ATE259276T1 - Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe - Google Patents

Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe

Info

Publication number
ATE259276T1
ATE259276T1 AT00954098T AT00954098T ATE259276T1 AT E259276 T1 ATE259276 T1 AT E259276T1 AT 00954098 T AT00954098 T AT 00954098T AT 00954098 T AT00954098 T AT 00954098T AT E259276 T1 ATE259276 T1 AT E259276T1
Authority
AT
Austria
Prior art keywords
polishing belt
site monitoring
semiconductor disc
windowless
belt
Prior art date
Application number
AT00954098T
Other languages
English (en)
Inventor
Cangshan Xu
Brian S Lombardo
Rajeev Bajaj
Rahul K Surana
Original Assignee
Lam Res Corp
Scapa Group Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp, Scapa Group Plc filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE259276T1 publication Critical patent/ATE259276T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AT00954098T 1999-08-31 2000-08-16 Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe ATE259276T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/386,745 US20020090819A1 (en) 1999-08-31 1999-08-31 Windowless belt and method for improved in-situ wafer monitoring
PCT/US2000/022429 WO2001015863A1 (en) 1999-08-31 2000-08-16 Windowless belt and method for in-situ wafer monitoring

Publications (1)

Publication Number Publication Date
ATE259276T1 true ATE259276T1 (de) 2004-02-15

Family

ID=23526875

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00954098T ATE259276T1 (de) 1999-08-31 2000-08-16 Fensterloses polierband und verfahren zum vor-ort überwachen einer halbleiterscheibe

Country Status (8)

Country Link
US (1) US20020090819A1 (de)
EP (1) EP1214174B1 (de)
JP (1) JP2003521811A (de)
KR (1) KR20020038740A (de)
AT (1) ATE259276T1 (de)
DE (1) DE60008259T2 (de)
TW (1) TW474849B (de)
WO (1) WO2001015863A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020086707A (ko) * 2000-03-31 2002-11-18 램 리서치 코포레이션 고정연마제 선형 연마벨트 및 그것을 이용하는 시스템
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6612902B1 (en) 2001-03-29 2003-09-02 Lam Research Corporation Method and apparatus for end point triggering with integrated steering
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US8439723B2 (en) * 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
DE102009040964A1 (de) * 2009-09-11 2011-03-24 Sgl Carbon Se Seil
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
CN108555738B (zh) * 2018-07-04 2023-11-24 苏州市相城区宏达电子有限公司 一种金属材料定向打磨装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6736714B2 (en) * 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers

Also Published As

Publication number Publication date
KR20020038740A (ko) 2002-05-23
JP2003521811A (ja) 2003-07-15
WO2001015863A1 (en) 2001-03-08
EP1214174A1 (de) 2002-06-19
DE60008259D1 (de) 2004-03-18
TW474849B (en) 2002-02-01
US20020090819A1 (en) 2002-07-11
EP1214174B1 (de) 2004-02-11
DE60008259T2 (de) 2005-04-14

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