ATE255962T1 - Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücks - Google Patents

Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücks

Info

Publication number
ATE255962T1
ATE255962T1 AT99912558T AT99912558T ATE255962T1 AT E255962 T1 ATE255962 T1 AT E255962T1 AT 99912558 T AT99912558 T AT 99912558T AT 99912558 T AT99912558 T AT 99912558T AT E255962 T1 ATE255962 T1 AT E255962T1
Authority
AT
Austria
Prior art keywords
workpiece
processing
reactor
housing
microelectronic workpiece
Prior art date
Application number
AT99912558T
Other languages
English (en)
Inventor
Gary L Curtis
Raymon F Thompson
Steven L Peace
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/041,649 external-priority patent/US6318385B1/en
Priority claimed from US09/041,901 external-priority patent/US6350319B1/en
Priority claimed from US09/113,435 external-priority patent/US6264752B1/en
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of ATE255962T1 publication Critical patent/ATE255962T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/66—Wet etching of conductive or resistive materials
    • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
    • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
AT99912558T 1998-03-13 1999-03-15 Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücks ATE255962T1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US09/041,649 US6318385B1 (en) 1998-03-13 1998-03-13 Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US09/041,901 US6350319B1 (en) 1998-03-13 1998-03-13 Micro-environment reactor for processing a workpiece
US09/113,435 US6264752B1 (en) 1998-03-13 1998-07-10 Reactor for processing a microelectronic workpiece
US11675099P 1999-01-22 1999-01-22
US11747499P 1999-01-27 1999-01-27
PCT/US1999/005676 WO1999046065A1 (en) 1998-03-13 1999-03-15 Micro-environment reactor for processing a microelectronic workpiece

Publications (1)

Publication Number Publication Date
ATE255962T1 true ATE255962T1 (de) 2003-12-15

Family

ID=27534766

Family Applications (2)

Application Number Title Priority Date Filing Date
AT99912558T ATE255962T1 (de) 1998-03-13 1999-03-15 Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücks
AT99912557T ATE299402T1 (de) 1998-03-13 1999-03-15 Selektive behandlung der oberfläche eines mikroelektronischen werkstücks

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT99912557T ATE299402T1 (de) 1998-03-13 1999-03-15 Selektive behandlung der oberfläche eines mikroelektronischen werkstücks

Country Status (8)

Country Link
EP (2) EP1091811B8 (de)
JP (2) JP2002506294A (de)
KR (1) KR100555258B1 (de)
CN (2) CN1167518C (de)
AT (2) ATE255962T1 (de)
DE (2) DE69926127T2 (de)
TW (2) TW452828B (de)
WO (2) WO1999046065A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
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US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6900132B2 (en) 1998-03-13 2005-05-31 Semitool, Inc. Single workpiece processing system
US6423642B1 (en) * 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6930046B2 (en) 1999-01-22 2005-08-16 Semitool, Inc. Single workpiece processing system
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6969682B2 (en) 1999-01-22 2005-11-29 Semitool, Inc. Single workpiece processing system
US7217325B2 (en) 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
JP3395696B2 (ja) 1999-03-15 2003-04-14 日本電気株式会社 ウェハ処理装置およびウェハ処理方法
FI118342B (fi) * 1999-05-10 2007-10-15 Asm Int Laite ohutkalvojen valmistamiseksi
US7780867B1 (en) 1999-10-01 2010-08-24 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
US6423636B1 (en) * 1999-11-19 2002-07-23 Applied Materials, Inc. Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
JP2001319849A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
US6991710B2 (en) 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US8100081B1 (en) 2006-06-30 2012-01-24 Novellus Systems, Inc. Edge removal of films using externally generated plasma species
US9732416B1 (en) 2007-04-18 2017-08-15 Novellus Systems, Inc. Wafer chuck with aerodynamic design for turbulence reduction
WO2008143476A1 (en) * 2007-05-23 2008-11-27 Semes Co., Ltd. Apparatus and method for drying substrates
JP5705723B2 (ja) * 2008-05-09 2015-04-22 テル エフエスアイ インコーポレイテッド 操作において開モードと閉モードとの切り替えを簡単に行う加工チェンバ設計を用いてマイクロ電子加工品を加工するための道具および方法
US8419964B2 (en) 2008-08-27 2013-04-16 Novellus Systems, Inc. Apparatus and method for edge bevel removal of copper from silicon wafers
JP4864949B2 (ja) * 2008-09-12 2012-02-01 株式会社東芝 半導体装置の製造方法及び半導体製造装置
US8172646B2 (en) 2009-02-27 2012-05-08 Novellus Systems, Inc. Magnetically actuated chuck for edge bevel removal
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor
US8899246B2 (en) * 2011-11-23 2014-12-02 Lam Research Ag Device and method for processing wafer shaped articles
US9435025B2 (en) 2013-09-25 2016-09-06 Applied Materials, Inc. Gas apparatus, systems, and methods for chamber ports
DE102014017451A1 (de) * 2014-11-26 2016-06-02 Eisenmann Se Anlage zum Behandeln eines Guts
DE102015001246B3 (de) * 2015-01-31 2016-06-16 Audi Ag Reinigungsvorrichtung für eine mechanische Reinigung einer Gasdüse eines Schutzgas-Schweißbrenners
CN107497639B (zh) * 2017-09-27 2022-09-06 济南迈克阀门科技有限公司 一种阀盖浸塑工装

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US4838289A (en) * 1982-08-03 1989-06-13 Texas Instruments Incorporated Apparatus and method for edge cleaning
US4439244A (en) * 1982-08-03 1984-03-27 Texas Instruments Incorporated Apparatus and method of material removal having a fluid filled slot
US4439243A (en) * 1982-08-03 1984-03-27 Texas Instruments Incorporated Apparatus and method of material removal with fluid flow within a slot
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
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JPS62166515A (ja) * 1986-01-20 1987-07-23 Hitachi Electronics Eng Co Ltd 半導体製造装置の処理カツプ
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JPS63185029A (ja) * 1987-01-28 1988-07-30 Hitachi Ltd ウエハ処理装置
JPH01120023A (ja) * 1987-11-02 1989-05-12 Seiko Epson Corp スピン現像装置
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
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JPH0521332A (ja) * 1991-07-10 1993-01-29 Oki Electric Ind Co Ltd レジスト除去装置
JP2591555B2 (ja) * 1991-12-20 1997-03-19 東京応化工業株式会社 塗布装置
DE4202194C2 (de) * 1992-01-28 1996-09-19 Fairchild Convac Gmbh Geraete Verfahren und Vorrichtung zum partiellen Entfernen von dünnen Schichten von einem Substrat
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JPH05326483A (ja) * 1992-05-15 1993-12-10 Sony Corp ウエハ処理装置およびウエハ一貫処理装置
JP2654314B2 (ja) * 1992-06-04 1997-09-17 東京応化工業株式会社 裏面洗浄装置
JP3030796B2 (ja) * 1992-07-24 2000-04-10 東京エレクトロン株式会社 洗浄処理方法
US5474807A (en) * 1992-09-30 1995-12-12 Hoya Corporation Method for applying or removing coatings at a confined peripheral region of a substrate
JP3388628B2 (ja) * 1994-03-24 2003-03-24 東京応化工業株式会社 回転式薬液処理装置
KR100284559B1 (ko) * 1994-04-04 2001-04-02 다카시마 히로시 처리방법 및 처리장치
JP3521587B2 (ja) * 1995-02-07 2004-04-19 セイコーエプソン株式会社 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法
JPH09181026A (ja) * 1995-12-25 1997-07-11 Toshiba Corp 半導体装置の製造装置
JPH104076A (ja) * 1996-06-15 1998-01-06 Sony Corp 枚葉型ウエハ洗浄装置
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Also Published As

Publication number Publication date
KR20010052209A (ko) 2001-06-25
TW452828B (en) 2001-09-01
JP2003517364A (ja) 2003-05-27
TW471059B (en) 2002-01-01
EP1091811A1 (de) 2001-04-18
EP1091811B8 (de) 2005-12-07
ATE299402T1 (de) 2005-07-15
DE69926127D1 (de) 2005-08-18
EP1091811B1 (de) 2005-07-13
JP2002506294A (ja) 2002-02-26
DE69913521D1 (de) 2004-01-22
CN1292736A (zh) 2001-04-25
EP1085948A1 (de) 2001-03-28
WO1999046065A1 (en) 1999-09-16
EP1085948A4 (de) 2002-01-23
EP1085948B1 (de) 2003-12-10
WO1999046064A1 (en) 1999-09-16
JP4189125B2 (ja) 2008-12-03
CN100342487C (zh) 2007-10-10
DE69926127T2 (de) 2006-05-11
CN1167518C (zh) 2004-09-22
DE69913521T2 (de) 2004-10-14
EP1091811A4 (de) 2002-01-30
KR100555258B1 (ko) 2006-03-03
CN1599025A (zh) 2005-03-23

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