ATE298771T1 - Epoxyharzzusammensetzung zur einkapselung von halbleitern - Google Patents

Epoxyharzzusammensetzung zur einkapselung von halbleitern

Info

Publication number
ATE298771T1
ATE298771T1 AT02710526T AT02710526T ATE298771T1 AT E298771 T1 ATE298771 T1 AT E298771T1 AT 02710526 T AT02710526 T AT 02710526T AT 02710526 T AT02710526 T AT 02710526T AT E298771 T1 ATE298771 T1 AT E298771T1
Authority
AT
Austria
Prior art keywords
epoxy resin
group
resin composition
general formula
compound
Prior art date
Application number
AT02710526T
Other languages
English (en)
Inventor
Atsuhito Hayakawa
Yasuyuki Murata
Original Assignee
Resolution Res Nederland Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resolution Res Nederland Bv filed Critical Resolution Res Nederland Bv
Application granted granted Critical
Publication of ATE298771T1 publication Critical patent/ATE298771T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT02710526T 2001-01-19 2002-01-08 Epoxyharzzusammensetzung zur einkapselung von halbleitern ATE298771T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001011383A JP2002212268A (ja) 2001-01-19 2001-01-19 半導体封止用エポキシ樹脂組成物
PCT/NL2002/000008 WO2002057333A2 (en) 2001-01-19 2002-01-08 Epoxy resin composition for semiconductor encapsulation

Publications (1)

Publication Number Publication Date
ATE298771T1 true ATE298771T1 (de) 2005-07-15

Family

ID=18878529

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02710526T ATE298771T1 (de) 2001-01-19 2002-01-08 Epoxyharzzusammensetzung zur einkapselung von halbleitern

Country Status (8)

Country Link
US (1) US20040048971A1 (de)
EP (1) EP1352008B1 (de)
JP (1) JP2002212268A (de)
KR (1) KR20030077576A (de)
CN (1) CN1203104C (de)
AT (1) ATE298771T1 (de)
DE (1) DE60204844T2 (de)
WO (1) WO2002057333A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397540B (zh) * 2004-12-21 2013-06-01 Nippon Kayaku Kk 環氧樹脂，環氧樹脂組成物及其硬化物
JP2007162001A (ja) * 2005-11-21 2007-06-28 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
JP5062714B2 (ja) * 2006-01-19 2012-10-31 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びその用途
WO2007144408A1 (en) * 2006-06-16 2007-12-21 Huntsman Advanced Materials (Switzerland) Gmbh Coating system
ES2622874T3 (es) * 2009-02-12 2017-07-07 Jx Nippon Oil & Energy Corporation Composición de resina de benzoxazina
KR101326960B1 (ko) 2011-05-20 2013-11-13 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
KR101326934B1 (ko) 2011-08-31 2013-11-11 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
DE102012200273A1 (de) * 2012-01-11 2013-07-11 Robert Bosch Gmbh Elektronisches Bauteil mit korrosionsgeschützter Bondverbindung und Verfahren zur Herstellung des Bauteils
CN102633990A (zh) * 2012-04-05 2012-08-15 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
CN107001580A (zh) * 2014-12-04 2017-08-01 三菱化学株式会社 四甲基联苯酚型环氧树脂、环氧树脂组合物、固化物和半导体封装材料
JP6772680B2 (ja) * 2015-09-03 2020-10-21 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品
TWI717446B (zh) * 2016-01-07 2021-02-01 日商積水化學工業股份有限公司 液晶顯示元件用密封劑、上下導通材料及液晶顯示元件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539439A (ja) * 1991-08-05 1993-02-19 Nippon Kayaku Co Ltd エポキシ樹脂粉体塗料組成物
SG87725A1 (en) * 1992-09-21 2002-04-16 Sumitomo Bakelite Co Epoxy resin composition
JP3214739B2 (ja) * 1992-11-13 2001-10-02 三井化学株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
JP2002212268A (ja) 2002-07-31
EP1352008A2 (de) 2003-10-15
KR20030077576A (ko) 2003-10-01
CN1203104C (zh) 2005-05-25
WO2002057333A2 (en) 2002-07-25
DE60204844D1 (de) 2005-08-04
DE60204844T2 (de) 2006-05-11
WO2002057333A3 (en) 2002-10-17
US20040048971A1 (en) 2004-03-11
EP1352008B1 (de) 2005-06-29
CN1487963A (zh) 2004-04-07

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