ATE293152T1 - Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms - Google Patents

Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms

Info

Publication number
ATE293152T1
ATE293152T1 AT00950025T AT00950025T ATE293152T1 AT E293152 T1 ATE293152 T1 AT E293152T1 AT 00950025 T AT00950025 T AT 00950025T AT 00950025 T AT00950025 T AT 00950025T AT E293152 T1 ATE293152 T1 AT E293152T1
Authority
AT
Austria
Prior art keywords
polyimide
patterned
produce
same
coating composition
Prior art date
Application number
AT00950025T
Other languages
English (en)
Inventor
Hiroshi Itatani
Shunichi Matsumoto
Original Assignee
Pi R & D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pi R & D Co Ltd filed Critical Pi R & D Co Ltd
Application granted granted Critical
Publication of ATE293152T1 publication Critical patent/ATE293152T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
AT00950025T 1999-08-06 2000-08-07 Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms ATE293152T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25614399 1999-08-06
PCT/JP2000/005285 WO2001010964A1 (fr) 1999-08-06 2000-08-07 Composition destinee a l'electrodeposition de polyimide et procede de formation de film de polyimide a motifs a partir de cette composition

Publications (1)

Publication Number Publication Date
ATE293152T1 true ATE293152T1 (de) 2005-04-15

Family

ID=17288509

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00950025T ATE293152T1 (de) 1999-08-06 2000-08-07 Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms

Country Status (6)

Country Link
US (1) US6630064B1 (de)
EP (1) EP1123954B1 (de)
JP (1) JP4958355B2 (de)
AT (1) ATE293152T1 (de)
DE (1) DE60019397T2 (de)
WO (1) WO2001010964A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4141625B2 (ja) * 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
JP4683763B2 (ja) * 2001-05-11 2011-05-18 リコー光学株式会社 高分子材料層の加熱方法及び装置
CN1307260C (zh) * 2002-01-15 2007-03-28 株式会社Pi技术研究所 溶剂可溶的嵌段共聚聚酰亚胺组合物及其制造方法
JP4646804B2 (ja) * 2003-03-28 2011-03-09 株式会社ピーアイ技術研究所 架橋ポリイミド、それを含む組成物及びその製造方法
CA2435538A1 (en) * 2003-07-18 2005-01-18 Universite Laval Solvent resistant asymmetric integrally skinned membranes
JP2005162954A (ja) * 2003-12-05 2005-06-23 Pi R & D Co Ltd 電着塗料組成物及びそれを用いた電着方法
JP4737938B2 (ja) * 2004-02-13 2011-08-03 株式会社ピーアイ技術研究所 コイル用リング状絶縁板の製造方法
US7892651B2 (en) * 2004-09-14 2011-02-22 Mitsubishi Gas Chemical Company, Inc. Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
WO2007029614A1 (ja) * 2005-09-05 2007-03-15 Asahi Kasei Emd Corporation ポジ型感光性樹脂組成物
KR101308119B1 (ko) * 2006-01-25 2013-09-12 피아이 알 앤 디 컴파니, 리미티드 수지 복합 동박, 인쇄 배선 기판 및 그 제조 방법
JP5281568B2 (ja) * 2007-04-03 2013-09-04 ソルピー工業株式会社 溶剤に可溶な６，６−ポリイミド共重合体及びその製造方法
KR101435074B1 (ko) 2007-10-17 2014-08-27 에이전시 포 사이언스, 테크놀로지 앤드 리서치 탄소 나노튜브 및 고분자를 포함하는 복합 필름
JP6168884B2 (ja) * 2013-07-05 2017-07-26 東京応化工業株式会社 ネガ型感光性樹脂組成物
KR102672003B1 (ko) * 2016-10-21 2024-06-03 한국전기연구원 전착코팅용 이미드계 고분자 콜로이드 분산액 및 그 제조방법
KR102433079B1 (ko) * 2017-04-28 2022-08-17 주식회사 동진쎄미켐 감광성 수지 조성물
DE102017119280A1 (de) * 2017-08-23 2019-02-28 Heraeus Noblelight Gmbh Verfahren und Vorrichtung zur Herstellung einer Polyimidschicht auf einem Substrat
CN115279808A (zh) * 2020-03-13 2022-11-01 积水化学工业株式会社 树脂材料和多层印刷线路板
TW202244130A (zh) * 2021-03-03 2022-11-16 美商杜邦電子股份有限公司 塗佈溶液及交聯聚合物膜

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100076A (ja) * 1989-09-14 1991-04-25 Hitachi Chem Co Ltd ポリイミド薄膜の製造法
JP2906637B2 (ja) * 1989-10-27 1999-06-21 日産化学工業株式会社 ポジ型感光性ポリイミド樹脂組成物
US5202411A (en) 1990-04-06 1993-04-13 W. R. Grace & Co.-Conn. Tri-component polyimide composition and preparation thereof
US5502143A (en) 1992-12-25 1996-03-26 Pi Material Research Laboratory Process for preparing polyimide resins
JP3089195B2 (ja) * 1995-10-12 2000-09-18 大日本塗料株式会社 電着用ポリイミド組成物
JP4547087B2 (ja) 1997-10-13 2010-09-22 株式会社ピーアイ技術研究所 ポジ型感光性ポリイミド組成物
JP4034403B2 (ja) * 1998-01-16 2008-01-16 株式会社ピーアイ技術研究所 ポジ型感光性ポリイミド組成物及び絶縁膜

Also Published As

Publication number Publication date
JP4958355B2 (ja) 2012-06-20
EP1123954A4 (de) 2002-07-03
DE60019397T2 (de) 2006-03-16
EP1123954A1 (de) 2001-08-16
DE60019397D1 (de) 2005-05-19
WO2001010964A1 (fr) 2001-02-15
US6630064B1 (en) 2003-10-07
EP1123954B1 (de) 2005-04-13

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