ATE230445T1 - Verfahren und vorrichtung zur ablagerung von parylen af4 auf halbleiterwafern - Google Patents
Verfahren und vorrichtung zur ablagerung von parylen af4 auf halbleiterwafernInfo
- Publication number
- ATE230445T1 ATE230445T1 AT96936895T AT96936895T ATE230445T1 AT E230445 T1 ATE230445 T1 AT E230445T1 AT 96936895 T AT96936895 T AT 96936895T AT 96936895 T AT96936895 T AT 96936895T AT E230445 T1 ATE230445 T1 AT E230445T1
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- parylene
- deposing
- onto
- semiconductor wafers
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/025—Polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
- C08G2261/342—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms
- C08G2261/3424—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms non-conjugated, e.g. paracyclophanes or xylenes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/549,169 US5534068A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including a tapered deposition chamber and dual vacuum outlet pumping arrangement |
| US08/549,133 US5536317A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including a quartz crystal thickness/rate controller |
| US08/549,093 US5536319A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including an atmospheric shroud and inert gas source |
| US08/549,131 US5536321A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including a post-pyrolysis filtering chamber and a deposition chamber inlet filter |
| US08/549,395 US5709753A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including a heated and cooled dimer crucible |
| US08/549,087 US5538758A (en) | 1995-10-27 | 1995-10-27 | Method and apparatus for the deposition of parylene AF4 onto semiconductor wafers |
| US08/549,635 US5536322A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including a heated and cooled support platen and an electrostatic clamping device |
| US08/549,130 US5556473A (en) | 1995-10-27 | 1995-10-27 | Parylene deposition apparatus including dry vacuum pump system and downstream cold trap |
| US67982796A | 1996-07-15 | 1996-07-15 | |
| US67995896A | 1996-07-15 | 1996-07-15 | |
| US68016196A | 1996-07-15 | 1996-07-15 | |
| US67995696A | 1996-07-15 | 1996-07-15 | |
| US68000596A | 1996-07-15 | 1996-07-15 | |
| US68357796A | 1996-07-15 | 1996-07-15 | |
| PCT/US1996/017003 WO1997015699A2 (en) | 1995-10-27 | 1996-10-25 | Method and apparatus for the deposition of parylene af4 onto semiconductor wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE230445T1 true ATE230445T1 (de) | 2003-01-15 |
Family
ID=27585116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT96936895T ATE230445T1 (de) | 1995-10-27 | 1996-10-25 | Verfahren und vorrichtung zur ablagerung von parylen af4 auf halbleiterwafern |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0862664B1 (de) |
| JP (1) | JP3808102B2 (de) |
| AT (1) | ATE230445T1 (de) |
| WO (1) | WO1997015699A2 (de) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6140456A (en) * | 1997-10-24 | 2000-10-31 | Quester Techology, Inc. | Chemicals and processes for making fluorinated poly(para-xylylenes) |
| US6086679A (en) * | 1997-10-24 | 2000-07-11 | Quester Technology, Inc. | Deposition systems and processes for transport polymerization and chemical vapor deposition |
| US6020458A (en) | 1997-10-24 | 2000-02-01 | Quester Technology, Inc. | Precursors for making low dielectric constant materials with improved thermal stability |
| US6051321A (en) * | 1997-10-24 | 2000-04-18 | Quester Technology, Inc. | Low dielectric constant materials and method |
| JP2002514004A (ja) | 1998-05-01 | 2002-05-14 | セシュー ビー デス | 化学蒸着によって堆積された酸化物/有機ポリマー多層薄膜 |
| US6495208B1 (en) | 1999-09-09 | 2002-12-17 | Virginia Tech Intellectual Properties, Inc. | Near-room temperature CVD synthesis of organic polymer/oxide dielectric nanocomposites |
| US6703462B2 (en) * | 2001-08-09 | 2004-03-09 | Dielectric Systems Inc. | Stabilized polymer film and its manufacture |
| US7192645B2 (en) | 2001-02-26 | 2007-03-20 | Dielectric Systems, Inc. | Porous low E (<2.0) thin films by transport co-polymerization |
| US7026052B2 (en) | 2001-02-26 | 2006-04-11 | Dielectric Systems, Inc. | Porous low k(<2.0) thin film derived from homo-transport-polymerization |
| US6881447B2 (en) * | 2002-04-04 | 2005-04-19 | Dielectric Systems, Inc. | Chemically and electrically stabilized polymer films |
| US6825303B2 (en) * | 2001-02-26 | 2004-11-30 | Dielectric Systems, Inc. | Integration of low ε thin films and Ta into Cu dual damascene |
| US6797343B2 (en) | 2001-12-20 | 2004-09-28 | Dielectric Systems, Inc. | Dielectric thin films from fluorinated precursors |
| RU2218364C2 (ru) * | 2001-07-27 | 2003-12-10 | Федеральное государственное унитарное предприятие "Научно-исследовательский физико-химический институт им. Л.Я. Карпова" | ПЛЕНКА ИЗ ПОЛИ ( α,α,α′,α′- ТЕТРАФТОРПАРАКСИЛИЛЕНА), СПОСОБ ЕЕ ПОЛУЧЕНИЯ И ПОЛУПРОВОДНИКОВЫЙ ПРИБОР С ЕЕ ИСПОЛЬЗОВАНИЕМ |
| US7179283B2 (en) | 2001-11-02 | 2007-02-20 | Scimed Life Systems, Inc. | Vapor deposition process for producing a stent-graft and a stent-graft produced therefrom |
| US6783598B2 (en) * | 2002-08-15 | 2004-08-31 | Fibersense Technology Corp. | Moisture barrier sealing of fiber optic coils |
| US7309395B2 (en) | 2004-03-31 | 2007-12-18 | Dielectric Systems, Inc. | System for forming composite polymer dielectric film |
| US7094661B2 (en) | 2004-03-31 | 2006-08-22 | Dielectric Systems, Inc. | Single and dual damascene techniques utilizing composite polymer dielectric film |
| US6962871B2 (en) | 2004-03-31 | 2005-11-08 | Dielectric Systems, Inc. | Composite polymer dielectric film |
| US20090142227A1 (en) * | 2005-07-01 | 2009-06-04 | Manfred Fuchs | Parylene Coating and Method for the Production Thereof |
| US20070148390A1 (en) * | 2005-12-27 | 2007-06-28 | Specialty Coating Systems, Inc. | Fluorinated coatings |
| US20100034970A1 (en) * | 2006-07-28 | 2010-02-11 | Daisankasei Co., Ltd. | Apparatus and method for chemical vapor deposition |
| DE102009003781A1 (de) | 2008-06-03 | 2009-12-10 | Aixtron Ag | Verfahren zum Abscheiden eines dünnschichtigen Polymers in einer Niederdruckgasphase |
| RU2461429C2 (ru) * | 2010-09-03 | 2012-09-20 | Российская Федерация, от имени которой выступает Министерство образования и науки РФ (Минобрнаука РФ) | Способ получения пленок полипараксилилена и его производных |
| US8816371B2 (en) * | 2011-11-30 | 2014-08-26 | Micron Technology, Inc. | Coated color-converting particles and associated devices, systems, and methods |
| US10887371B2 (en) | 2015-09-14 | 2021-01-05 | Google Llc | Systems and methods for content storage and retrieval |
| US11933942B2 (en) * | 2019-03-25 | 2024-03-19 | Applied Materials, Inc. | Non-line-of-sight deposition of coating on internal components of assembled device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB650947A (en) * | 1947-09-19 | 1951-03-07 | Michael Mojzesz Szwarc | The production of new polymers |
| US3246627A (en) * | 1962-10-05 | 1966-04-19 | Union Carbide Corp | Apparatus for vapor deposition |
| US3301707A (en) * | 1962-12-27 | 1967-01-31 | Union Carbide Corp | Thin film resistors and methods of making thereof |
| US3749601A (en) * | 1971-04-01 | 1973-07-31 | Hughes Aircraft Co | Encapsulated packaged electronic assembly |
| US4110392A (en) * | 1976-12-17 | 1978-08-29 | W. L. Gore & Associates, Inc. | Production of porous sintered PTFE products |
| US4184188A (en) * | 1978-01-16 | 1980-01-15 | Veeco Instruments Inc. | Substrate clamping technique in IC fabrication processes |
| CA1187622A (en) * | 1981-03-11 | 1985-05-21 | Zoltan J. Kiss | Semiconductor device having a body of amorphous silicon |
| EP0102417A1 (de) * | 1982-08-24 | 1984-03-14 | New-Come Filters Limited | Gasfiltervorrichtung |
| US4577465A (en) * | 1984-05-11 | 1986-03-25 | Helix Technology Corporation | Oil free vacuum system |
| EP0246917B1 (de) * | 1986-05-23 | 1992-07-22 | W.L. Gore & Associates, Inc. | Hochleistungsgasfilter |
| US4761269A (en) * | 1986-06-12 | 1988-08-02 | Crystal Specialties, Inc. | Apparatus for depositing material on a substrate |
| US4990374A (en) * | 1989-11-28 | 1991-02-05 | Cvd Incorporated | Selective area chemical vapor deposition |
| US5112642A (en) * | 1990-03-30 | 1992-05-12 | Leybold Inficon, Inc. | Measuring and controlling deposition on a piezoelectric monitor crystal |
| US5268202A (en) * | 1992-10-09 | 1993-12-07 | Rensselaer Polytechnic Institute | Vapor deposition of parylene-F using 1,4-bis (trifluoromethyl) benzene |
| JP3319055B2 (ja) * | 1993-08-06 | 2002-08-26 | 日新電機株式会社 | 水晶振動子式ラジカルビームモニタ |
| CA2147813A1 (en) * | 1994-04-28 | 1995-10-29 | Richard Dixon | Intravascular prosthesis with anti-thrombogenic coating |
| US5534068A (en) * | 1995-10-27 | 1996-07-09 | Specialty Coating Systems, Inc. | Parylene deposition apparatus including a tapered deposition chamber and dual vacuum outlet pumping arrangement |
-
1996
- 1996-10-25 EP EP96936895A patent/EP0862664B1/de not_active Expired - Lifetime
- 1996-10-25 WO PCT/US1996/017003 patent/WO1997015699A2/en not_active Ceased
- 1996-10-25 AT AT96936895T patent/ATE230445T1/de not_active IP Right Cessation
- 1996-10-25 JP JP51675197A patent/JP3808102B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO1997015699A2 (en) | 1997-05-01 |
| JP2000508115A (ja) | 2000-06-27 |
| JP3808102B2 (ja) | 2006-08-09 |
| EP0862664B1 (de) | 2003-01-02 |
| WO1997015699A3 (en) | 1997-09-12 |
| EP0862664A2 (de) | 1998-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |