ATE293516T1 - Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel - Google Patents

Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel

Info

Publication number
ATE293516T1
ATE293516T1 AT01971086T AT01971086T ATE293516T1 AT E293516 T1 ATE293516 T1 AT E293516T1 AT 01971086 T AT01971086 T AT 01971086T AT 01971086 T AT01971086 T AT 01971086T AT E293516 T1 ATE293516 T1 AT E293516T1
Authority
AT
Austria
Prior art keywords
particulate
polishing pad
polymer
crosslinked
binder
Prior art date
Application number
AT01971086T
Other languages
English (en)
Inventor
Robert G Swisher
Alan E Wang
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Application granted granted Critical
Publication of ATE293516T1 publication Critical patent/ATE293516T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT01971086T 2000-09-15 2001-09-14 Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel ATE293516T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/663,180 US6477926B1 (en) 2000-09-15 2000-09-15 Polishing pad
PCT/US2001/028948 WO2002022309A1 (en) 2000-09-15 2001-09-14 Polishing pad comprising particulate polymer and crosslinked polymer binder

Publications (1)

Publication Number Publication Date
ATE293516T1 true ATE293516T1 (de) 2005-05-15

Family

ID=24660789

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01971086T ATE293516T1 (de) 2000-09-15 2001-09-14 Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel

Country Status (8)

Country Link
US (1) US6477926B1 (de)
EP (1) EP1318891B1 (de)
CN (1) CN100346930C (de)
AT (1) ATE293516T1 (de)
AU (1) AU2001291016A1 (de)
DE (1) DE60110248T2 (de)
TW (1) TW550165B (de)
WO (1) WO2002022309A1 (de)

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US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
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US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
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JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
CN101489721B (zh) * 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
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US20080274674A1 (en) * 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
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US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
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CN103878707B (zh) * 2014-03-31 2016-04-13 湖北鼎龙化学股份有限公司 化学机械抛光的抛光垫及其制备方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2016062879A1 (de) * 2014-10-24 2016-04-28 Basf Se Schleifelemente und verfahren zu deren herstellung von schleifelementen
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106041719B (zh) * 2016-06-03 2018-10-23 湖北鼎龙控股股份有限公司 一种抛光层及其制备方法以及化学机械抛光垫
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KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
CN114450127B (zh) * 2019-07-12 2024-05-28 Cmc材料有限责任公司 采用多胺及环己烷二甲醇固化剂的抛光垫
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
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Also Published As

Publication number Publication date
DE60110248D1 (de) 2005-05-25
US6477926B1 (en) 2002-11-12
EP1318891A1 (de) 2003-06-18
WO2002022309A1 (en) 2002-03-21
TW550165B (en) 2003-09-01
DE60110248T2 (de) 2006-03-09
AU2001291016A1 (en) 2002-03-26
CN1474735A (zh) 2004-02-11
CN100346930C (zh) 2007-11-07
EP1318891B1 (de) 2005-04-20

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