ATE286448T1 - Trägerloses polierband zum chemisch-mechanischen polieren - Google Patents

Trägerloses polierband zum chemisch-mechanischen polieren

Info

Publication number
ATE286448T1
ATE286448T1 AT00959821T AT00959821T ATE286448T1 AT E286448 T1 ATE286448 T1 AT E286448T1 AT 00959821 T AT00959821 T AT 00959821T AT 00959821 T AT00959821 T AT 00959821T AT E286448 T1 ATE286448 T1 AT E286448T1
Authority
AT
Austria
Prior art keywords
polishing
belt
chemical
strapsless
mechanical polishing
Prior art date
Application number
AT00959821T
Other languages
English (en)
Inventor
Cangshan Xu
Brian S Lombardo
Original Assignee
Lam Res Corp
Peripheral Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp, Peripheral Products Inc filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE286448T1 publication Critical patent/ATE286448T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT00959821T 1999-08-31 2000-08-31 Trägerloses polierband zum chemisch-mechanischen polieren ATE286448T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/386,741 US6406363B1 (en) 1999-08-31 1999-08-31 Unsupported chemical mechanical polishing belt
PCT/US2000/024207 WO2001015867A1 (en) 1999-08-31 2000-08-31 Unsupported polishing belt for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
ATE286448T1 true ATE286448T1 (de) 2005-01-15

Family

ID=23526859

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00959821T ATE286448T1 (de) 1999-08-31 2000-08-31 Trägerloses polierband zum chemisch-mechanischen polieren

Country Status (10)

Country Link
US (2) US6406363B1 (de)
EP (1) EP1214175B1 (de)
JP (1) JP2003508905A (de)
KR (1) KR20020068032A (de)
AT (1) ATE286448T1 (de)
AU (1) AU7108000A (de)
DE (1) DE60017271D1 (de)
PT (1) PT1214175E (de)
TW (1) TW466157B (de)
WO (1) WO2001015867A1 (de)

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US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
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US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
TWM573509U (zh) * 2017-01-20 2019-01-21 美商應用材料股份有限公司 用於cmp 應用的薄的塑膠拋光用具及支撐元件
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
CN120382564B (zh) * 2025-06-30 2025-10-10 台州职业技术学院 一种多线切割机加工系统及其控制方法

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Also Published As

Publication number Publication date
US6656030B2 (en) 2003-12-02
EP1214175A1 (de) 2002-06-19
WO2001015867A1 (en) 2001-03-08
US20020068513A1 (en) 2002-06-06
KR20020068032A (ko) 2002-08-24
US6406363B1 (en) 2002-06-18
EP1214175B1 (de) 2005-01-05
JP2003508905A (ja) 2003-03-04
TW466157B (en) 2001-12-01
PT1214175E (pt) 2005-05-31
AU7108000A (en) 2001-03-26
DE60017271D1 (de) 2005-02-10

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