ATE291650T1 - Lösung zum galvanischen abscheiden einer zinn- indium-legierung - Google Patents

Lösung zum galvanischen abscheiden einer zinn- indium-legierung

Info

Publication number: ATE291650T1
Authority: AT; Austria
Prior art keywords: tin; indium alloy; solution; indium; alloy plating
Prior art date: 2000-01-17

Application number

AT00309300T

Other languages

English (en)

Inventor

Takaaki Tamura

Kyoko Tsunoda

Original Assignee

Nippon Macdermid Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-01-17

Filing date

2000-10-23

Publication date

2005-04-15

2000-10-23 Application filed by Nippon Macdermid Co Ltd filed Critical Nippon Macdermid Co Ltd

2005-04-15 Application granted granted Critical

2005-04-15 Publication of ATE291650T1 publication Critical patent/ATE291650T1/de

Links

229910000846 In alloy Inorganic materials 0.000 title abstract 4
230000008021 deposition Effects 0.000 title 1
RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 title 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 5
229910001128 Sn alloy Inorganic materials 0.000 abstract 4
238000007747 plating Methods 0.000 abstract 3
239000007864 aqueous solution Substances 0.000 abstract 2
239000000243 solution Substances 0.000 abstract 2
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
229910000978 Pb alloy Inorganic materials 0.000 abstract 1
229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
239000002253 acid Substances 0.000 abstract 1
239000003513 alkali Substances 0.000 abstract 1
239000003518 caustics Substances 0.000 abstract 1
239000002738 chelating agent Substances 0.000 abstract 1
AUYOHNUMSAGWQZ-UHFFFAOYSA-L dihydroxy(oxo)tin Chemical compound O[Sn](O)=O AUYOHNUMSAGWQZ-UHFFFAOYSA-L 0.000 abstract 1
238000009713 electroplating Methods 0.000 abstract 1
150000002471 indium Chemical class 0.000 abstract 1
229910052751 metal Inorganic materials 0.000 abstract 1
239000002184 metal Substances 0.000 abstract 1
150000003839 salts Chemical class 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electroplating Methods And Accessories (AREA)

AT00309300T 2000-01-17 2000-10-23 Lösung zum galvanischen abscheiden einer zinn- indium-legierung ATE291650T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2000010288A JP2001200387A (ja)	2000-01-17	2000-01-17	錫−インジウム合金電気めっき浴

Publications (1)

Publication Number	Publication Date
ATE291650T1 true ATE291650T1 (de)	2005-04-15

Family

ID=18538325

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT00309300T ATE291650T1 (de)	2000-01-17	2000-10-23	Lösung zum galvanischen abscheiden einer zinn- indium-legierung

Country Status (8)

Country	Link
US (1)	US6331240B1 (de)
EP (1)	EP1116804B1 (de)
JP (1)	JP2001200387A (de)
CN (1)	CN1165639C (de)
AT (1)	ATE291650T1 (de)
DE (1)	DE60018893T2 (de)
ES (1)	ES2235790T3 (de)
TW (1)	TW538144B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005060822A (ja) *	2003-08-08	2005-03-10	Rohm & Haas Electronic Materials Llc	複合基体の電気メッキ
JP5497261B2 (ja)	2006-12-15	2014-05-21	ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー．	インジウム組成物
US20090188808A1 (en) *	2008-01-29	2009-07-30	Jiaxiong Wang	Indium electroplating baths for thin layer deposition
EP2123799B1 (de) *	2008-04-22	2015-04-22	Rohm and Haas Electronic Materials LLC	Verfahren zum Nachfüllen von Indiumionen in Indium-Elektroplattierzusammensetzungen
RU2458188C1 (ru) *	2011-06-16	2012-08-10	Георгий Иосифович Медведев	Способ электроосаждения сплава олово-индий
CN102424995A (zh) *	2011-12-17	2012-04-25	张家港舒马克电梯安装维修服务有限公司镀锌分公司	一种锡-铟合金电镀液
US10879156B2 (en)	2016-03-08	2020-12-29	Washington State University	Mitigation of whisker growth in tin coatings by alloying with indium
US9809892B1 (en)	2016-07-18	2017-11-07	Rohm And Haas Electronic Materials Llc	Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US11686007B2 (en)	2017-12-18	2023-06-27	New Mexico Tech University Research Park Corporation	Tin-indium alloy electroplating solution
RU2769855C1 (ru) *	2021-06-30	2022-04-07	Федеральное государственное бюджетное образовательное учреждение высшего образования "Чувашский государственный университет имени И.Н. Ульянова"	Безфлюсовый способ получения луженой медной проволоки с покрытием сплавом на основе олова и индия
RU2768620C1 (ru) *	2021-06-30	2022-03-24	Федеральное государственное бюджетное образовательное учреждение высшего образования "Чувашский государственный университет имени И.Н. Ульянова"	Способ получения медной проволоки с покрытием на основе сплава олово-индий

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1176787A (en) *	1968-04-08	1970-01-07	Vandervell Products Ltd	Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium.
JP3279353B2 (ja) *	1992-09-25	2002-04-30	ディップソール株式会社	錫−亜鉛合金電気めっき浴
US6210556B1 (en) *	1998-02-12	2001-04-03	Learonal, Inc.	Electrolyte and tin-silver electroplating process

2000
- 2000-01-17 JP JP2000010288A patent/JP2001200387A/ja active Pending
- 2000-09-15 US US09/663,447 patent/US6331240B1/en not_active Expired - Lifetime
- 2000-10-23 AT AT00309300T patent/ATE291650T1/de not_active IP Right Cessation
- 2000-10-23 EP EP00309300A patent/EP1116804B1/de not_active Expired - Lifetime
- 2000-10-23 ES ES00309300T patent/ES2235790T3/es not_active Expired - Lifetime
- 2000-10-23 DE DE60018893T patent/DE60018893T2/de not_active Expired - Lifetime
- 2000-12-08 TW TW089126189A patent/TW538144B/zh not_active IP Right Cessation
2001
- 2001-01-10 CN CNB011000961A patent/CN1165639C/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE60018893T2 (de)	2005-07-28
EP1116804B1 (de)	2005-03-23
JP2001200387A (ja)	2001-07-24
CN1314501A (zh)	2001-09-26
CN1165639C (zh)	2004-09-08
ES2235790T3 (es)	2005-07-16
EP1116804A3 (de)	2004-01-28
TW538144B (en)	2003-06-21
DE60018893D1 (de)	2005-04-28
US6331240B1 (en)	2001-12-18
EP1116804A2 (de)	2001-07-18

Legal Events

Date	Code	Title	Description
2005-09-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE291650T1 (de)	2005-04-15	Lösung zum galvanischen abscheiden einer zinn- indium-legierung
ATE356229T1 (de)	2007-03-15	Lösung zur stromlosen nickel-plattierung
CN101532152B (zh)	2010-12-29	钴-钨-铁-镍合金电镀液
ATE521734T1 (de)	2011-09-15	Cyanidfreies pyrophosphorsäure-bad zum elektrolytischen abscheiden von kupfer- zinnlegierungsüberzügen
EP2329062B1 (de)	2013-05-29	Cyanidfreie elektrolytzusammensetzung zur galvanischen abscheidung einer kupferschicht
GB718574A (en)	1954-11-17	Bath for the deposit of gold alloys by electroplating
CN101260549A (zh)	2008-09-10	一种无预镀型无氰镀银电镀液
CA1244373A (en)	1988-11-08	Gold sulphite electroplating solutions
BR0010358A (pt)	2002-02-13	Revestimento com liga
JPS56116894A (en)	1981-09-12	Neutral tin electroplating bath for obtaining dense plated coating
JPH10317183A (ja)	1998-12-02	非シアンの電気金めっき浴
SE8002598L (sv)	1980-10-05	Silver- och silver/guld-pleteringsbad
CN102383149A (zh)	2012-03-21	一种环保三价铬电镀液及其电镀方法
GB1414896A (en)	1975-11-19	Electroless copper plating
JPH0730458B2 (ja)	1995-04-05	亜鉛又は亜鉛系めっき材料の黒色化処理方法
EP0384679B1 (de)	1994-08-17	Elektroplattierung von Gold enthaltenden Legierungen
WO2000017420A3 (en)	2000-11-23	Method for improving the macro throwing power for nickel, zinc orzinc alloy electroplating baths
PL348755A1 (en)	2002-06-03	Aqueous solution for electrodepositing tin-zinc alloys
GB1304424A (de)	1973-01-24
GB1051383A (de)
CN104195604A (zh)	2014-12-10	一种抑制裂缝产生的铱电镀液及其电镀方法和镀膜物
JPH06146058A (ja)	1994-05-27	パラジウム・インジウム合金めっき浴
GB1177166A (en)	1970-01-07	Electrodeposition of Silver
JPS5462933A (en)	1979-05-21	Nickel electroplating method
JPS5719388A (en)	1982-02-01	Cathode for electrolysis