ATE271259T1 - Elektronisches leistungselement mit kühlvorrichtung - Google Patents

Elektronisches leistungselement mit kühlvorrichtung

Info

Publication number
ATE271259T1
ATE271259T1 AT99402890T AT99402890T ATE271259T1 AT E271259 T1 ATE271259 T1 AT E271259T1 AT 99402890 T AT99402890 T AT 99402890T AT 99402890 T AT99402890 T AT 99402890T AT E271259 T1 ATE271259 T1 AT E271259T1
Authority
AT
Austria
Prior art keywords
cooling device
power element
electronic power
array
thermal transfer
Prior art date
Application number
AT99402890T
Other languages
English (en)
Inventor
Michel Mermet-Guyennet
Christian Schaeffer
Original Assignee
Alstom Holdings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom Holdings filed Critical Alstom Holdings
Application granted granted Critical
Publication of ATE271259T1 publication Critical patent/ATE271259T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Electric Motors In General (AREA)
AT99402890T 1998-11-27 1999-11-22 Elektronisches leistungselement mit kühlvorrichtung ATE271259T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9815155A FR2786656B1 (fr) 1998-11-27 1998-11-27 Composant electronique de puissance comportant des moyens de refroidissement

Publications (1)

Publication Number Publication Date
ATE271259T1 true ATE271259T1 (de) 2004-07-15

Family

ID=9533441

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99402890T ATE271259T1 (de) 1998-11-27 1999-11-22 Elektronisches leistungselement mit kühlvorrichtung

Country Status (13)

Country Link
US (1) US6344686B1 (de)
EP (1) EP1005083B1 (de)
JP (1) JP2000164780A (de)
KR (1) KR100603880B1 (de)
CN (1) CN1146041C (de)
AT (1) ATE271259T1 (de)
AU (1) AU755407B2 (de)
CA (1) CA2290802C (de)
DE (1) DE69918644T2 (de)
DK (1) DK1005083T3 (de)
ES (1) ES2222674T3 (de)
FR (1) FR2786656B1 (de)
PT (1) PT1005083E (de)

Families Citing this family (18)

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WO2001050526A1 (en) * 1999-12-30 2001-07-12 Intel Corporation Optimized driver layout for integrated circuits with staggered bond pads
US6773963B2 (en) * 2002-01-16 2004-08-10 Intel Corporation Apparatus and method for containing excess thermal interface material
US6903929B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders
JP4491244B2 (ja) * 2004-01-07 2010-06-30 三菱電機株式会社 電力半導体装置
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
JP4478049B2 (ja) * 2005-03-15 2010-06-09 三菱電機株式会社 半導体装置
DE102005050028A1 (de) 2005-10-14 2007-04-19 Robert Bosch Gmbh Elektrische Vorrichtung, insbesondere zur Ansteuerung einer motorisch und/oder generatorisch betreibbaren elektrischen Maschine
US20070158050A1 (en) * 2006-01-06 2007-07-12 Julian Norley Microchannel heat sink manufactured from graphite materials
US7973387B2 (en) 2007-06-08 2011-07-05 Continental Automotive Systems Us, Inc. Insulated gate bipolar transistor
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US8232637B2 (en) * 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
WO2012058105A1 (en) * 2010-10-28 2012-05-03 Spx Cooling Technologies, Inc. Heat exchanger fin, roll forming die assembly for forming same, and method of forming
JP5891707B2 (ja) * 2011-10-28 2016-03-23 富士通株式会社 半導体装置とその製造方法
KR101692490B1 (ko) 2015-08-11 2017-01-04 주식회사 세미파워렉스 액체냉각구조를 갖는 전력반도체 모듈
EP3410478A1 (de) * 2017-05-29 2018-12-05 Mitsubishi Electric R & D Centre Europe B.V. Leistungsmodul und verfahren zur herstellung des leistungsmoduls
KR102869892B1 (ko) 2023-11-20 2025-10-14 주식회사 세미파워렉스 일체형 냉각구조를 갖는 전력반도체모듈 및 그 제조방법

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US3663184A (en) * 1970-01-23 1972-05-16 Fairchild Camera Instr Co Solder bump metallization system using a titanium-nickel barrier layer
US3652903A (en) * 1971-02-01 1972-03-28 Gen Electric Fluid cooled pressure assembly
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
DE2813529A1 (de) * 1978-03-29 1979-10-04 Siemens Ag Anordnung zur beidseitigen kuehlung von halbleiterbauelementen
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4520305A (en) * 1983-08-17 1985-05-28 Cauchy Charles J Thermoelectric generating system
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4879629A (en) * 1988-10-31 1989-11-07 Unisys Corporation Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation
JP2891432B2 (ja) * 1989-12-27 1999-05-17 田中電子工業株式会社 半導体材料の接続方法，それに用いる接続材料及び半導体装置
US5168537A (en) * 1991-06-28 1992-12-01 Digital Equipment Corporation Method and apparatus for coupling light between an optoelectronic device and a waveguide
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
FR2701600B1 (fr) * 1993-02-10 1995-09-08 Gec Alsthom Transport Sa Dispositif de refroidissement de composants electriques de puissance.
DE4311839A1 (de) * 1993-04-15 1994-10-20 Siemens Ag Mikrokühleinrichtung für eine Elektronik-Komponente
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5504378A (en) * 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
US5774334A (en) * 1994-08-26 1998-06-30 Hitachi, Ltd. Low thermal resistant, fluid-cooled semiconductor module
JPH08241943A (ja) * 1995-03-07 1996-09-17 Fuji Electric Co Ltd パワー半導体素子用の液冷式冷却体
FR2737608A1 (fr) * 1995-08-02 1997-02-07 Alsthom Cge Alcatel Dispositif electronique de puissance pourvu de moyens ameliores d'evacuation de la chaleur
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US5790376A (en) * 1996-11-06 1998-08-04 Compaq Computer Corporation Heat dissipating pad structure for an electronic component
JP2914342B2 (ja) * 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造

Also Published As

Publication number Publication date
FR2786656A1 (fr) 2000-06-02
CA2290802C (fr) 2008-08-05
DE69918644D1 (de) 2004-08-19
EP1005083B1 (de) 2004-07-14
AU755407B2 (en) 2002-12-12
CN1258934A (zh) 2000-07-05
EP1005083A1 (de) 2000-05-31
CN1146041C (zh) 2004-04-14
ES2222674T3 (es) 2005-02-01
FR2786656B1 (fr) 2001-01-26
US6344686B1 (en) 2002-02-05
DK1005083T3 (da) 2004-11-22
PT1005083E (pt) 2004-10-29
KR100603880B1 (ko) 2006-07-24
KR20000035714A (ko) 2000-06-26
JP2000164780A (ja) 2000-06-16
CA2290802A1 (fr) 2000-05-27
DE69918644T2 (de) 2005-07-21
AU5961099A (en) 2000-06-01

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