ATE27468T1 - PROCESS FOR ELECTRICAL DEPOSITION OF METAL COATINGS ON METAL SURFACES. - Google Patents

PROCESS FOR ELECTRICAL DEPOSITION OF METAL COATINGS ON METAL SURFACES.

Info

Publication number
ATE27468T1
ATE27468T1 AT83109721T AT83109721T ATE27468T1 AT E27468 T1 ATE27468 T1 AT E27468T1 AT 83109721 T AT83109721 T AT 83109721T AT 83109721 T AT83109721 T AT 83109721T AT E27468 T1 ATE27468 T1 AT E27468T1
Authority
AT
Austria
Prior art keywords
metal
electrical deposition
coatings
metals
metal surfaces
Prior art date
Application number
AT83109721T
Other languages
German (de)
Inventor
Hans-Georg Prof Dr Schnering
Helmut Prof Dr Quast
Gert Prof Dr Kollenz
Karl Dr Peters
Georg Dr Uray
Walter Dr Ott
Original Assignee
Max Planck Gesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max Planck Gesellschaft filed Critical Max Planck Gesellschaft
Application granted granted Critical
Publication of ATE27468T1 publication Critical patent/ATE27468T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1. Process for the currentless deposition of metal layers of metals of Groups Ib, IIb, IVb, Vb and VIII of the Periodic System on to appropriate more electronegative metals by contacting the object to be coated with a non-aqueous coating bath which contains a metal complex which is obtained by reaction of a corresponding di- or trivalent metal chloride with the hydrochloride of a base which is capable of complex formation with the metal or with the free base and hydrochloric acid.
AT83109721T 1982-09-29 1983-09-28 PROCESS FOR ELECTRICAL DEPOSITION OF METAL COATINGS ON METAL SURFACES. ATE27468T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19823236115 DE3236115A1 (en) 1982-09-29 1982-09-29 METHOD FOR ELECTRICALLY DEPOSITING METAL LAYERS ON SURFACES OF METALS
EP83109721A EP0107801B1 (en) 1982-09-29 1983-09-28 Process for electroless plating of metal surfaces with layers of metal

Publications (1)

Publication Number Publication Date
ATE27468T1 true ATE27468T1 (en) 1987-06-15

Family

ID=6174496

Family Applications (1)

Application Number Title Priority Date Filing Date
AT83109721T ATE27468T1 (en) 1982-09-29 1983-09-28 PROCESS FOR ELECTRICAL DEPOSITION OF METAL COATINGS ON METAL SURFACES.

Country Status (5)

Country Link
EP (1) EP0107801B1 (en)
JP (1) JPS5980767A (en)
AT (1) ATE27468T1 (en)
CA (1) CA1209412A (en)
DE (2) DE3236115A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60245797A (en) * 1984-05-18 1985-12-05 Nippon Steel Corp Electroplating solution containing nonaqueous solvent and its manufacture
EP0843592A4 (en) 1995-08-02 1999-02-17 Monsanto Co DEHALOGENATION OF HALOGENED CARBONATES IN AQUEOUS COMPOSITIONS.
DE19740908C1 (en) * 1997-09-17 1999-08-05 Vacuumschmelze Gmbh Indicator for use in a magnetic anti-theft system and method of making an activation strip therefor
US6818313B2 (en) 2002-07-24 2004-11-16 University Of Dayton Corrosion-inhibiting coating
US7412791B2 (en) 2004-12-20 2008-08-19 Lsi Industries, Inc. Adjustable menu panel
CN114990533B (en) * 2022-04-13 2023-06-16 江苏富乐华半导体科技股份有限公司 Method for improving binding force of electroplated copper on surface of ceramic substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
GB1411971A (en) * 1972-04-07 1975-10-29 Ici Ltd Process for the immersion plating of copper on iron or steel

Also Published As

Publication number Publication date
EP0107801A1 (en) 1984-05-09
EP0107801B1 (en) 1987-05-27
DE3371799D1 (en) 1987-07-02
CA1209412A (en) 1986-08-12
JPS5980767A (en) 1984-05-10
JPH0152474B2 (en) 1989-11-08
DE3236115A1 (en) 1984-03-29

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee