導体装置の製造方法、及び表示装置の製造方法
JP2008244361A (ja) * 2007-03-28 2008-10-09 Hitachi Via Mechanics Ltd プリント基板のレーザ加工方法
KR100866577B1 (ko) * 2007-09-28 2008-11-03 삼성전기주식회사 인쇄회로기판의 층간 도통방법
US8298611B2 (en) * 2008-07-23 2012-10-30 Seagate Technology Llc Discrete track media
US20100031501A1 (en) * 2008-08-08 2010-02-11 Napra Co., Ltd. Method for filling through hole or non-through hole formed on board with filler
FR2966008B1 (fr) * 2010-10-12 2012-12-14 Jean Noel Claveau Procede de formation d'un circuit electrique par sublimation d'encre chargee de nanoparticules conductrice.
US8534533B2 (en) * 2012-01-19 2013-09-17 Raytheon Company Solder paste transfer process
US8770462B2 (en) 2012-03-14 2014-07-08 Raytheon Company Solder paste transfer process
JP2015159277A (ja) * 2014-01-23 2015-09-03 パナソニック株式会社 電子デバイスの製造方法
US11802337B1 (en) * 2014-01-28 2023-10-31 United States of America as Administrator of NASA Atmospheric pressure plasma based fabrication process of printable electronics and functional coatings
TWI805953B (zh) * 2020-10-15 2023-06-21 日商小森公司 球搭載方法及球搭載裝置
CN114521057B (zh) * 2020-11-18 2024-07-05 深南电路股份有限公司 一种印制线路板及其制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560256A (en) * 1966-10-06 1971-02-02 Western Electric Co Combined thick and thin film circuits
US4000054A (en) * 1970-11-06 1976-12-28 Microsystems International Limited Method of making thin film crossover structure
AT337292B (de) * 1971-09-02 1977-06-27 Siemens Ag Verfahren zur herstellung einer leiterplatte
US3806629A (en) * 1972-07-03 1974-04-23 Spacetac Inc Crossover junction
US3821611A (en) * 1973-09-21 1974-06-28 Du Pont Cross conductors with double layered insulation
US4417393A (en) * 1981-04-01 1983-11-29 General Electric Company Method of fabricating high density electronic circuits having very narrow conductors
US4566384A (en) * 1983-01-18 1986-01-28 Dainippon Screen Mfg. Co., Ltd. Intaglio printing plate and printing method
DE3433045A1 (de) * 1984-09-08 1986-03-20 Basf Ag, 6700 Ludwigshafen Lichthaertbare verschlussmasse, insbesondere zum verschliessen des spaltes zwischen den enden von auf formzylinder aufgespannten tiefdruckplatten
GB2177262B (en) * 1985-06-28 1988-08-10 Gen Electric Co Plc Electrical circuits
US4908346A (en) * 1987-07-01 1990-03-13 Eastman Kodak Company Crystalline rare earth alkaline earth copper oxide thick film circuit element with superconducting onset transition temperature in excess of 77%
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
EP0452118B1 (de) * 1990-04-12 1996-08-21 Matsushita Electric Industrial Co., Ltd. Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
US5362513A (en) * 1990-05-10 1994-11-08 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same
JPH0467509A (ja) * 1990-07-06 1992-03-03 Kao Corp 導電性ペースト及び導電性塗膜
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
US5600103A (en) * 1993-04-16 1997-02-04 Kabushiki Kaisha Toshiba Circuit devices and fabrication method of the same
US5609704A (en) * 1993-09-21 1997-03-11 Matsushita Electric Industrial Co., Ltd. Method for fabricating an electronic part by intaglio printing
JP3039285B2 (ja) * 1993-09-21 2000-05-08 松下電器産業株式会社 電子部品およびその製造方法
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5629837A (en) * 1995-09-20 1997-05-13 Oz Technologies, Inc. Button contact for surface mounting an IC device to a circuit board
US5853446A (en) * 1996-04-16 1998-12-29 Corning Incorporated Method for forming glass rib structures

Also Published As

Publication number Publication date
EP0861018A3 (de) 1999-07-14
US6109175A (en) 2000-08-29
US6586685B2 (en) 2003-07-01
KR19980071549A (ko) 1998-10-26
DE69810170D1 (de) 2003-01-30
EP0861018B1 (de) 2002-12-18
US20020000330A1 (en) 2002-01-03
TW340296B (en) 1998-09-11
EP0861018A2 (de) 1998-08-26

Similar Documents

Publication Publication Date Title
DE69810170D1 (de) Tiefdruckverfahren, Tiefdrucker, Verfahren zur Herstellung von Höckern oder Leitermustern, Vorrichtung dafür, Höckerelektrode und gedruckte Leiterplatte
GB2341277A (en) An electronic component package with posts on the active surface
DE69417684D1 (de) Leitfähige Pastenzusammensetzung zum Füllen von Kontaktlöchern, Leiterplatte unter Anwendung dieser leifähigen Paste und Verfahren zur Herstellung
ATE317633T1 (de) Verfahren zur herstellung einer gedruckten schaltung und mit dieser gedruckten schaltung hergestellte planarantenne
ATE283764T1 (de) Datenträger mit stichtiefdruckbild und verfahren zur umsetzung von bildmotiven in linienstrukturen sowie in eine stichtiefdruckplatte
DE69507739D1 (de) Verfahren und Vorrichtung zum Siebdrucken
ATE251836T1 (de) Verfahren zur herstellung von leiterzügen auf einer leiterplatte und vorrichtung zur durchführung des verfahrens
DE3769785D1 (de) Verfahren und beschichtungsmittel zum aufbringen elektrisch leitender druckbilder auf isolierende substrate.
WO2002097534A3 (en) Apparatus and method for aligning an article with a reference object
SG103894A1 (en) Method of removing assist features utilized to improve process latitude
ATE232332T1 (de) Bilderzeugungsgerät und verfahren zur herstellung
DE59704917D1 (de) Verfahren zum Vereinzeln von elektronischen Elementen unter Verwendung einer Trägerschicht
AU7759498A (en) Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards
GB9817589D0 (en) Method and apparatus for recognition of hand printed characters represented as an electronic ink stream
EP1359464A3 (de) Methode und Gerät zur Bestimmung eines Maskenmusters mit räumlicher Frequenzverdopplung
SE8302619L (sv) Forfarande och anordning for framstellning av kopplingsplattor
US6344974B1 (en) Printed circuit board and method of producing same
EP1080889A3 (de) Methode und Vorrichtung zur Regelung des auf Druckmaterial ausgeübten Pressdrucks
GB2177262A (en) Making printed circuits
JP2000228572A (ja) 可撓性回路基板の端子部形成法
ATE161384T1 (de) Verfahren zur durchkontaktierung von leiterplatten
DE69203304D1 (de) Verfahren und Vorrichtung zur Offsetlackierung.
ATE476298T1 (de) Verfahren zum gravieren von einem druckblock
JP3982871B2 (ja) 半田印刷検査処理方法および半田印刷機
DE69218336D1 (de) Verfahren zur Herstellung eines elektrisch leitenden Kontakts

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties