ATE254192T1 - Verfahren und vorrichtung zur sequentiellen plasmabehandlung - Google Patents
Verfahren und vorrichtung zur sequentiellen plasmabehandlungInfo
- Publication number
- ATE254192T1 ATE254192T1 AT01401101T AT01401101T ATE254192T1 AT E254192 T1 ATE254192 T1 AT E254192T1 AT 01401101 T AT01401101 T AT 01401101T AT 01401101 T AT01401101 T AT 01401101T AT E254192 T1 ATE254192 T1 AT E254192T1
- Authority
- AT
- Austria
- Prior art keywords
- plasma treatment
- ionisation energy
- substrate
- energy sources
- sources
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32394—Treating interior parts of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
- Radiation-Therapy Devices (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01401101A EP1253216B1 (de) | 2001-04-27 | 2001-04-27 | Verfahren und Vorrichtung zur sequentiellen Plasmabehandlung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE254192T1 true ATE254192T1 (de) | 2003-11-15 |
Family
ID=8182707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01401101T ATE254192T1 (de) | 2001-04-27 | 2001-04-27 | Verfahren und vorrichtung zur sequentiellen plasmabehandlung |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US7618686B2 (de) |
| EP (1) | EP1253216B1 (de) |
| JP (1) | JP2004533316A (de) |
| KR (1) | KR20040007516A (de) |
| AT (1) | ATE254192T1 (de) |
| CA (1) | CA2444766C (de) |
| DE (1) | DE60101209T2 (de) |
| DK (1) | DK1253216T3 (de) |
| ES (1) | ES2208530T3 (de) |
| NO (1) | NO20034750L (de) |
| PT (1) | PT1253216E (de) |
| TW (1) | TW593464B (de) |
| WO (1) | WO2002088420A1 (de) |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10358505B4 (de) * | 2003-12-13 | 2007-10-11 | Roth & Rau Ag | Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas |
| EP1662546A1 (de) * | 2004-11-25 | 2006-05-31 | The European Community, represented by the European Commission | Induktiv gekoppelte Plasmabearbeitungsvorrichtung |
| JP4682917B2 (ja) * | 2006-05-30 | 2011-05-11 | パナソニック株式会社 | 大気圧プラズマ発生方法及び装置 |
| JP4682946B2 (ja) * | 2006-07-25 | 2011-05-11 | パナソニック株式会社 | プラズマ処理方法及び装置 |
| TW200816880A (en) | 2006-05-30 | 2008-04-01 | Matsushita Electric Industrial Co Ltd | Atmospheric pressure plasma generating method, plasma processing method and component mounting method using same, and device using these methods |
| DE102007035403A1 (de) * | 2007-07-26 | 2009-01-29 | Linde Ag | Verfahren zum thermischen Trennen |
| DK2251453T3 (da) | 2009-05-13 | 2014-07-07 | Sio2 Medical Products Inc | Beholderholder |
| US9545360B2 (en) | 2009-05-13 | 2017-01-17 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
| US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
| US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
| JP5429124B2 (ja) * | 2010-09-29 | 2014-02-26 | パナソニック株式会社 | プラズマ処理方法及び装置 |
| US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
| US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
| JP6095678B2 (ja) | 2011-11-11 | 2017-03-15 | エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド | 薬剤パッケージ用の不動態化、pH保護又は滑性皮膜、被覆プロセス及び装置 |
| US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
| US20150297800A1 (en) | 2012-07-03 | 2015-10-22 | Sio2 Medical Products, Inc. | SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS |
| DE102012109251A1 (de) * | 2012-09-28 | 2014-04-03 | Osram Gmbh | Vorrichtung und Verfahren zur Beschichtung von Substraten |
| CN104854257B (zh) | 2012-11-01 | 2018-04-13 | Sio2医药产品公司 | 涂层检查方法 |
| JP6093552B2 (ja) * | 2012-11-08 | 2017-03-08 | 日精エー・エス・ビー機械株式会社 | 樹脂容器用コーティング装置 |
| EP2920567B1 (de) | 2012-11-16 | 2020-08-19 | SiO2 Medical Products, Inc. | Verfahren und vorrichtung zur erkennung von schnellen sperrbeschichtungsintegritätseigenschaften |
| CA2892294C (en) | 2012-11-30 | 2021-07-27 | Sio2 Medical Products, Inc. | Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like |
| US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
| CN103037609B (zh) * | 2013-01-10 | 2014-12-31 | 哈尔滨工业大学 | 射流等离子体电子能量调节器 |
| CN103060778B (zh) * | 2013-01-23 | 2015-03-11 | 深圳市劲拓自动化设备股份有限公司 | 平板式pecvd装置 |
| EP2961858B1 (de) | 2013-03-01 | 2022-09-07 | Si02 Medical Products, Inc. | Beschichtete spritze. |
| US10060851B2 (en) | 2013-03-05 | 2018-08-28 | Plexense, Inc. | Surface plasmon detection apparatuses and methods |
| CN110074968B (zh) | 2013-03-11 | 2021-12-21 | Sio2医药产品公司 | 涂布包装材料 |
| US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
| WO2014144926A1 (en) | 2013-03-15 | 2014-09-18 | Sio2 Medical Products, Inc. | Coating method |
| US10359362B2 (en) | 2013-04-15 | 2019-07-23 | Plexense, Inc. | Method for manufacturing nanoparticle array, surface plasmon resonance-based sensor and method for analyzing using same |
| EP3122917B1 (de) | 2014-03-28 | 2020-05-06 | SiO2 Medical Products, Inc. | Antistatische beschichtungen für kunststoffbehälter |
| EP3233303A4 (de) * | 2014-12-15 | 2018-08-22 | Plexense, Inc. | Oberflächenplasmonendetektionvorrichtungen und -verfahren |
| KR102786617B1 (ko) | 2015-08-18 | 2025-03-26 | 에스아이오2 메디컬 프로덕츠, 엘엘씨 | 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기 |
| CN109074998A (zh) * | 2016-04-29 | 2018-12-21 | 雷特罗萨米科技有限责任公司 | Vhf z线圈等离子体源 |
| US10510575B2 (en) * | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
| US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
| US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
| KR20250100790A (ko) | 2019-01-22 | 2025-07-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 펄스 전압 파형을 제어하기 위한 피드백 루프 |
| US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
| US11462388B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Plasma processing assembly using pulsed-voltage and radio-frequency power |
| US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
| US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
| US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
| US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US12581586B2 (en) | 2021-05-14 | 2026-03-17 | Eli Lilly And Company | Systems and methods for igniting plasma within tubes |
| US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
| US12525441B2 (en) | 2021-06-09 | 2026-01-13 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
| US12525433B2 (en) | 2021-06-09 | 2026-01-13 | Applied Materials, Inc. | Method and apparatus to reduce feature charging in plasma processing chamber |
| US12148595B2 (en) | 2021-06-09 | 2024-11-19 | Applied Materials, Inc. | Plasma uniformity control in pulsed DC plasma chamber |
| US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
| US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
| US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
| US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
| US12106938B2 (en) | 2021-09-14 | 2024-10-01 | Applied Materials, Inc. | Distortion current mitigation in a radio frequency plasma processing chamber |
| US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
| US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
| US12315732B2 (en) | 2022-06-10 | 2025-05-27 | Applied Materials, Inc. | Method and apparatus for etching a semiconductor substrate in a plasma etch chamber |
| US12272524B2 (en) | 2022-09-19 | 2025-04-08 | Applied Materials, Inc. | Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics |
| US12111341B2 (en) | 2022-10-05 | 2024-10-08 | Applied Materials, Inc. | In-situ electric field detection method and apparatus |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1603949A (en) * | 1978-05-30 | 1981-12-02 | Standard Telephones Cables Ltd | Plasma deposit |
| US4692347A (en) * | 1983-07-07 | 1987-09-08 | The Curators Of The University Of Missouri | Method of interiorly coating tubing |
| ATE49023T1 (de) * | 1984-03-03 | 1990-01-15 | Stc Plc | Pulsierendes plasmaverfahren. |
| US4879140A (en) * | 1988-11-21 | 1989-11-07 | Deposition Sciences, Inc. | Method for making pigment flakes |
| US5434395A (en) * | 1990-03-05 | 1995-07-18 | Jean-Rene Storck | Method and device for effecting a transaction between a first and at least one second data carrier and carrier used for this purpose |
| DE4034211C1 (en) * | 1990-10-27 | 1991-11-14 | Schott Glaswerke, 6500 Mainz, De | Coating interior of pipe-glass tube - comprises coupling HF energy to tube using resonator to deliver pulsed microwave discharges |
| AU5914994A (en) * | 1993-04-21 | 1994-10-27 | Bend Research, Inc. | Plasma polymerization and surface modification inside hollow micro-substrates |
| US6022602A (en) * | 1994-01-26 | 2000-02-08 | Neomecs Incorporated | Plasma modification of lumen surface of tubing |
| US5593550A (en) * | 1994-05-06 | 1997-01-14 | Medtronic, Inc. | Plasma process for reducing friction within the lumen of polymeric tubing |
| US5521351A (en) * | 1994-08-30 | 1996-05-28 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma surface treatment of the interior of hollow forms |
| DE4437050A1 (de) * | 1994-10-17 | 1996-04-18 | Leybold Ag | Vorrichtung zum Behandeln von Oberflächen von Hohlkörpern, insbesondere von Innenflächen von Kraftstofftanks |
| US5653811A (en) * | 1995-07-19 | 1997-08-05 | Chan; Chung | System for the plasma treatment of large area substrates |
| US5907221A (en) * | 1995-08-16 | 1999-05-25 | Applied Materials, Inc. | Inductively coupled plasma reactor with an inductive coil antenna having independent loops |
| DE19634795C2 (de) * | 1996-08-29 | 1999-11-04 | Schott Glas | Plasma-CVD-Anlage mit einem Array von Mikrowellen-Plasmaelektroden und Plasma-CVD-Verfahren |
| DE19643865C2 (de) * | 1996-10-30 | 1999-04-08 | Schott Glas | Plasmaunterstütztes chemisches Abscheidungsverfahren (CVD) mit entfernter Anregung eines Anregungsgases (Remote-Plasma-CVD-Verfahren) zur Beschichtung oder zur Behandlung großflächiger Substrate und Vorrichtung zur Durchführung desselben |
| WO1998037259A1 (en) * | 1997-02-19 | 1998-08-27 | Kirin Beer Kabushiki Kaisha | Method and apparatus for producing plastic container having carbon film coating |
| JP3072269B2 (ja) * | 1997-02-19 | 2000-07-31 | 麒麟麦酒株式会社 | 炭素膜コーティングプラスチック容器の製造装置および製造方法 |
| US6051073A (en) * | 1998-02-11 | 2000-04-18 | Silicon Genesis Corporation | Perforated shield for plasma immersion ion implantation |
| JP3698887B2 (ja) * | 1998-03-16 | 2005-09-21 | 株式会社アルバック | ダイヤモンド状炭素膜の製造装置 |
| DE69940260D1 (de) * | 1999-09-29 | 2009-02-26 | Europ Economic Community | Gleichmässige Gasverteilung in einer grossflächige Plasma-Behandlungs-Vorrichtung |
| EP1126504A1 (de) * | 2000-02-18 | 2001-08-22 | European Community | Verfahren und Gerät zur induktivgekoppelter Plasmabehandlung |
-
2001
- 2001-04-27 AT AT01401101T patent/ATE254192T1/de active
- 2001-04-27 ES ES01401101T patent/ES2208530T3/es not_active Expired - Lifetime
- 2001-04-27 EP EP01401101A patent/EP1253216B1/de not_active Expired - Lifetime
- 2001-04-27 DE DE60101209T patent/DE60101209T2/de not_active Expired - Lifetime
- 2001-04-27 DK DK01401101T patent/DK1253216T3/da active
- 2001-04-27 PT PT01401101T patent/PT1253216E/pt unknown
-
2002
- 2002-04-01 TW TW091106499A patent/TW593464B/zh not_active IP Right Cessation
- 2002-04-24 WO PCT/EP2002/004583 patent/WO2002088420A1/en not_active Ceased
- 2002-04-24 KR KR10-2003-7014098A patent/KR20040007516A/ko not_active Withdrawn
- 2002-04-24 US US10/475,512 patent/US7618686B2/en not_active Expired - Fee Related
- 2002-04-24 JP JP2002585697A patent/JP2004533316A/ja active Pending
- 2002-04-24 CA CA002444766A patent/CA2444766C/en not_active Expired - Fee Related
-
2003
- 2003-10-23 NO NO20034750A patent/NO20034750L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004533316A (ja) | 2004-11-04 |
| KR20040007516A (ko) | 2004-01-24 |
| PT1253216E (pt) | 2004-04-30 |
| ES2208530T3 (es) | 2004-06-16 |
| WO2002088420A1 (en) | 2002-11-07 |
| CA2444766A1 (en) | 2002-11-07 |
| DE60101209D1 (de) | 2003-12-18 |
| EP1253216A1 (de) | 2002-10-30 |
| TW593464B (en) | 2004-06-21 |
| US20040154541A1 (en) | 2004-08-12 |
| CA2444766C (en) | 2009-07-14 |
| NO20034750D0 (no) | 2003-10-23 |
| DK1253216T3 (da) | 2004-03-22 |
| DE60101209T2 (de) | 2004-09-02 |
| EP1253216B1 (de) | 2003-11-12 |
| US7618686B2 (en) | 2009-11-17 |
| NO20034750L (no) | 2003-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1253216 Country of ref document: EP |
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| EEFA | Change of the company name |