ATE291830T1 - Vorrichtung und verfahren zur herstellung elektronischer schaltungen - Google Patents

Vorrichtung und verfahren zur herstellung elektronischer schaltungen

Info

Publication number
ATE291830T1
ATE291830T1 AT02790664T AT02790664T ATE291830T1 AT E291830 T1 ATE291830 T1 AT E291830T1 AT 02790664 T AT02790664 T AT 02790664T AT 02790664 T AT02790664 T AT 02790664T AT E291830 T1 ATE291830 T1 AT E291830T1
Authority
AT
Austria
Prior art keywords
placing
location
circuit carrier
electronic circuits
take
Prior art date
Application number
AT02790664T
Other languages
English (en)
Inventor
Willibald Konrath
Helmut Greiner
Klaus Scholl
Werner Horzer
Original Assignee
Marconi Comm Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10162327A external-priority patent/DE10162327A1/de
Application filed by Marconi Comm Gmbh filed Critical Marconi Comm Gmbh
Application granted granted Critical
Publication of ATE291830T1 publication Critical patent/ATE291830T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5196—Multiple station with conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automatic Assembly (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT02790664T 2001-12-18 2002-12-13 Vorrichtung und verfahren zur herstellung elektronischer schaltungen ATE291830T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10162327A DE10162327A1 (de) 2001-11-09 2001-12-18 Vorrichtung und Verfahren zum Montieren von elektronischen Schaltungen
PCT/IB2002/005753 WO2003053122A1 (en) 2001-12-18 2002-12-13 Apparatus and method for assembling electronic circuits

Publications (1)

Publication Number Publication Date
ATE291830T1 true ATE291830T1 (de) 2005-04-15

Family

ID=7709761

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02790664T ATE291830T1 (de) 2001-12-18 2002-12-13 Vorrichtung und verfahren zur herstellung elektronischer schaltungen

Country Status (6)

Country Link
US (2) US20050108872A1 (de)
EP (1) EP1466514B1 (de)
CN (1) CN100446650C (de)
AT (1) ATE291830T1 (de)
AU (1) AU2002366508A1 (de)
WO (1) WO2003053122A1 (de)

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JP2009141106A (ja) * 2007-12-06 2009-06-25 Mitsubishi Electric Corp プリント配線基板、空気調和機、プリント配線基板の半田付け方法
US20100047053A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Die picker for picking printhead die from a wafer
US8701276B2 (en) * 2008-08-19 2014-04-22 Zamtec Ltd Placement head for a die placing assembly
US8092625B2 (en) * 2008-08-19 2012-01-10 Silverbrook Research Pty Ltd Integrated circuit placement system
US20100047962A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Multi-chip printhead assembler
US7877876B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Method of attaching integrated circuits to a carrier
US20100043214A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Integrated circuit dice pick and lift head
US8296937B2 (en) * 2008-08-19 2012-10-30 Silverbrook Research Pty Ltd Wafer positioning system
US7805832B2 (en) * 2008-08-19 2010-10-05 Silverbrook Research Pty Ltd Transfer apparatus for transferring a component of integrated circuitry
US7979979B2 (en) * 2008-08-19 2011-07-19 Silverbrook Research Pty Ltd Clamp assembly for an assembler of integrated circuitry on a carrier
CN102648442B (zh) * 2009-09-11 2015-03-11 Abb技术有限公司 改进的拾取和放置
US9352430B2 (en) 2010-06-16 2016-05-31 Schleuniger Holding Ag Cable grommet fitting apparatus for cable
RU2013101776A (ru) * 2010-06-16 2014-07-27 Шлойнигер Холдинг Аг Устройство для установки кабельных наконечников на кабель
CN102530325B (zh) * 2010-12-23 2016-04-20 赛恩倍吉科技顾问（深圳）有限公司 自动装料系统及方法
CN102874540B (zh) * 2011-07-15 2015-01-21 鸿富锦精密工业（深圳）有限公司 生产线设备及使用该生产线设备的生产线系统
MX362314B (es) 2011-09-29 2019-01-10 Schleuniger Holding Ag Metodo para ajustar cables con fundas de cable y unidad de transferencia para sellos o componentes de ensamble de cable comparables para una planta de procesamiento de cable.
WO2013101226A1 (en) * 2011-12-30 2013-07-04 Intel Corporation Apparatus and method for automated sort probe assembly and repair
DE102012003479A1 (de) * 2012-02-21 2013-08-22 Kuka Roboter Gmbh Verfahren und Vorrichtung zum Ausführen eines Manipulatorprozesses
EP2709217B1 (de) 2012-09-12 2017-08-09 Schleuniger Holding AG Maschine für die Montage von Kabeltüllen
EP2928279B1 (de) * 2012-11-30 2019-06-19 FUJI Corporation Arbeitssystem für ein substrat
CN104717878B (zh) * 2013-12-16 2017-08-29 无锡华润安盛科技有限公司 一种用于smt工艺的装置及其控制方法
CN104999280B (zh) * 2015-08-04 2017-05-31 嘉联电梯有限公司 一种电梯电路板的加工设备
CN106696475B (zh) * 2015-11-13 2019-06-18 富泰华工业（深圳）有限公司 打印机及利用打印机打印电路板的方法
EP3595423B1 (de) * 2017-03-08 2022-01-05 Fuji Corporation Fördervorrichtung und montage-assoziierte vorrichtung
CN107161682B (zh) * 2017-05-25 2022-08-30 常州市范群干燥设备有限公司 压药生产设备及其工作方法
CN108521718B (zh) * 2018-06-21 2023-12-19 苏州工业职业技术学院 一种电路板加工用辅助装置
CN109454420A (zh) * 2018-09-26 2019-03-12 芜湖优能自动化设备有限公司 一种出油座全自动装配设备
CN109561650B (zh) * 2018-12-20 2021-02-26 苏州光韵达自动化设备有限公司 一种自动拼板机及自动拼板方法
CN113579762A (zh) * 2021-08-17 2021-11-02 苏州新威浩机电科技有限公司 一种直放式传感器自动化组装设备及其生产工艺

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US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
US5507085A (en) * 1993-05-13 1996-04-16 Cybex Technologies Corp. Method and apparatus for automatically placing lids on component packages
JPH0878882A (ja) * 1994-09-02 1996-03-22 Fuji Mach Mfg Co Ltd 対回路基板トランスファ作業装置
JP3202929B2 (ja) * 1996-09-13 2001-08-27 東京エレクトロン株式会社 処理システム
US6226452B1 (en) * 1997-05-19 2001-05-01 Texas Instruments Incorporated Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging
JPH1154993A (ja) * 1997-08-01 1999-02-26 Yamagata Casio Co Ltd 部品搭載装置
US6032577A (en) * 1998-03-02 2000-03-07 Mpm Corporation Method and apparatus for transporting substrates
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WO2000045323A1 (en) * 1999-01-29 2000-08-03 Bp Microsystems In-line programming system and method
DE19962693A1 (de) 1999-12-23 2001-07-26 Siemens Ag Verfahren zum Bestücken von elektrischen Bauteilen und Bestückautomat für elektrische Bauteile

Also Published As

Publication number Publication date
WO2003053122A1 (en) 2003-06-26
US7552529B2 (en) 2009-06-30
CN1620846A (zh) 2005-05-25
AU2002366508A1 (en) 2003-06-30
US20050108872A1 (en) 2005-05-26
EP1466514B1 (de) 2005-03-23
EP1466514A1 (de) 2004-10-13
CN100446650C (zh) 2008-12-24
US20070124927A1 (en) 2007-06-07

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Legal Events

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