ATE254192T1 - Verfahren und vorrichtung zur sequentiellen plasmabehandlung - Google Patents

Verfahren und vorrichtung zur sequentiellen plasmabehandlung

Info

Publication number
ATE254192T1
ATE254192T1 AT01401101T AT01401101T ATE254192T1 AT E254192 T1 ATE254192 T1 AT E254192T1 AT 01401101 T AT01401101 T AT 01401101T AT 01401101 T AT01401101 T AT 01401101T AT E254192 T1 ATE254192 T1 AT E254192T1
Authority
AT
Austria
Prior art keywords
plasma treatment
ionisation energy
substrate
energy sources
sources
Prior art date
Application number
AT01401101T
Other languages
English (en)
Inventor
Pascal Colpo
Francois Rossi
Original Assignee
Europ Economic Community
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europ Economic Community filed Critical Europ Economic Community
Application granted granted Critical
Publication of ATE254192T1 publication Critical patent/ATE254192T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32394—Treating interior parts of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Radiation-Therapy Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
AT01401101T 2001-04-27 2001-04-27 Verfahren und vorrichtung zur sequentiellen plasmabehandlung ATE254192T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01401101A EP1253216B1 (de) 2001-04-27 2001-04-27 Verfahren und Vorrichtung zur sequentiellen Plasmabehandlung

Publications (1)

Publication Number Publication Date
ATE254192T1 true ATE254192T1 (de) 2003-11-15

Family

ID=8182707

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01401101T ATE254192T1 (de) 2001-04-27 2001-04-27 Verfahren und vorrichtung zur sequentiellen plasmabehandlung

Country Status (13)

Country Link
US (1) US7618686B2 (de)
EP (1) EP1253216B1 (de)
JP (1) JP2004533316A (de)
KR (1) KR20040007516A (de)
AT (1) ATE254192T1 (de)
CA (1) CA2444766C (de)
DE (1) DE60101209T2 (de)
DK (1) DK1253216T3 (de)
ES (1) ES2208530T3 (de)
NO (1) NO20034750L (de)
PT (1) PT1253216E (de)
TW (1) TW593464B (de)
WO (1) WO2002088420A1 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358505B4 (de) * 2003-12-13 2007-10-11 Roth & Rau Ag Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas
EP1662546A1 (de) * 2004-11-25 2006-05-31 The European Community, represented by the European Commission Induktiv gekoppelte Plasmabearbeitungsvorrichtung
JP4682917B2 (ja) * 2006-05-30 2011-05-11 パナソニック株式会社 大気圧プラズマ発生方法及び装置
JP4682946B2 (ja) * 2006-07-25 2011-05-11 パナソニック株式会社 プラズマ処理方法及び装置
TW200816880A (en) 2006-05-30 2008-04-01 Matsushita Electric Industrial Co Ltd Atmospheric pressure plasma generating method, plasma processing method and component mounting method using same, and device using these methods
DE102007035403A1 (de) * 2007-07-26 2009-01-29 Linde Ag Verfahren zum thermischen Trennen
MX345403B (es) 2009-05-13 2017-01-30 Sio2 Medical Products Inc Revestimiento por pecvd utilizando un precursor organosilícico.
US9545360B2 (en) 2009-05-13 2017-01-17 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
JP5429124B2 (ja) * 2010-09-29 2014-02-26 パナソニック株式会社 プラズマ処理方法及び装置
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US9554968B2 (en) 2013-03-11 2017-01-31 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2776603B1 (de) 2011-11-11 2019-03-06 SiO2 Medical Products, Inc. Passivierungs-, ph-schutz- oder schmierbeschichtung für arzneimittelverpackung, beschichtungsverfahren und vorrichtung
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
DE102012109251A1 (de) * 2012-09-28 2014-04-03 Osram Gmbh Vorrichtung und Verfahren zur Beschichtung von Substraten
CA2890066C (en) 2012-11-01 2021-11-09 Sio2 Medical Products, Inc. Coating inspection method
JP6093552B2 (ja) * 2012-11-08 2017-03-08 日精エー・エス・ビー機械株式会社 樹脂容器用コーティング装置
US9903782B2 (en) 2012-11-16 2018-02-27 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
KR102211950B1 (ko) 2012-11-30 2021-02-04 에스아이오2 메디컬 프로덕츠, 인크. 의료용 주사기 카트리지 등의 pecvd 증착 균일성 제어
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
CN103037609B (zh) * 2013-01-10 2014-12-31 哈尔滨工业大学 射流等离子体电子能量调节器
CN103060778B (zh) * 2013-01-23 2015-03-11 深圳市劲拓自动化设备股份有限公司 平板式pecvd装置
US20160015898A1 (en) 2013-03-01 2016-01-21 Sio2 Medical Products, Inc. Plasma or cvd pre-treatment for lubricated pharmaceutical package, coating process and apparatus
WO2014171597A1 (ko) 2013-04-15 2014-10-23 (주)플렉센스 나노 입자 어레이의 제조 방법, 표면 플라즈몬 공명 기반의 센서, 및 이를 이용한 분석 방법
US10060851B2 (en) 2013-03-05 2018-08-28 Plexense, Inc. Surface plasmon detection apparatuses and methods
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
US9863042B2 (en) 2013-03-15 2018-01-09 Sio2 Medical Products, Inc. PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases
US11066745B2 (en) 2014-03-28 2021-07-20 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
JP6441500B2 (ja) * 2014-12-15 2018-12-19 プレクセンス・インコーポレイテッド 表面プラズモン検出装置及び方法
CN108138316A (zh) 2015-08-18 2018-06-08 Sio2医药产品公司 具有低氧气传输速率的药物和其他包装
US20170316921A1 (en) * 2016-04-29 2017-11-02 Retro-Semi Technologies, Llc Vhf z-coil plasma source
US10510575B2 (en) 2017-09-20 2019-12-17 Applied Materials, Inc. Substrate support with multiple embedded electrodes
US10555412B2 (en) 2018-05-10 2020-02-04 Applied Materials, Inc. Method of controlling ion energy distribution using a pulse generator with a current-return output stage
US11476145B2 (en) 2018-11-20 2022-10-18 Applied Materials, Inc. Automatic ESC bias compensation when using pulsed DC bias
KR20250100790A (ko) 2019-01-22 2025-07-03 어플라이드 머티어리얼스, 인코포레이티드 펄스 전압 파형을 제어하기 위한 피드백 루프
US11508554B2 (en) 2019-01-24 2022-11-22 Applied Materials, Inc. High voltage filter assembly
US11848176B2 (en) 2020-07-31 2023-12-19 Applied Materials, Inc. Plasma processing using pulsed-voltage and radio-frequency power
US11798790B2 (en) 2020-11-16 2023-10-24 Applied Materials, Inc. Apparatus and methods for controlling ion energy distribution
US11901157B2 (en) 2020-11-16 2024-02-13 Applied Materials, Inc. Apparatus and methods for controlling ion energy distribution
US11495470B1 (en) 2021-04-16 2022-11-08 Applied Materials, Inc. Method of enhancing etching selectivity using a pulsed plasma
US11791138B2 (en) 2021-05-12 2023-10-17 Applied Materials, Inc. Automatic electrostatic chuck bias compensation during plasma processing
US11948780B2 (en) 2021-05-12 2024-04-02 Applied Materials, Inc. Automatic electrostatic chuck bias compensation during plasma processing
WO2022240919A1 (en) 2021-05-14 2022-11-17 Eli Lilly And Company Systems and methods for igniting plasma within tubes
US11967483B2 (en) 2021-06-02 2024-04-23 Applied Materials, Inc. Plasma excitation with ion energy control
US20220399186A1 (en) 2021-06-09 2022-12-15 Applied Materials, Inc. Method and apparatus to reduce feature charging in plasma processing chamber
US12525441B2 (en) 2021-06-09 2026-01-13 Applied Materials, Inc. Plasma chamber and chamber component cleaning methods
US12394596B2 (en) 2021-06-09 2025-08-19 Applied Materials, Inc. Plasma uniformity control in pulsed DC plasma chamber
US11810760B2 (en) 2021-06-16 2023-11-07 Applied Materials, Inc. Apparatus and method of ion current compensation
US11569066B2 (en) 2021-06-23 2023-01-31 Applied Materials, Inc. Pulsed voltage source for plasma processing applications
US11776788B2 (en) 2021-06-28 2023-10-03 Applied Materials, Inc. Pulsed voltage boost for substrate processing
US11476090B1 (en) 2021-08-24 2022-10-18 Applied Materials, Inc. Voltage pulse time-domain multiplexing
US12106938B2 (en) 2021-09-14 2024-10-01 Applied Materials, Inc. Distortion current mitigation in a radio frequency plasma processing chamber
US11694876B2 (en) 2021-12-08 2023-07-04 Applied Materials, Inc. Apparatus and method for delivering a plurality of waveform signals during plasma processing
US11972924B2 (en) 2022-06-08 2024-04-30 Applied Materials, Inc. Pulsed voltage source for plasma processing applications
US12315732B2 (en) 2022-06-10 2025-05-27 Applied Materials, Inc. Method and apparatus for etching a semiconductor substrate in a plasma etch chamber
US12586768B2 (en) 2022-08-10 2026-03-24 Applied Materials, Inc. Pulsed voltage compensation for plasma processing applications
US12272524B2 (en) 2022-09-19 2025-04-08 Applied Materials, Inc. Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics
US12111341B2 (en) 2022-10-05 2024-10-08 Applied Materials, Inc. In-situ electric field detection method and apparatus
US12683123B2 (en) 2023-12-11 2026-07-14 Applied Materials, Inc. Pulsed voltage waveform biasing of plasma

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1603949A (en) * 1978-05-30 1981-12-02 Standard Telephones Cables Ltd Plasma deposit
US4692347A (en) * 1983-07-07 1987-09-08 The Curators Of The University Of Missouri Method of interiorly coating tubing
EP0154483B1 (de) * 1984-03-03 1989-12-27 Stc Plc Pulsierendes Plasmaverfahren
US4879140A (en) * 1988-11-21 1989-11-07 Deposition Sciences, Inc. Method for making pigment flakes
US5434395A (en) * 1990-03-05 1995-07-18 Jean-Rene Storck Method and device for effecting a transaction between a first and at least one second data carrier and carrier used for this purpose
DE4034211C1 (en) * 1990-10-27 1991-11-14 Schott Glaswerke, 6500 Mainz, De Coating interior of pipe-glass tube - comprises coupling HF energy to tube using resonator to deliver pulsed microwave discharges
AU5914994A (en) * 1993-04-21 1994-10-27 Bend Research, Inc. Plasma polymerization and surface modification inside hollow micro-substrates
US6022602A (en) * 1994-01-26 2000-02-08 Neomecs Incorporated Plasma modification of lumen surface of tubing
US5593550A (en) * 1994-05-06 1997-01-14 Medtronic, Inc. Plasma process for reducing friction within the lumen of polymeric tubing
US5521351A (en) * 1994-08-30 1996-05-28 Wisconsin Alumni Research Foundation Method and apparatus for plasma surface treatment of the interior of hollow forms
DE4437050A1 (de) * 1994-10-17 1996-04-18 Leybold Ag Vorrichtung zum Behandeln von Oberflächen von Hohlkörpern, insbesondere von Innenflächen von Kraftstofftanks
US5653811A (en) * 1995-07-19 1997-08-05 Chan; Chung System for the plasma treatment of large area substrates
US5907221A (en) * 1995-08-16 1999-05-25 Applied Materials, Inc. Inductively coupled plasma reactor with an inductive coil antenna having independent loops
DE19634795C2 (de) * 1996-08-29 1999-11-04 Schott Glas Plasma-CVD-Anlage mit einem Array von Mikrowellen-Plasmaelektroden und Plasma-CVD-Verfahren
DE19643865C2 (de) * 1996-10-30 1999-04-08 Schott Glas Plasmaunterstütztes chemisches Abscheidungsverfahren (CVD) mit entfernter Anregung eines Anregungsgases (Remote-Plasma-CVD-Verfahren) zur Beschichtung oder zur Behandlung großflächiger Substrate und Vorrichtung zur Durchführung desselben
WO1998037259A1 (en) * 1997-02-19 1998-08-27 Kirin Beer Kabushiki Kaisha Method and apparatus for producing plastic container having carbon film coating
JP3072269B2 (ja) * 1997-02-19 2000-07-31 麒麟麦酒株式会社 炭素膜コーティングプラスチック容器の製造装置および製造方法
US6051073A (en) * 1998-02-11 2000-04-18 Silicon Genesis Corporation Perforated shield for plasma immersion ion implantation
JP3698887B2 (ja) * 1998-03-16 2005-09-21 株式会社アルバック ダイヤモンド状炭素膜の製造装置
ES2320501T3 (es) * 1999-09-29 2009-05-22 European Community Distribucion uniforme de gas en un dispositivo de tratamiento con plasma de zona grande.
EP1126504A1 (de) * 2000-02-18 2001-08-22 European Community Verfahren und Gerät zur induktivgekoppelter Plasmabehandlung

Also Published As

Publication number Publication date
DE60101209D1 (de) 2003-12-18
DE60101209T2 (de) 2004-09-02
US7618686B2 (en) 2009-11-17
TW593464B (en) 2004-06-21
EP1253216B1 (de) 2003-11-12
NO20034750L (no) 2003-12-22
EP1253216A1 (de) 2002-10-30
PT1253216E (pt) 2004-04-30
NO20034750D0 (no) 2003-10-23
ES2208530T3 (es) 2004-06-16
US20040154541A1 (en) 2004-08-12
CA2444766C (en) 2009-07-14
DK1253216T3 (da) 2004-03-22
WO2002088420A1 (en) 2002-11-07
KR20040007516A (ko) 2004-01-24
CA2444766A1 (en) 2002-11-07
JP2004533316A (ja) 2004-11-04

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