ATE246399T1 - Werkzeug für eine kontaktfreie halterung von plattenförmigen substraten - Google Patents

Werkzeug für eine kontaktfreie halterung von plattenförmigen substraten

Info

Publication number
ATE246399T1
ATE246399T1 AT99109589T AT99109589T ATE246399T1 AT E246399 T1 ATE246399 T1 AT E246399T1 AT 99109589 T AT99109589 T AT 99109589T AT 99109589 T AT99109589 T AT 99109589T AT E246399 T1 ATE246399 T1 AT E246399T1
Authority
AT
Austria
Prior art keywords
gas
slit
respect
plate
chamber
Prior art date
Application number
AT99109589T
Other languages
English (en)
Inventor
Helmut Ing Frey
Original Assignee
Sez Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sez Ag filed Critical Sez Ag
Application granted granted Critical
Publication of ATE246399T1 publication Critical patent/ATE246399T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Multi-Conductor Connections (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT99109589T 1998-05-29 1999-05-14 Werkzeug für eine kontaktfreie halterung von plattenförmigen substraten ATE246399T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8735998P 1998-05-29 1998-05-29

Publications (1)

Publication Number Publication Date
ATE246399T1 true ATE246399T1 (de) 2003-08-15

Family

ID=22204717

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99109589T ATE246399T1 (de) 1998-05-29 1999-05-14 Werkzeug für eine kontaktfreie halterung von plattenförmigen substraten

Country Status (7)

Country Link
US (1) US5967578A (de)
EP (1) EP0961309B1 (de)
JP (1) JP3401637B2 (de)
KR (1) KR100498779B1 (de)
AT (1) ATE246399T1 (de)
DE (1) DE69909893T2 (de)
TW (1) TW417144B (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322116B1 (en) * 1999-07-23 2001-11-27 Asm America, Inc. Non-contact end effector
US6481951B1 (en) * 1999-09-16 2002-11-19 Applied Materials, Inc. Multiple sided robot blade for semiconductor processing equipment
JP4391655B2 (ja) 2000-02-22 2009-12-24 インターナショナル・ビジネス・マシーンズ・コーポレーション エアピンセット
US6517130B1 (en) * 2000-03-14 2003-02-11 Applied Materials, Inc. Self positioning vacuum chuck
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US6497403B2 (en) 2000-12-28 2002-12-24 Memc Electronic Materials, Inc. Semiconductor wafer holder
US6601888B2 (en) 2001-03-19 2003-08-05 Creo Inc. Contactless handling of objects
US6935830B2 (en) * 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6638004B2 (en) 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
CA2455283A1 (fr) * 2004-01-26 2005-07-26 Rejean Leblond Systeme universel de securite (s.u.s.)
TWI235412B (en) * 2004-08-10 2005-07-01 Ind Tech Res Inst Method for manufacturing bonded wafer with ultra-thin single crystal ferroelectricity film
US20060040111A1 (en) * 2004-08-20 2006-02-23 Dolechek Kert L Process chamber and system for thinning a semiconductor workpiece
US7193295B2 (en) * 2004-08-20 2007-03-20 Semitool, Inc. Process and apparatus for thinning a semiconductor workpiece
US7354649B2 (en) 2004-08-20 2008-04-08 Semitool, Inc. Semiconductor workpiece
US20060046499A1 (en) * 2004-08-20 2006-03-02 Dolechek Kert L Apparatus for use in thinning a semiconductor workpiece
US7288489B2 (en) * 2004-08-20 2007-10-30 Semitool, Inc. Process for thinning a semiconductor workpiece
DE102004045957A1 (de) * 2004-09-22 2006-04-06 Singulus Technologies Ag Vorrichtung zum Halten und Transportieren eines Werkstücks mit einer ebenen Oberfläche
JP4541824B2 (ja) * 2004-10-14 2010-09-08 リンテック株式会社 非接触型吸着保持装置
CN101304847A (zh) * 2005-08-16 2008-11-12 约瑟夫·莫泽 具有双侧抽吸梁的运动装置
JP2007214529A (ja) * 2006-01-13 2007-08-23 Fluoro Mechanic Kk ベルヌーイチャック
KR101761166B1 (ko) * 2009-03-31 2017-07-25 에이티에스 오토메이션 툴링 시스템즈 인코포레이티드 스프링들에 의해 안정화된 진공 그리퍼 조립체
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US9528184B2 (en) 2015-02-13 2016-12-27 Eastman Kodak Company Atomic-layer deposition method using compound gas jet
US9499906B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Coating substrate using bernoulli atomic-layer deposition
US9506147B2 (en) 2015-02-13 2016-11-29 Eastman Kodak Company Atomic-layer deposition apparatus using compound gas jet
US9499908B2 (en) 2015-02-13 2016-11-22 Eastman Kodak Company Atomic layer deposition apparatus
CN106298618A (zh) * 2015-06-26 2017-01-04 北京北方微电子基地设备工艺研究中心有限责任公司 晶片传输装置
US10373858B2 (en) 2016-04-06 2019-08-06 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
US11342215B2 (en) 2017-04-25 2022-05-24 Veeco Instruments Inc. Semiconductor wafer processing chamber
CN110612601B (zh) * 2017-05-11 2023-08-22 日商乐华股份有限公司 薄板状衬底保持指状件以及具有该指状件的运送机器人
EP3687884A4 (de) * 2017-09-25 2021-07-14 WCB Robotics Inc. Niederdrucksauger mit hohem durchfluss
FR3084518B1 (fr) * 2018-07-25 2020-10-30 Commissariat Energie Atomique Dispositif de prehension d'une structure monocouche ou multicouche comportant un element de prehension rotatif et thermique
GB202215215D0 (en) 2022-10-14 2022-11-30 Lam Res Ag Device for conveying a wafer-shaped article

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3438668A (en) * 1965-08-26 1969-04-15 Gen Electric Contactless lifter
US3523706A (en) * 1967-10-27 1970-08-11 Ibm Apparatus for supporting articles without structural contact and for positioning the supported articles
US3539216A (en) * 1968-01-11 1970-11-10 Sprague Electric Co Pickup device
GB1513444A (en) * 1974-09-06 1978-06-07 Chemical Reactor Equip As Pick-up devices for lifting and moving semiconductor wafers
DE2609754A1 (de) * 1976-03-09 1977-09-22 Wacker Chemitronic Halterung fuer das beidseitig beruehrungslose aufnehmen von scheiben
JPS6351446U (de) * 1986-09-22 1988-04-07
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
GB8815553D0 (en) * 1988-06-30 1988-08-03 Mpl Precision Ltd Vacuum chuck
ATE174155T1 (de) * 1993-02-08 1998-12-15 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige gegenstände
EP0611273B1 (de) * 1993-02-08 1998-09-16 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Träger für scheibenförmige Gegenstände
WO1997003456A1 (de) * 1995-07-12 1997-01-30 Sez Semiconductor-Equipment Zubehör Für Die Halbleiterfertigung Gesellschaft Mbh Träger für scheibenförmige gegenstände, insbesondere siliziumscheiben

Also Published As

Publication number Publication date
DE69909893T2 (de) 2006-10-05
KR19990088549A (ko) 1999-12-27
EP0961309A3 (de) 2001-08-29
JPH11354611A (ja) 1999-12-24
DE69909893D1 (de) 2003-09-04
EP0961309A2 (de) 1999-12-01
JP3401637B2 (ja) 2003-04-28
US5967578A (en) 1999-10-19
KR100498779B1 (ko) 2005-07-01
TW417144B (en) 2001-01-01
EP0961309B1 (de) 2003-07-30

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