ATE286448T1 - Trägerloses polierband zum chemisch-mechanischen polieren - Google Patents

Trägerloses polierband zum chemisch-mechanischen polieren

Info

Publication number
ATE286448T1
ATE286448T1 AT00959821T AT00959821T ATE286448T1 AT E286448 T1 ATE286448 T1 AT E286448T1 AT 00959821 T AT00959821 T AT 00959821T AT 00959821 T AT00959821 T AT 00959821T AT E286448 T1 ATE286448 T1 AT E286448T1
Authority
AT
Austria
Prior art keywords
polishing
belt
chemical
strapsless
mechanical polishing
Prior art date
Application number
AT00959821T
Other languages
English (en)
Inventor
Cangshan Xu
Brian S Lombardo
Original Assignee
Lam Res Corp
Peripheral Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp, Peripheral Products Inc filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE286448T1 publication Critical patent/ATE286448T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT00959821T 1999-08-31 2000-08-31 Trägerloses polierband zum chemisch-mechanischen polieren ATE286448T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/386,741 US6406363B1 (en) 1999-08-31 1999-08-31 Unsupported chemical mechanical polishing belt
PCT/US2000/024207 WO2001015867A1 (en) 1999-08-31 2000-08-31 Unsupported polishing belt for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
ATE286448T1 true ATE286448T1 (de) 2005-01-15

Family

ID=23526859

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00959821T ATE286448T1 (de) 1999-08-31 2000-08-31 Trägerloses polierband zum chemisch-mechanischen polieren

Country Status (10)

Country Link
US (2) US6406363B1 (de)
EP (1) EP1214175B1 (de)
JP (1) JP2003508905A (de)
KR (1) KR20020068032A (de)
AT (1) ATE286448T1 (de)
AU (1) AU7108000A (de)
DE (1) DE60017271D1 (de)
PT (1) PT1214175E (de)
TW (1) TW466157B (de)
WO (1) WO2001015867A1 (de)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6908374B2 (en) * 1998-12-01 2005-06-21 Nutool, Inc. Chemical mechanical polishing endpoint detection
KR20010020807A (ko) * 1999-05-03 2001-03-15 조셉 제이. 스위니 고정 연마재 제품을 사전-조절하는 방법
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6406363B1 (en) * 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
CN100379522C (zh) * 2000-12-01 2008-04-09 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
US6896776B2 (en) * 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US6572463B1 (en) 2000-12-27 2003-06-03 Lam Research Corp. Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
US6561889B1 (en) 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US7201829B2 (en) 2001-03-01 2007-04-10 Novellus Systems, Inc. Mask plate design
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
US7238092B2 (en) * 2001-09-28 2007-07-03 Novellus Systems, Inc. Low-force electrochemical mechanical processing method and apparatus
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
US6722946B2 (en) 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US6942546B2 (en) 2002-01-17 2005-09-13 Asm Nutool, Inc. Endpoint detection for non-transparent polishing member
US6926589B2 (en) * 2002-03-22 2005-08-09 Asm Nutool, Inc. Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
US6857947B2 (en) 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US6935922B2 (en) 2002-02-04 2005-08-30 Kla-Tencor Technologies Corp. Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
US20040023607A1 (en) * 2002-03-13 2004-02-05 Homayoun Talieh Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
KR100823187B1 (ko) * 2002-07-19 2008-04-18 삼성에스디아이 주식회사 음극선관용 섀도우 마스크
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7121937B2 (en) 2003-03-17 2006-10-17 3M Innovative Properties Company Abrasive brush elements and segments
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
JP4947583B2 (ja) * 2007-03-30 2012-06-06 東洋ゴム工業株式会社 研磨パッドの製造方法
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
KR102100654B1 (ko) * 2012-04-02 2020-04-14 토마스 웨스트 인코포레이티드 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
SG11201906131WA (en) * 2017-01-20 2019-08-27 Applied Materials Inc A thin plastic polishing article for cmp applications
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
CN120382564B (zh) * 2025-06-30 2025-10-10 台州职业技术学院 一种多线切割机加工系统及其控制方法

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58163638A (ja) 1982-03-25 1983-09-28 Mitsuboshi Belting Ltd ゴム製歯付ベルトの製造用組立モ−ルド
US4576612A (en) 1984-06-01 1986-03-18 Ferro Corporation Fixed ophthalmic lens polishing pad
US4728552A (en) 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4927432A (en) 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US4753838A (en) 1986-06-16 1988-06-28 Tsuguji Kimura Polishing sheet material and method for its production
JPS63267155A (ja) 1987-04-24 1988-11-04 Babcock Hitachi Kk 研磨装置
US4841680A (en) 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
JPH01193166A (ja) 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
US4962562A (en) 1989-01-18 1990-10-16 Minnesota Mining And Manufacturing Company Compounding, glazing or polishing pad
US5234867A (en) 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5020283A (en) 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5177908A (en) 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5197999A (en) 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5487697A (en) 1993-02-09 1996-01-30 Rodel, Inc. Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
US5329734A (en) 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
GB9310398D0 (en) * 1993-05-20 1993-07-07 Minnisota Mining And Manufactu Process for the manufacture of endless coated abrasive articles
US5681612A (en) * 1993-06-17 1997-10-28 Minnesota Mining And Manufacturing Company Coated abrasives and methods of preparation
US5454844A (en) * 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
AU1735295A (en) * 1994-02-22 1995-09-04 Minnesota Mining And Manufacturing Company Method for making an endless coated abrasive article and the product thereof
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5534106A (en) 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
ATE186001T1 (de) 1994-08-09 1999-11-15 Ontrak Systems Inc Linear poliergerät und wafer planarisierungsverfahren
US5593344A (en) 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5575707A (en) 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
JP2898896B2 (ja) 1995-01-10 1999-06-02 ニッタ株式会社 ポリウレタン製ベルト
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
DE69635816T2 (de) 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US5578096A (en) * 1995-08-10 1996-11-26 Minnesota Mining And Manufacturing Company Method for making a spliceless coated abrasive belt and the product thereof
US5603311A (en) * 1995-08-17 1997-02-18 Reimann & Georger Belt based cutting system
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JP2830907B2 (ja) 1995-12-06 1998-12-02 日本電気株式会社 半導体基板研磨装置
US5916012A (en) * 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5876268A (en) * 1997-01-03 1999-03-02 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
US5871390A (en) 1997-02-06 1999-02-16 Lam Research Corporation Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6406363B1 (en) * 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt

Also Published As

Publication number Publication date
TW466157B (en) 2001-12-01
KR20020068032A (ko) 2002-08-24
AU7108000A (en) 2001-03-26
WO2001015867A1 (en) 2001-03-08
EP1214175A1 (de) 2002-06-19
DE60017271D1 (de) 2005-02-10
US6406363B1 (en) 2002-06-18
PT1214175E (pt) 2005-05-31
EP1214175B1 (de) 2005-01-05
US6656030B2 (en) 2003-12-02
JP2003508905A (ja) 2003-03-04
US20020068513A1 (en) 2002-06-06

Similar Documents

Publication Publication Date Title
ATE286448T1 (de) Trägerloses polierband zum chemisch-mechanischen polieren
TW365561B (en) Polishing semiconductor wafer
TW363218B (en) Integrated pad and belt for chemical mechanical polishing
MY122784A (en) Abrasive article suitable for modifying a semiconductor wafer
EP1043379A4 (de) Schleiffmittel, halbleiterscheibe polierverfahren und verfahren zur herstellung einer halbleiteranordnung
ATE194728T1 (de) Einrichtung zur kopplung von be- und entladegeräten mit halbleiterbearbeitungsmaschinen
DE60115710D1 (de) Artikel mit flixiertem schleifmittel zum verändern einer halbleiterscheibe
EP0928662A3 (de) Halbleiterscheibe Oberflächenglattungsvorrichtung
MY128145A (en) In-situ method and apparatus for end point detection in chemical mechanical polishing
CA2151340A1 (en) Contact lens production line pallet system
EP1475357A4 (de) Ritzer für substrat aus fragilem material, verarbeitungsmaschine für substrat aus fragilem material, poliervorrichtung für substrat aus fragilem material und system zum teilen von substrat aus fragilem material
AU2003287956A8 (en) Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device
ZA947021B (en) Method of forming a stacked article group
TW200602157A (en) Polishing pad having grooves configured to promote mixing wakes during polishing
TW200635702A (en) Retainer ring for cmp device, method of manufacturing the same, and cmp device
SE0400201D0 (sv) Apparatus and method for manufacturing an absorbent core
IT1278082B1 (it) Supporto per corpi portanti in un dispositivo per la deposizione di materiale di semiconduttori.
CA2249507A1 (en) Forming belt for manufacturing construction materials and transfer belt for manufacturing construction materials
TW200500171A (en) Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
US6358132B1 (en) Apparatus for grinding spherical objects
NO993824D0 (no) Nye isocyanatterminerte prepolymerer
PT1386709E (pt) Metodo e dispositivo para levantar um cordao de materia plastica
WO2000013995A3 (de) Einrichtung zum transportieren von blattförmigem fördergut
GB1402275A (en) Belt conveyors and conveyor belts therefor
ATE189149T1 (de) Ziegel-schleifvorrichtung für die herstellung von planziegeln

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties