ATE278250T1 - Vorrichtung und verfahren zur laser- oberflächenbehandlung - Google Patents
Vorrichtung und verfahren zur laser- oberflächenbehandlungInfo
- Publication number
- ATE278250T1 ATE278250T1 AT96924926T AT96924926T ATE278250T1 AT E278250 T1 ATE278250 T1 AT E278250T1 AT 96924926 T AT96924926 T AT 96924926T AT 96924926 T AT96924926 T AT 96924926T AT E278250 T1 ATE278250 T1 AT E278250T1
- Authority
- AT
- Austria
- Prior art keywords
- pct
- laser
- treatment
- laser beam
- sec
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
- H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Laser Beam Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9509778A FR2737806B1 (fr) | 1995-08-11 | 1995-08-11 | Dispositif et procede de traitement de surface par laser |
| PCT/FR1996/001034 WO1997007539A1 (fr) | 1995-08-11 | 1996-07-03 | Dispositif et procede de traitement de surface par laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE278250T1 true ATE278250T1 (de) | 2004-10-15 |
Family
ID=9481898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT96924926T ATE278250T1 (de) | 1995-08-11 | 1996-07-03 | Vorrichtung und verfahren zur laser- oberflächenbehandlung |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6073464A (de) |
| EP (1) | EP0843889B1 (de) |
| JP (1) | JP3996641B2 (de) |
| KR (1) | KR100403792B1 (de) |
| AT (1) | ATE278250T1 (de) |
| CA (1) | CA2225422C (de) |
| DE (1) | DE69633511T2 (de) |
| FR (1) | FR2737806B1 (de) |
| WO (1) | WO1997007539A1 (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2737786B1 (fr) * | 1995-08-11 | 1997-09-12 | Soc D Production Et De Rech Ap | Dispositif optique pour homogeneiser un faisceau laser |
| FR2737814B1 (fr) * | 1995-08-11 | 1997-09-12 | Soc D Production Et De Rech Ap | Procede et dispositif de commande d'une source laser a plusieurs modules laser pour optimiser le traitement de surface par laser |
| TW444275B (en) * | 1998-01-13 | 2001-07-01 | Toshiba Corp | Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display |
| KR100322135B1 (ko) * | 1999-03-11 | 2002-02-04 | 윤종용 | 잔류 기계적 스트레스를 최대화하는 광섬유 및 이를 이용한 광섬유 격자 제작방법 |
| JP3447654B2 (ja) * | 2000-03-24 | 2003-09-16 | Necエレクトロニクス株式会社 | 異方性薄膜評価法及び評価装置 |
| WO2003014732A1 (en) * | 2001-08-10 | 2003-02-20 | Symyx Technologies, Inc. | Apparatuses and methods for creating and testing pre-formulations and systems for same |
| TW586173B (en) * | 2002-11-29 | 2004-05-01 | Au Optronics Corp | Method of monitoring a laser crystallization process |
| TWI284443B (en) * | 2003-01-07 | 2007-07-21 | Au Optronics Corp | Automatic control system and method of laser energy |
| US7109087B2 (en) * | 2003-10-03 | 2006-09-19 | Applied Materials, Inc. | Absorber layer for DSA processing |
| WO2005036627A1 (en) * | 2003-10-03 | 2005-04-21 | Applied Materials, Inc. | Absorber layer for dynamic surface annealing processing |
| JP2006040949A (ja) * | 2004-07-22 | 2006-02-09 | Advanced Lcd Technologies Development Center Co Ltd | レーザー結晶化装置及びレーザー結晶化方法 |
| JP2006088163A (ja) * | 2004-09-21 | 2006-04-06 | Fanuc Ltd | レーザ装置 |
| US7796260B1 (en) * | 2006-04-25 | 2010-09-14 | J.A. Woollam Co., Inc. | System and method of controlling intensity of an electromagnetic beam |
| US8557040B2 (en) * | 2007-11-21 | 2013-10-15 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparation of epitaxially textured thick films |
| EP2470485A4 (de) * | 2009-08-27 | 2012-12-26 | Mcalister Technologies Llc | Keramikisolator sowie herstellungsverfahren und verwendungsverfahren dafür |
| US8994943B2 (en) * | 2012-11-30 | 2015-03-31 | Infineon Technologies Ag | Selectivity by polarization |
| JP6348149B2 (ja) * | 2016-07-08 | 2018-06-27 | ファナック株式会社 | ロボットを用いてレーザ加工を行うレーザ加工ロボットシステム |
| JP6464213B2 (ja) * | 2017-02-09 | 2019-02-06 | ファナック株式会社 | レーザ加工ヘッドおよび撮影装置を備えるレーザ加工システム |
| FR3075377B1 (fr) * | 2017-12-19 | 2020-10-16 | Commissariat Energie Atomique | Procede de caracterisation et de controle de l'homogeneite de pieces metalliques fabriquees par frittage laser |
| GB2571997B (en) | 2018-03-16 | 2021-10-27 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
| CN117612966A (zh) * | 2023-08-09 | 2024-02-27 | 瑶光半导体(浙江)有限公司 | 激光退火装置及方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59168636A (ja) * | 1983-03-15 | 1984-09-22 | Toshiba Corp | ド−ズ量評価方法 |
| US4897154A (en) * | 1986-07-03 | 1990-01-30 | International Business Machines Corporation | Post dry-etch cleaning method for restoring wafer properties |
| US4962065A (en) * | 1989-02-13 | 1990-10-09 | The University Of Arkansas | Annealing process to stabilize PECVD silicon nitride for application as the gate dielectric in MOS devices |
| JPH03295251A (ja) * | 1990-04-12 | 1991-12-26 | Sumitomo Electric Ind Ltd | 半導体基板の表面状態検査方法 |
| US5313044A (en) * | 1992-04-28 | 1994-05-17 | Duke University | Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor |
| JPH06288835A (ja) * | 1993-03-30 | 1994-10-18 | Shimadzu Corp | エリプソメータ |
| US5399229A (en) * | 1993-05-13 | 1995-03-21 | Texas Instruments Incorporated | System and method for monitoring and evaluating semiconductor wafer fabrication |
| KR100327086B1 (ko) * | 1994-06-15 | 2002-03-06 | 구사마 사부로 | 박막 반도체 장치의 제조방법, 박막 반도체 장치,액정표시장치 및 전자기기 |
| FR2737786B1 (fr) * | 1995-08-11 | 1997-09-12 | Soc D Production Et De Rech Ap | Dispositif optique pour homogeneiser un faisceau laser |
| FR2737779B1 (fr) * | 1995-08-11 | 1997-09-12 | Soc D Production Et De Rech Ap | Dispositif ellipsometre a haute resolution spatiale |
| FR2737814B1 (fr) * | 1995-08-11 | 1997-09-12 | Soc D Production Et De Rech Ap | Procede et dispositif de commande d'une source laser a plusieurs modules laser pour optimiser le traitement de surface par laser |
| US5798837A (en) * | 1997-07-11 | 1998-08-25 | Therma-Wave, Inc. | Thin film optical measurement system and method with calibrating ellipsometer |
| US5864393A (en) * | 1997-07-30 | 1999-01-26 | Brown University Research Foundation | Optical method for the determination of stress in thin films |
-
1995
- 1995-08-11 FR FR9509778A patent/FR2737806B1/fr not_active Expired - Fee Related
-
1996
- 1996-07-03 WO PCT/FR1996/001034 patent/WO1997007539A1/fr not_active Ceased
- 1996-07-03 EP EP96924926A patent/EP0843889B1/de not_active Expired - Lifetime
- 1996-07-03 DE DE69633511T patent/DE69633511T2/de not_active Expired - Fee Related
- 1996-07-03 CA CA002225422A patent/CA2225422C/en not_active Expired - Fee Related
- 1996-07-03 US US09/000,126 patent/US6073464A/en not_active Expired - Lifetime
- 1996-07-03 JP JP50897997A patent/JP3996641B2/ja not_active Expired - Fee Related
- 1996-07-03 AT AT96924926T patent/ATE278250T1/de not_active IP Right Cessation
- 1996-07-03 KR KR10-1998-0700915A patent/KR100403792B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100403792B1 (ko) | 2004-03-24 |
| CA2225422A1 (en) | 1997-02-27 |
| DE69633511D1 (de) | 2004-11-04 |
| EP0843889A1 (de) | 1998-05-27 |
| KR19990036247A (ko) | 1999-05-25 |
| EP0843889B1 (de) | 2004-09-29 |
| WO1997007539A1 (fr) | 1997-02-27 |
| FR2737806B1 (fr) | 1997-09-12 |
| JP3996641B2 (ja) | 2007-10-24 |
| US6073464A (en) | 2000-06-13 |
| DE69633511T2 (de) | 2005-11-17 |
| FR2737806A1 (fr) | 1997-02-14 |
| CA2225422C (en) | 2007-05-22 |
| JPH11510960A (ja) | 1999-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 0843889 Country of ref document: EP |
|
| REN | Ceased due to non-payment of the annual fee |