ATE275760T1 - Heizplatteneinheit - Google Patents

Heizplatteneinheit

Info

Publication number
ATE275760T1
ATE275760T1 AT00935530T AT00935530T ATE275760T1 AT E275760 T1 ATE275760 T1 AT E275760T1 AT 00935530 T AT00935530 T AT 00935530T AT 00935530 T AT00935530 T AT 00935530T AT E275760 T1 ATE275760 T1 AT E275760T1
Authority
AT
Austria
Prior art keywords
plate unit
heating plate
heater
casing
opening portion
Prior art date
Application number
AT00935530T
Other languages
English (en)
Inventor
Masakazu Furukawa
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of ATE275760T1 publication Critical patent/ATE275760T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Lubricants (AREA)
  • Laminated Bodies (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT00935530T 2000-06-02 2000-06-02 Heizplatteneinheit ATE275760T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/003595 WO2001095379A1 (en) 2000-06-02 2000-06-02 Hot plate unit

Publications (1)

Publication Number Publication Date
ATE275760T1 true ATE275760T1 (de) 2004-09-15

Family

ID=11736107

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00935530T ATE275760T1 (de) 2000-06-02 2000-06-02 Heizplatteneinheit

Country Status (5)

Country Link
US (1) US6756568B1 (de)
EP (2) EP1220303B1 (de)
AT (1) ATE275760T1 (de)
DE (1) DE60013620T2 (de)
WO (1) WO2001095379A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1249433A4 (de) * 1999-09-06 2005-01-05 Ibiden Co Ltd Brikett und keramisches substrat aus gesintertem kohlenstoffhaltigem aluminiumnitrid zur verwendung in vorrichtungen zur herstellung und untersuchung von halbleitern
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
US20060088692A1 (en) * 2004-10-22 2006-04-27 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/examining device
JP5111876B2 (ja) * 2007-01-31 2013-01-09 東京エレクトロン株式会社 基板載置構造体及び基板処理装置
JP5524560B2 (ja) * 2009-10-01 2014-06-18 株式会社ブリヂストン ヒータユニット反射板および該反射板を備えたヒータユニット
DE102013113045A1 (de) * 2013-11-26 2015-05-28 Aixtron Se Heizvorrichtung
JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN113544834A (zh) * 2019-03-18 2021-10-22 磁共振谱成像系统有限公司 具有加热式自动夹头更换器的裸片接合系统
JP7074946B1 (ja) * 2020-12-25 2022-05-24 京セラ株式会社 加熱装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2976386A (en) * 1958-03-31 1961-03-21 Lewis L Salton Electric food warmers
US3805024A (en) * 1973-06-18 1974-04-16 Irex Corp Electrical infrared heater with a coated silicon carbide emitter
US3987275A (en) * 1976-02-02 1976-10-19 General Electric Company Glass plate surface heating unit with sheathed heater
DE3527533A1 (de) * 1985-08-01 1987-02-12 Ego Elektro Blanc & Fischer Elektrokochplatte
JPS6296292A (ja) 1985-10-22 1987-05-02 三菱電機株式会社 ク−ラ−付エレベ−タの冷気流出防止装置
JPS63274768A (ja) 1987-05-06 1988-11-11 Tokuda Seisakusho Ltd 真空処理装置
DE3728466A1 (de) * 1987-08-26 1989-03-09 Ego Elektro Blanc & Fischer Kochgeraet
US5221829A (en) * 1990-10-15 1993-06-22 Shimon Yahav Domestic cooking apparatus
JP2617064B2 (ja) 1992-07-28 1997-06-04 日本碍子株式会社 半導体ウェハー加熱装置およびその製造方法
JP3165938B2 (ja) * 1993-06-24 2001-05-14 東京エレクトロン株式会社 ガス処理装置
JPH07111244A (ja) 1993-10-13 1995-04-25 Mitsubishi Electric Corp 気相結晶成長装置
DE9319245U1 (de) * 1993-12-15 1994-02-03 Bräuer, Dietmar, 78050 Villingen-Schwenningen Heizkörper, bestehend aus einem Grundmaterial mit sehr geringer Wärmeleitfähigkeit, mindestens einem vorzugsweis elektrischen Heizelement und Materialien zur Wärmedämmung und Wärmestrahlungsreflexion
JPH07280462A (ja) 1994-04-11 1995-10-27 Shin Etsu Chem Co Ltd 均熱セラミックスヒーター
JPH08176831A (ja) 1994-12-26 1996-07-09 Touyoko Kagaku Kk 高速熱処理成膜装置
JPH08274147A (ja) 1995-03-30 1996-10-18 Kyocera Corp ウェハ保持装置
JPH08222360A (ja) 1995-02-10 1996-08-30 Noboru Naruo 真空加熱兼冷却均熱ヒータ
US6002109A (en) * 1995-07-10 1999-12-14 Mattson Technology, Inc. System and method for thermal processing of a semiconductor substrate
JP3338593B2 (ja) 1995-09-19 2002-10-28 日本碍子株式会社 半導体処理装置およびその製造方法
JP3423131B2 (ja) 1995-11-20 2003-07-07 東京エレクトロン株式会社 熱処理装置及び処理装置
KR100280634B1 (ko) * 1996-05-05 2001-02-01 세이이치로 미야타 전기 발열체 및 이를 이용한 정전 척
JPH11283729A (ja) 1998-03-27 1999-10-15 Ibiden Co Ltd ホットプレートユニット

Also Published As

Publication number Publication date
EP1220303A4 (de) 2003-04-02
US6756568B1 (en) 2004-06-29
EP1463097A1 (de) 2004-09-29
DE60013620D1 (de) 2004-10-14
DE60013620T2 (de) 2005-02-03
EP1220303A1 (de) 2002-07-03
EP1220303B1 (de) 2004-09-08
WO2001095379A1 (en) 2001-12-13

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties