ATE282098T1 - Kupfergewinnungsverfahren - Google Patents

Kupfergewinnungsverfahren

Info

Publication number
ATE282098T1
ATE282098T1 AT00902242T AT00902242T ATE282098T1 AT E282098 T1 ATE282098 T1 AT E282098T1 AT 00902242 T AT00902242 T AT 00902242T AT 00902242 T AT00902242 T AT 00902242T AT E282098 T1 ATE282098 T1 AT E282098T1
Authority
AT
Austria
Prior art keywords
copper
acid solution
extraction process
copper extraction
printed boards
Prior art date
Application number
AT00902242T
Other languages
English (en)
Inventor
Robert Pacholik
Gunnar Lidmer
Original Assignee
Mecer Holdings Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mecer Holdings Corp filed Critical Mecer Holdings Corp
Application granted granted Critical
Publication of ATE282098T1 publication Critical patent/ATE282098T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0084—Treating solutions
    • C22B15/0089—Treating solutions by chemical methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacture And Refinement Of Metals (AREA)
AT00902242T 1999-03-02 2000-01-14 Kupfergewinnungsverfahren ATE282098T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9900748A SE512160C2 (sv) 1999-03-02 1999-03-02 Förfarande för återvinning av koppar från ett alkaliskt etsbad
PCT/SE2000/000066 WO2000052229A1 (en) 1999-03-02 2000-01-14 Copper recovery process

Publications (1)

Publication Number Publication Date
ATE282098T1 true ATE282098T1 (de) 2004-11-15

Family

ID=20414695

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00902242T ATE282098T1 (de) 1999-03-02 2000-01-14 Kupfergewinnungsverfahren

Country Status (9)

Country Link
US (1) US6821404B1 (de)
EP (1) EP1165861B1 (de)
CN (1) CN1342218A (de)
AT (1) ATE282098T1 (de)
AU (1) AU2337100A (de)
DE (1) DE60015736D1 (de)
HK (1) HK1043814A1 (de)
SE (1) SE512160C2 (de)
WO (1) WO2000052229A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848457B2 (en) * 2000-05-08 2005-02-01 Tokyo Electron Limited Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment
US7175819B2 (en) * 2005-03-04 2007-02-13 Phibro-Tech, Inc. Regeneration of cupric etchants and recovery of copper sulfate
CN1904142B (zh) * 2006-07-08 2012-01-25 江门市蓬江区大盈机电设备有限公司 一种蚀刻废液或低含铜废水的提铜方法
CN103695653B (zh) * 2014-01-02 2016-06-08 沈少波 一种湿法提取电路板上贵金属的方法
CN105077561B (zh) * 2015-08-28 2016-08-31 安徽中烟工业有限责任公司 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法
CN109881200B (zh) * 2019-04-10 2021-05-11 深圳市铿东科技有限公司 一种碱性蚀刻液再生及其铜回收方法
CN110359051B (zh) * 2019-06-18 2020-09-22 龙建国 线路板蚀刻废液循环再利用的方法
CN110636710A (zh) * 2019-07-17 2019-12-31 江苏博敏电子有限公司 一种印制电路板精细线路电解蚀刻和电镀同步制作方法
CN115852457A (zh) * 2022-09-06 2023-03-28 徐州上达芯源半导体技术有限公司 一种半导体的生产加工电镀装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4083758A (en) * 1976-09-27 1978-04-11 Criterion Process for regenerating and for recovering metallic copper from chloride-containing etching solutions
SE411231B (sv) * 1978-05-02 1979-12-10 Mx Processer Reinhardt Forfarande for atervinning av ett ammonialkaliskt etsbad
US5261154A (en) * 1991-07-22 1993-11-16 Macdermid, Incorporated Process for fabricating multilayer printed circuits
DE19506832A1 (de) * 1995-02-28 1996-08-29 Eilenburger Elektrolyse & Umwelttechnik Gmbh Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
US5705048A (en) * 1996-03-27 1998-01-06 Oxley Research, Inc. Apparatus and a process for regenerating a CUCl2 etchant
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process

Also Published As

Publication number Publication date
HK1043814A1 (zh) 2002-09-27
WO2000052229A1 (en) 2000-09-08
DE60015736D1 (de) 2004-12-16
EP1165861B1 (de) 2004-11-10
SE512160C2 (sv) 2000-02-07
CN1342218A (zh) 2002-03-27
EP1165861A1 (de) 2002-01-02
AU2337100A (en) 2000-09-21
US6821404B1 (en) 2004-11-23
SE9900748D0 (sv) 1999-03-02

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