ATE287126T1 - Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat - Google Patents

Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat

Info

Publication number
ATE287126T1
ATE287126T1 AT98944906T AT98944906T ATE287126T1 AT E287126 T1 ATE287126 T1 AT E287126T1 AT 98944906 T AT98944906 T AT 98944906T AT 98944906 T AT98944906 T AT 98944906T AT E287126 T1 ATE287126 T1 AT E287126T1
Authority
AT
Austria
Prior art keywords
liquid
substrate
removal
locally
ambient boundary
Prior art date
Application number
AT98944906T
Other languages
English (en)
Inventor
Paul Mertens
Marc Meuris
Marc Heyns
Original Assignee
Imec Inter Uni Micro Electr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP98870056A external-priority patent/EP0905746A1/de
Application filed by Imec Inter Uni Micro Electr filed Critical Imec Inter Uni Micro Electr
Application granted granted Critical
Publication of ATE287126T1 publication Critical patent/ATE287126T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)
AT98944906T 1997-09-24 1998-09-24 Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat ATE287126T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5992997P 1997-09-24 1997-09-24
EP98870056A EP0905746A1 (de) 1997-09-24 1998-03-20 Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
US7968898P 1998-03-27 1998-03-27
US9803898P 1998-08-27 1998-08-27
PCT/BE1998/000140 WO1999016109A1 (en) 1997-09-24 1998-09-24 Method and apparatus for removing a liquid from a surface

Publications (1)

Publication Number Publication Date
ATE287126T1 true ATE287126T1 (de) 2005-01-15

Family

ID=27443760

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98944906T ATE287126T1 (de) 1997-09-24 1998-09-24 Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat

Country Status (5)

Country Link
EP (1) EP0970511B1 (de)
JP (1) JP4017680B2 (de)
AT (1) ATE287126T1 (de)
DE (1) DE69828592T8 (de)
WO (1) WO1999016109A1 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
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US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
US7584761B1 (en) 2000-06-30 2009-09-08 Lam Research Corporation Wafer edge surface treatment with liquid meniscus
US7234477B2 (en) 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
KR100416590B1 (ko) * 2001-01-13 2004-02-05 삼성전자주식회사 반도체 웨이퍼 세정장치 및 이를 이용한 웨이퍼 세정방법
US7100304B2 (en) * 2001-06-12 2006-09-05 Akrion Technologies, Inc. Megasonic cleaner and dryer
JP4114188B2 (ja) 2001-06-12 2008-07-09 アクリオン テクノロジーズ， インコーポレイテッド メガソニック洗浄乾燥システム
DE10200525A1 (de) * 2002-01-09 2003-10-23 Mattson Wet Products Gmbh Vorrichtung und Verfahren zum Behandeln von scheibenförmigen Substraten
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7045018B2 (en) 2002-09-30 2006-05-16 Lam Research Corporation Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
US7614411B2 (en) 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
CN100431092C (zh) * 2002-09-30 2008-11-05 拉姆研究公司 利用接近晶片表面的多个入口和出口干燥半导体晶片表面的方法和设备
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7389783B2 (en) 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US8236382B2 (en) 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7069937B2 (en) 2002-09-30 2006-07-04 Lam Research Corporation Vertical proximity processor
US7153400B2 (en) 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US7293571B2 (en) 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus
CN100350552C (zh) * 2002-09-30 2007-11-21 拉姆研究公司 使用弯液面、负压、ipa蒸汽、干燥歧管进行基板处理的系统
US7513262B2 (en) 2002-09-30 2009-04-07 Lam Research Corporation Substrate meniscus interface and methods for operation
US7632376B1 (en) 2002-09-30 2009-12-15 Lam Research Corporation Method and apparatus for atomic layer deposition (ALD) in a proximity system
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7329321B2 (en) 2002-09-30 2008-02-12 Lam Research Corporation Enhanced wafer cleaning method
US7704367B2 (en) 2004-06-28 2010-04-27 Lam Research Corporation Method and apparatus for plating semiconductor wafers
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7170190B1 (en) 2003-12-16 2007-01-30 Lam Research Corporation Apparatus for oscillating a head and methods for implementing the same
US7350315B2 (en) * 2003-12-22 2008-04-01 Lam Research Corporation Edge wheel dry manifold
US7416370B2 (en) 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US7568490B2 (en) 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US8062471B2 (en) 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
US7089687B2 (en) 2004-09-30 2006-08-15 Lam Research Corporation Wafer edge wheel with drying function
US8480810B2 (en) 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US8813764B2 (en) 2009-05-29 2014-08-26 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
JP4810411B2 (ja) 2006-11-30 2011-11-09 東京応化工業株式会社 処理装置
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US7975708B2 (en) 2007-03-30 2011-07-12 Lam Research Corporation Proximity head with angled vacuum conduit system, apparatus and method
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8388762B2 (en) 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US20110289795A1 (en) 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
JP5538102B2 (ja) 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP2014130883A (ja) * 2012-12-28 2014-07-10 Ebara Corp 基板洗浄装置及び基板洗浄方法
JP6376553B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108155133B (zh) * 2014-02-27 2022-04-15 斯克林集团公司 基板处理装置
KR102308587B1 (ko) 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP6376554B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6461621B2 (ja) * 2015-01-23 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN105826219B (zh) 2015-01-23 2019-01-04 株式会社思可林集团 基板处理方法、基板处理装置和流体喷嘴
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP7285692B2 (ja) * 2019-05-17 2023-06-02 東京エレクトロン株式会社 乾燥装置、基板処理システム、および乾燥方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027686A (en) * 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
JP3351082B2 (ja) * 1994-01-14 2002-11-25 ソニー株式会社 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法
DE19522525A1 (de) * 1994-10-04 1996-04-11 Kunze Concewitz Horst Dipl Phy Verfahren und Vorrichtung zum Feinstreinigen von Oberflächen
JPH09162159A (ja) * 1995-12-05 1997-06-20 Dainippon Screen Mfg Co Ltd 回転式基板乾燥装置
EP0905746A1 (de) * 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
JP4616948B2 (ja) * 1997-09-24 2011-01-19 アイメック 回転基材の表面から液体を除去する方法および装置

Also Published As

Publication number Publication date
DE69828592T2 (de) 2006-03-23
JP4017680B2 (ja) 2007-12-05
EP0970511B1 (de) 2005-01-12
EP0970511A1 (de) 2000-01-12
WO1999016109A1 (en) 1999-04-01
DE69828592D1 (de) 2005-02-17
DE69828592T8 (de) 2006-06-08
JP2001506061A (ja) 2001-05-08

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