ATE287200T1 - Randkontaktflächen für leiterplatten mit leitfähiger tinte - Google Patents

Randkontaktflächen für leiterplatten mit leitfähiger tinte

Info

Publication number
ATE287200T1
ATE287200T1 AT99961713T AT99961713T ATE287200T1 AT E287200 T1 ATE287200 T1 AT E287200T1 AT 99961713 T AT99961713 T AT 99961713T AT 99961713 T AT99961713 T AT 99961713T AT E287200 T1 ATE287200 T1 AT E287200T1
Authority
AT
Austria
Prior art keywords
circuit boards
conductive ink
contact surface
edge contact
contacts
Prior art date
Application number
AT99961713T
Other languages
English (en)
Inventor
Denis Jean
Original Assignee
3Com Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3Com Corp filed Critical 3Com Corp
Application granted granted Critical
Publication of ATE287200T1 publication Critical patent/ATE287200T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
AT99961713T 1998-11-20 1999-11-18 Randkontaktflächen für leiterplatten mit leitfähiger tinte ATE287200T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/197,685 US6265051B1 (en) 1998-11-20 1998-11-20 Edge connectors for printed circuit boards comprising conductive ink
PCT/US1999/027445 WO2000032020A1 (en) 1998-11-20 1999-11-18 Edge connectors for printed circuit boards comprising conductive ink

Publications (1)

Publication Number Publication Date
ATE287200T1 true ATE287200T1 (de) 2005-01-15

Family

ID=22730352

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99961713T ATE287200T1 (de) 1998-11-20 1999-11-18 Randkontaktflächen für leiterplatten mit leitfähiger tinte

Country Status (6)

Country Link
US (2) US6265051B1 (de)
EP (1) EP1129605B1 (de)
AT (1) ATE287200T1 (de)
AU (1) AU1823000A (de)
DE (1) DE69923213D1 (de)
WO (1) WO2000032020A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265051B1 (en) 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink
JP3909791B2 (ja) * 1999-04-19 2007-04-25 共同印刷株式会社 透明導電膜の転写方法
GB2373639B (en) * 2001-03-20 2004-09-08 Eturbotouch Technology Inc Method for manufacturing touch screen linearization pattern
CA2504223C (en) * 2002-10-30 2012-03-06 Inverness Medical Limited Ink composition for use in a continuous web process for the manufacture of electrochemical sensors
KR100545288B1 (ko) * 2003-03-28 2006-01-25 주식회사 잉크테크 유기은 조성물 및 그 제조방법, 그로부터 제조되는 잉크및 그 잉크를 이용한 도전배선 형성 방법
KR101788731B1 (ko) 2010-08-06 2017-10-20 히타치가세이가부시끼가이샤 액상 조성물, 및 그것을 사용한 저항체막, 저항체 소자 및 배선판
CN103013226B (zh) * 2012-12-26 2014-10-15 赵婕 导电油墨组合物及其制备方法
FR3003354B1 (fr) * 2013-03-12 2015-04-17 Alstom Technology Ltd Element resistif, module rc et diviseur en tension rc pour poste electrique haute tension isole par un fluide dielectrique
US20140307423A1 (en) * 2013-04-12 2014-10-16 Oryon Technologies, Llc Flexible interconnect circuitry
CN103694796B (zh) * 2013-12-19 2015-02-18 电子科技大学 一种印制电路板埋嵌电阻喷墨打印油墨的制作方法
JP6771350B2 (ja) * 2016-10-03 2020-10-21 日立オートモティブシステムズ株式会社 車載用電子装置とその製造方法
DE102017113750A1 (de) * 2017-06-21 2018-12-27 Schreiner Group Gmbh & Co. Kg Folienaufbau mit elektrischer Funktionalität und externer Kontaktierung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4045636A (en) 1976-01-28 1977-08-30 Bowmar Instrument Corporation Keyboard switch assembly having printed circuit board with plural layer exposed contacts and undersurface jumper connections
US4243455A (en) 1977-07-29 1981-01-06 Nippon Graphite Industries, Ltd. Method of forming electrode connector for liquid crystal display device
US4545926A (en) * 1980-04-21 1985-10-08 Raychem Corporation Conductive polymer compositions and devices
US4578215A (en) 1983-08-12 1986-03-25 Micro-Circuits Company Electrical conductivity-enhancing and protecting material
US4517739A (en) 1983-11-21 1985-05-21 Northern Telecom Limited Method for making circuit boards with die stamped contact pads and conductive ink circuit patterns
US4964948A (en) 1985-04-16 1990-10-23 Protocad, Inc. Printed circuit board through hole technique
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
US4896250A (en) 1988-02-12 1990-01-23 Emerson & Cuming, Inc. Solvent-processible electrically conductive coatings
JPH02150090A (ja) 1988-11-30 1990-06-08 Cmk Corp プリント配線板の製造方法
US5049313A (en) 1989-09-05 1991-09-17 Advanced Products Inc. Thermoset polymer thick film compositions and their use as electrical circuitry
US5716663A (en) 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
US5042971A (en) 1990-04-16 1991-08-27 Ambrose Stephen D Method of manufacturing an electrical circuit system and electrical circuit system
US5057245A (en) 1990-04-17 1991-10-15 Advanced Products, Inc. Fast curing and storage stable thermoset polymer thick film compositions
CA2055148C (en) 1991-10-25 2002-06-18 Alain Langevin Method of forming an electrically conductive contact on a substrate
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US5380271A (en) 1992-09-24 1995-01-10 Alza Corporation Electrotransport agent delivery device and method
US5484648A (en) * 1993-08-11 1996-01-16 Shin-Etsu Polymer Co., Ltd. Heat-sealable connector and method for the preparation thereof
IE940943A1 (en) 1993-12-09 1995-06-14 Methode Electronics Inc Printed plastic circuits and contacts and method for making¹same
US5841111A (en) * 1996-12-19 1998-11-24 Eaton Corporation Low resistance electrical interface for current limiting polymers by plasma processing
US6265051B1 (en) 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink

Also Published As

Publication number Publication date
EP1129605B1 (de) 2005-01-12
US6265051B1 (en) 2001-07-24
AU1823000A (en) 2000-06-13
DE69923213D1 (de) 2005-02-17
WO2000032020A1 (en) 2000-06-02
US6821555B2 (en) 2004-11-23
EP1129605A1 (de) 2001-09-05
US20020086146A1 (en) 2002-07-04

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties