ATE269630T1 - Trennfolien aus stahllegierung und kupfer/stahl- verbundfolien zur anwendung in der herstellung von leiterplatten - Google Patents

Trennfolien aus stahllegierung und kupfer/stahl- verbundfolien zur anwendung in der herstellung von leiterplatten

Info

Publication number
ATE269630T1
ATE269630T1 AT99916559T AT99916559T ATE269630T1 AT E269630 T1 ATE269630 T1 AT E269630T1 AT 99916559 T AT99916559 T AT 99916559T AT 99916559 T AT99916559 T AT 99916559T AT E269630 T1 ATE269630 T1 AT E269630T1
Authority
AT
Austria
Prior art keywords
steel alloy
copper
steel
production
layer
Prior art date
Application number
AT99916559T
Other languages
English (en)
Inventor
Mark S Frater
Original Assignee
R E Service Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/058,262 external-priority patent/US6129998A/en
Priority claimed from US09/182,956 external-priority patent/US6127051A/en
Priority claimed from US09/193,461 external-priority patent/US6129990A/en
Application filed by R E Service Company Inc filed Critical R E Service Company Inc
Application granted granted Critical
Publication of ATE269630T1 publication Critical patent/ATE269630T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
AT99916559T 1998-04-10 1999-04-09 Trennfolien aus stahllegierung und kupfer/stahl- verbundfolien zur anwendung in der herstellung von leiterplatten ATE269630T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/058,262 US6129998A (en) 1998-04-10 1998-04-10 Copper/steel laminated sheet for use in manufacturing printed circuit boards
US09/182,956 US6127051A (en) 1998-04-10 1998-10-29 Copper/steel laminated sheet for use in manufacturing printed circuit boards
US09/193,461 US6129990A (en) 1998-04-10 1998-11-17 Copper/steel laminated sheet for use in manufacturing printed circuit boards
US09/210,349 US6130000A (en) 1998-04-10 1998-12-11 Copper and steel components for use in manufacturing printed circuit boards
PCT/US1999/007795 WO1999053737A1 (en) 1998-04-10 1999-04-09 Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards

Publications (1)

Publication Number Publication Date
ATE269630T1 true ATE269630T1 (de) 2004-07-15

Family

ID=27489958

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99916559T ATE269630T1 (de) 1998-04-10 1999-04-09 Trennfolien aus stahllegierung und kupfer/stahl- verbundfolien zur anwendung in der herstellung von leiterplatten

Country Status (7)

Country Link
EP (1) EP1070443B1 (de)
JP (1) JP2002511663A (de)
AT (1) ATE269630T1 (de)
AU (1) AU3485699A (de)
DE (1) DE69918086T2 (de)
TW (1) TW407440B (de)
WO (1) WO1999053737A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6955740B2 (en) 2002-01-10 2005-10-18 Polyclad Laminates, Inc. Production of laminates for printed wiring boards using protective carrier
AT411893B (de) * 2002-12-27 2004-07-26 C2C Technologie Fuer Leiterpla Trennplatte zum herstellen von leiterplattenkomponenten
CN117177461B (zh) * 2023-09-28 2025-07-04 威科电子模块（深圳）有限公司 一种厚膜电路板的印刷工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765048A1 (de) * 1968-03-26 1971-07-01 Siemens Ag Verfahren zum Kontaktieren von Stromtraegern aus Aluminium
JP2556897B2 (ja) * 1989-02-23 1996-11-27 ファナック株式会社 多層プリント配線板の外層材及び製造方法
DE4116543C2 (de) * 1991-05-21 1995-07-27 Siemens Nixdorf Inf Syst Verfahren zum Verpressen von mehrlagigen Leiterplatten
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5942314A (en) * 1997-04-17 1999-08-24 Mitsui Mining & Smelting Co., Ltd. Ultrasonic welding of copper foil
DE29719716U1 (de) * 1997-11-06 1997-12-11 Carl Aug. Picard GmbH & Co. KG, 42857 Remscheid Trennblech

Also Published As

Publication number Publication date
EP1070443A1 (de) 2001-01-24
WO1999053737A1 (en) 1999-10-21
AU3485699A (en) 1999-11-01
JP2002511663A (ja) 2002-04-16
DE69918086D1 (de) 2004-07-22
EP1070443B1 (de) 2004-06-16
DE69918086T2 (de) 2005-07-07
TW407440B (en) 2000-10-01

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties