ATE270029T1 - Erdungsanschlusskontakt - Google Patents

Erdungsanschlusskontakt

Info

Publication number
ATE270029T1
ATE270029T1 AT99310479T AT99310479T ATE270029T1 AT E270029 T1 ATE270029 T1 AT E270029T1 AT 99310479 T AT99310479 T AT 99310479T AT 99310479 T AT99310479 T AT 99310479T AT E270029 T1 ATE270029 T1 AT E270029T1
Authority
AT
Austria
Prior art keywords
substrate part
ground terminal
earth ground
ground connection
connection contact
Prior art date
Application number
AT99310479T
Other languages
English (en)
Inventor
Izuru Kumagai
Original Assignee
Thomas & Betts Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas & Betts Int filed Critical Thomas & Betts Int
Application granted granted Critical
Publication of ATE270029T1 publication Critical patent/ATE270029T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Non-Reversible Transmitting Devices (AREA)
AT99310479T 1998-12-25 1999-12-23 Erdungsanschlusskontakt ATE270029T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10369267A JP2000195597A (ja) 1998-12-25 1998-12-25 ア―ス用端子

Publications (1)

Publication Number Publication Date
ATE270029T1 true ATE270029T1 (de) 2004-07-15

Family

ID=18493997

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99310479T ATE270029T1 (de) 1998-12-25 1999-12-23 Erdungsanschlusskontakt

Country Status (8)

Country Link
US (1) US6555742B2 (de)
EP (1) EP1014774B1 (de)
JP (1) JP2000195597A (de)
KR (1) KR20000048409A (de)
AT (1) ATE270029T1 (de)
CA (1) CA2293099C (de)
DE (1) DE69918254T2 (de)
TW (1) TW461636U (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408777B2 (ja) 2000-05-24 2003-05-19 Ｓｍｋ株式会社 端 子
JP3675719B2 (ja) * 2001-01-19 2005-07-27 日本電気株式会社 電子機器内部実装基板の低インピーダンス実装方法及び実装構造
JP5031423B2 (ja) * 2007-03-28 2012-09-19 三洋電機株式会社 実装基板
US8573328B1 (en) 2010-05-04 2013-11-05 Cameron West Coast Inc. Hydrocarbon well completion system and method of completing a hydrocarbon well
US10320164B2 (en) 2016-05-05 2019-06-11 Rxl, Inc. Grounding clip
CN111208334A (zh) * 2018-11-21 2020-05-29 臻驱科技（上海）有限公司 电流传感器
US11909154B1 (en) 2021-03-08 2024-02-20 Chatsworth Products, Inc. Endcap for establishing electrical bonding connection

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079681A (ja) 1983-09-28 1985-05-07 モレツクス・インコ−ポレ−テツド ヒンジ付電気コネクタ−
WO1987004892A1 (fr) 1986-02-06 1987-08-13 Fujitsu Limited Structure de mise a la terre d'une carte de circuits imprimes a noyau metallique
US4674811A (en) * 1986-07-10 1987-06-23 Honeywell Inc. Apparatus for connecting pin grid array devices to printed wiring boards
US5159826A (en) * 1990-07-19 1992-11-03 Hidaka Seiki Kabushiki Kaisha Die set for manufacturing fins of heat exchangers and a manufacturing device using the same
JPH05136578A (ja) 1991-11-15 1993-06-01 Toshiba Corp フレームグランド強化装置
JPH0546094U (ja) 1991-11-20 1993-06-18 富士通テン株式会社 アース構造
JPH0620730A (ja) 1992-07-06 1994-01-28 Hitachi Ltd アース金属板取付け構造
US5259769A (en) 1992-09-29 1993-11-09 Molex Incorporated Electrical connector with preloaded spring-like terminal with improved wiping action
US5470255A (en) 1993-03-23 1995-11-28 The Whitaker Corporation Extended height connector for a battery
TW243558B (de) 1993-03-23 1995-03-21 Whitaker Corp
TW270248B (de) 1993-11-17 1996-02-11 Whitaker Corp
JP3192570B2 (ja) 1995-04-04 2001-07-30 トーマス アンド ベッツ コーポレーション アース用端子
JP3085572B2 (ja) 1995-10-13 2000-09-11 エスエムケイ株式会社 接続用端子
US5709574A (en) * 1996-08-30 1998-01-20 Autosplice Systems Inc. Surface-mountable socket connector

Also Published As

Publication number Publication date
DE69918254D1 (de) 2004-07-29
CA2293099C (en) 2004-04-06
EP1014774B1 (de) 2004-06-23
US6555742B2 (en) 2003-04-29
KR20000048409A (ko) 2000-07-25
JP2000195597A (ja) 2000-07-14
US20020062969A1 (en) 2002-05-30
EP1014774A3 (de) 2001-03-14
EP1014774A2 (de) 2000-06-28
CA2293099A1 (en) 2000-06-25
DE69918254T2 (de) 2005-08-04
TW461636U (en) 2001-10-21

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties