ATE299065T1 - Laserschweissverfahren - Google Patents

Laserschweissverfahren

Info

Publication number
ATE299065T1
ATE299065T1 AT01272148T AT01272148T ATE299065T1 AT E299065 T1 ATE299065 T1 AT E299065T1 AT 01272148 T AT01272148 T AT 01272148T AT 01272148 T AT01272148 T AT 01272148T AT E299065 T1 ATE299065 T1 AT E299065T1
Authority
AT
Austria
Prior art keywords
laser
laser welding
time
melt
operated
Prior art date
Application number
AT01272148T
Other languages
English (en)
Inventor
Durandus K Dijken
Willem Hoving
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE299065T1 publication Critical patent/ATE299065T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Laser Surgery Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
AT01272148T 2000-12-22 2001-12-07 Laserschweissverfahren ATE299065T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00204789 2000-12-22
PCT/IB2001/002446 WO2002051580A1 (en) 2000-12-22 2001-12-07 Method of laser welding

Publications (1)

Publication Number Publication Date
ATE299065T1 true ATE299065T1 (de) 2005-07-15

Family

ID=8172548

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01272148T ATE299065T1 (de) 2000-12-22 2001-12-07 Laserschweissverfahren

Country Status (9)

Country Link
US (1) US6576864B2 (de)
EP (1) EP1349696B1 (de)
JP (1) JP2004516147A (de)
KR (1) KR100845911B1 (de)
CN (1) CN1325220C (de)
AT (1) ATE299065T1 (de)
DE (1) DE60111863T2 (de)
TW (1) TW516981B (de)
WO (1) WO2002051580A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6932879B2 (en) * 2002-08-13 2005-08-23 Edison Welding Institute Method of weldbonding
US20050054952A1 (en) * 2003-09-05 2005-03-10 Scimed Life Systems, Inc. Elongated medical device for intracorporal use
JP3957703B2 (ja) * 2004-05-18 2007-08-15 川崎重工業株式会社 レーザ溶接方法、レーザ溶接継手、外板パネルおよび鉄道車両の構体構造
DE102006042280A1 (de) * 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP2008058732A (ja) * 2006-08-31 2008-03-13 Mitsumi Electric Co Ltd カメラモジュール
FR2915912B1 (fr) * 2007-05-11 2010-02-26 Peugeot Citroen Automobiles Sa Procede de soudage au laser d'elements metalliques.
DE102010018366A1 (de) * 2010-04-26 2011-10-27 Forschungszentrum Jülich GmbH Fügen von metallischen und/oder keramischen Werkstoffen mit Hilfe eines glaskeramischen Zusatzwerkstoffes
CN102476241B (zh) * 2010-11-24 2014-03-26 上海汽车变速器有限公司 结合齿环与齿轮热后激光焊接方法
DE202012012150U1 (de) 2012-12-18 2013-01-18 Jiann-Ying Houng Metallplatten-Schweißstruktur
CN103273199B (zh) * 2013-04-07 2017-06-09 深圳市三森科技有限公司 一种可提高激光焊接强度的加工方法
DE102014116283B4 (de) 2014-11-07 2016-05-19 Webasto SE Verfahren zum Bearbeiten eines ersten Bauelements und eines zweiten Bauelements sowie Vorrichtung
GB201502149D0 (en) * 2015-02-09 2015-03-25 Spi Lasers Uk Ltd Apparatus and method for laser welding
DE102015014060B4 (de) * 2015-11-02 2018-05-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Fügen von zwei Bauteilen im Bereich einer Fügezone mittels mindestens einem Laserstrahl sowie Verfahren zum Erzeugen einer durchgehenden Fügenaht
DE102015119252B4 (de) 2015-11-09 2024-02-01 Webasto SE Vorrichtung für ein Heizgerät für ein Fahrzeug
CN105552679B (zh) * 2015-12-14 2017-04-05 深圳市海目星激光科技有限公司 一种焊接漆包线的控制方法和系统
CN108463308B (zh) * 2016-01-18 2020-02-18 通用汽车环球科技运作有限责任公司 激光点焊镀层钢的方法
CN109462986B (zh) * 2016-07-14 2021-01-26 通用汽车环球科技运作有限责任公司 涂层钢的多束激光点焊
JP6935484B2 (ja) * 2017-03-03 2021-09-15 古河電気工業株式会社 溶接方法および溶接装置
JP7058955B2 (ja) * 2017-07-28 2022-04-25 日本発條株式会社 溶接部を有するワークと、ワークのための溶接装置と、溶接方法
CN107598371A (zh) * 2017-09-21 2018-01-19 中国科学院长春光学精密机械与物理研究所 一种铜工件的焊接方法
EP3753667B1 (de) * 2018-02-16 2022-06-22 Panasonic Intellectual Property Management Co., Ltd. Laserschweissvorrichtung und laserschweissverfahren
EP3778101B1 (de) * 2018-04-13 2024-01-17 Panasonic Intellectual Property Management Co., Ltd. Laserschweissvorrichtung
DE102021109787A1 (de) * 2021-04-19 2022-10-20 Precitec Gmbh & Co. Kg Verfahren zum Vergleichen von Laserbearbeitungssystemen und Verfahren zum Überwachen eines Laserbearbeitungsprozesses sowie dazugehöriges Laserbearbeitungssystem

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1958430A1 (de) * 1969-11-21 1971-05-27 Dozler Geb Bauscher Elisabeth Schweisseinrichtung
JPS5949112B2 (ja) * 1977-01-28 1984-11-30 株式会社東芝 レ−ザ溶接方法
JPS5662688A (en) * 1979-10-24 1981-05-28 Toshiba Corp Laser welding method
GB2175737A (en) * 1985-05-09 1986-12-03 Control Laser Limited Laser material processing
GB2218660B (en) * 1988-05-16 1991-09-25 Lumonics Ltd Method of material processing using a laser beam
JPH04231190A (ja) * 1990-12-28 1992-08-20 Fanuc Ltd 亜鉛メッキ鋼板のレーザ溶接方法と装置
JPH04251684A (ja) * 1991-01-24 1992-09-08 Toyota Motor Corp 亜鉛メッキ鋼板のレーザ溶接方法
JP2728623B2 (ja) * 1993-09-10 1998-03-18 川崎重工業株式会社 レーザ溶接方法
FR2710571B1 (fr) * 1993-09-29 1995-12-22 Lorraine Laminage Procédé de soudage d'au moins deux pièces métalliques et tube obtenu par ce procédé de soudage.
DE59407495D1 (de) 1994-06-15 1999-01-28 Inpro Innovations Gmbh Verfahren und Vorrichtung zum Verschweissen von verzinkten Stahlblechen mittels Laserstrahlen
FR2731373B1 (fr) * 1995-03-09 1997-04-18 Peugeot Procede de soudage de toles par un faisceau laser et assemblage de toles soudees obtenu par ce procede
JP2918829B2 (ja) * 1995-11-30 1999-07-12 本田技研工業株式会社 燃料タンクの製造方法、レーザ溶接体及び燃料タンク
US5897796A (en) * 1997-06-16 1999-04-27 Chrysler Corporation Method and apparatus for in-situ laser welding of hemmed joints
JP4408519B2 (ja) * 2000-03-10 2010-02-03 独立行政法人物質・材料研究機構 レーザー溶接方法

Also Published As

Publication number Publication date
US20020079296A1 (en) 2002-06-27
EP1349696A1 (de) 2003-10-08
CN1325220C (zh) 2007-07-11
EP1349696B1 (de) 2005-07-06
WO2002051580A1 (en) 2002-07-04
CN1633346A (zh) 2005-06-29
DE60111863T2 (de) 2006-04-27
KR20020080430A (ko) 2002-10-23
JP2004516147A (ja) 2004-06-03
KR100845911B1 (ko) 2008-07-11
TW516981B (en) 2003-01-11
DE60111863D1 (de) 2005-08-11
US6576864B2 (en) 2003-06-10

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