ATE259869T1 - Aufschlämmungszusammensetzung und verfahren zum chemisch-mechanischen polieren - Google Patents

Aufschlämmungszusammensetzung und verfahren zum chemisch-mechanischen polieren

Info

Publication number
ATE259869T1
ATE259869T1 AT00930248T AT00930248T ATE259869T1 AT E259869 T1 ATE259869 T1 AT E259869T1 AT 00930248 T AT00930248 T AT 00930248T AT 00930248 T AT00930248 T AT 00930248T AT E259869 T1 ATE259869 T1 AT E259869T1
Authority
AT
Austria
Prior art keywords
mechanical polishing
present
particles
slurry composition
chemical
Prior art date
Application number
AT00930248T
Other languages
English (en)
Inventor
Robert James Small
Maria Louise Peterson
Tuan Troung
Lionel Bonneau
Jean Claude Drouget
Original Assignee
Ekc Technology Inc
Baikowski Chimie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekc Technology Inc, Baikowski Chimie filed Critical Ekc Technology Inc
Application granted granted Critical
Publication of ATE259869T1 publication Critical patent/ATE259869T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C09K3/1427—Abrasive particles per se obtained by division of a mass agglomerated by melting, at least partially, e.g. with a binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT00930248T 1999-05-27 2000-05-01 Aufschlämmungszusammensetzung und verfahren zum chemisch-mechanischen polieren ATE259869T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/321,036 US6251150B1 (en) 1999-05-27 1999-05-27 Slurry composition and method of chemical mechanical polishing using same
PCT/US2000/011675 WO2000073396A1 (en) 1999-05-27 2000-05-01 Slurry composition and method of chemical mechanical polishing using same

Publications (1)

Publication Number Publication Date
ATE259869T1 true ATE259869T1 (de) 2004-03-15

Family

ID=23248903

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00930248T ATE259869T1 (de) 1999-05-27 2000-05-01 Aufschlämmungszusammensetzung und verfahren zum chemisch-mechanischen polieren

Country Status (10)

Country Link
US (1) US6251150B1 (de)
EP (1) EP1190006B1 (de)
JP (1) JP3616802B2 (de)
KR (1) KR100475690B1 (de)
AT (1) ATE259869T1 (de)
AU (1) AU4810200A (de)
DE (1) DE60008376T2 (de)
HK (1) HK1042723B (de)
TW (1) TWI262939B (de)
WO (1) WO2000073396A1 (de)

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US20040134873A1 (en) * 1996-07-25 2004-07-15 Li Yao Abrasive-free chemical mechanical polishing composition and polishing process containing same
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US6361712B1 (en) * 1999-10-15 2002-03-26 Arch Specialty Chemicals, Inc. Composition for selective etching of oxides over metals
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US6521523B2 (en) * 2001-06-15 2003-02-18 Silicon Integrated Systems Corp. Method for forming selective protection layers on copper interconnects
US6812193B2 (en) 2001-08-31 2004-11-02 International Business Machines Corporation Slurry for mechanical polishing (CMP) of metals and use thereof
US6589100B2 (en) * 2001-09-24 2003-07-08 Cabot Microelectronics Corporation Rare earth salt/oxidizer-based CMP method
DE10149130A1 (de) * 2001-10-05 2003-04-10 Degussa Flammenhydrolytisch hergestelltes, mit zweiwertigen Metalloxiden dotiertes Aluminiumoxid und wässerige Dispersion hiervon
US7416680B2 (en) * 2001-10-12 2008-08-26 International Business Machines Corporation Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
US20030077983A1 (en) * 2001-10-12 2003-04-24 International Business Machines Corporation Cleaning polish etch composition and process for a superfinished surface of a substrate
US7077880B2 (en) * 2004-01-16 2006-07-18 Dupont Air Products Nanomaterials Llc Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
US20030139069A1 (en) * 2001-12-06 2003-07-24 Block Kelly H. Planarization of silicon carbide hardmask material
US6866792B2 (en) * 2001-12-12 2005-03-15 Ekc Technology, Inc. Compositions for chemical mechanical planarization of copper
KR100445759B1 (ko) * 2001-12-28 2004-08-25 제일모직주식회사 금속배선 연마용 슬러리 조성물
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US7513920B2 (en) * 2002-02-11 2009-04-07 Dupont Air Products Nanomaterials Llc Free radical-forming activator attached to solid and used to enhance CMP formulations
JP2004193495A (ja) * 2002-12-13 2004-07-08 Toshiba Corp 化学的機械的研磨用スラリーおよびこれを用いた半導体装置の製造方法
US20040216388A1 (en) * 2003-03-17 2004-11-04 Sharad Mathur Slurry compositions for use in a chemical-mechanical planarization process
US20040217006A1 (en) * 2003-03-18 2004-11-04 Small Robert J. Residue removers for electrohydrodynamic cleaning of semiconductors
US20050045852A1 (en) * 2003-08-29 2005-03-03 Ameen Joseph G. Particle-free polishing fluid for nickel-based coating planarization
US7344988B2 (en) * 2003-10-27 2008-03-18 Dupont Air Products Nanomaterials Llc Alumina abrasive for chemical mechanical polishing
US20050126588A1 (en) * 2003-11-04 2005-06-16 Carter Melvin K. Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor
US7419911B2 (en) * 2003-11-10 2008-09-02 Ekc Technology, Inc. Compositions and methods for rapidly removing overfilled substrates
US7161247B2 (en) * 2004-07-28 2007-01-09 Cabot Microelectronics Corporation Polishing composition for noble metals
US8038752B2 (en) * 2004-10-27 2011-10-18 Cabot Microelectronics Corporation Metal ion-containing CMP composition and method for using the same
US7208325B2 (en) * 2005-01-18 2007-04-24 Applied Materials, Inc. Refreshing wafers having low-k dielectric materials
TWI327761B (en) * 2005-10-07 2010-07-21 Rohm & Haas Elect Mat Method for making semiconductor wafer and wafer holding article
DE602006015503D1 (en) 2005-10-12 2010-08-26 Kohler Co Luftreinigeranordnung
US8157877B2 (en) 2005-12-16 2012-04-17 Jsr Corporation Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
DE102006032582A1 (de) * 2006-07-13 2008-01-24 Clariant International Limited Verfahren zur Herstellung von Nanopartikeln aus Aluminiumspinellen und deren Anwendung
US7837888B2 (en) 2006-11-13 2010-11-23 Cabot Microelectronics Corporation Composition and method for damascene CMP
US8808432B2 (en) 2008-06-13 2014-08-19 Kohler Co. Cyclonic air cleaner
USD632770S1 (en) 2008-06-13 2011-02-15 Kohler Co. Cyclonic air cleaner housing
FR2943333B1 (fr) 2009-03-20 2011-08-05 Baikowski Alumine, luminophores et composes mixtes ainsi que procedes de preparation associes
RU2441048C1 (ru) * 2010-06-16 2012-01-27 Игорь Олегович Белогрудов Доводочно-притирочная паста с минеральными наполнителями
US10442055B2 (en) * 2016-02-18 2019-10-15 Iowa State University Research Foundation, Inc. Lubricated mechanical polishing
JP7398304B2 (ja) * 2020-03-19 2023-12-14 株式会社フジミインコーポレーテッド 研磨用組成物、研磨方法および半導体基板の製造方法

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US5080718A (en) * 1989-02-23 1992-01-14 Engelhard Corporation Inorganic pigments of the empirical formula Ax By Cz
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US5139570A (en) * 1991-04-24 1992-08-18 Revlon, Inc. Nail stain remover
US5387268A (en) 1991-10-16 1995-02-07 Showa Denko Kabushiki Kaisha Sintered alumina abrasive grain and abrasive products
US5282898A (en) * 1992-06-12 1994-02-01 Engelhard Corporation Use of surfactants in processing abrasive pigments
DE4223598A1 (de) * 1992-07-17 1994-01-20 Bayer Ag Verfahren zum Einfärben von Baustoffen
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US5993686A (en) * 1996-06-06 1999-11-30 Cabot Corporation Fluoride additive containing chemical mechanical polishing slurry and method for use of same
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KR19980024187A (ko) 1996-09-03 1998-07-06 고사이 아키오 반도체 기판상의 금속막을 연마하기 위한 연마용 조성물 및 이의 용도
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Also Published As

Publication number Publication date
US6251150B1 (en) 2001-06-26
KR20020012246A (ko) 2002-02-15
HK1042723B (en) 2004-10-08
WO2000073396A9 (en) 2002-07-11
EP1190006A1 (de) 2002-03-27
HK1042723A1 (en) 2002-08-23
AU4810200A (en) 2000-12-18
DE60008376D1 (de) 2004-03-25
EP1190006B1 (de) 2004-02-18
TWI262939B (en) 2006-10-01
DE60008376T2 (de) 2004-12-09
KR100475690B1 (ko) 2005-03-10
JP3616802B2 (ja) 2005-02-02
WO2000073396A1 (en) 2000-12-07
JP2003501817A (ja) 2003-01-14

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