ATE299758T1 - Verfahren zum lokalen entfernen einer beschichtung auf einem transluzenten oder transparenten substrat - Google Patents

Verfahren zum lokalen entfernen einer beschichtung auf einem transluzenten oder transparenten substrat

Info

Publication number
ATE299758T1
ATE299758T1 AT01942585T AT01942585T ATE299758T1 AT E299758 T1 ATE299758 T1 AT E299758T1 AT 01942585 T AT01942585 T AT 01942585T AT 01942585 T AT01942585 T AT 01942585T AT E299758 T1 ATE299758 T1 AT E299758T1
Authority
AT
Austria
Prior art keywords
coating
translucent
transparent substrate
pulsed laser
removal
Prior art date
Application number
AT01942585T
Other languages
English (en)
Inventor
Axel Kupisiewicz
Original Assignee
Wallonia Space Logistics Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wallonia Space Logistics Sa filed Critical Wallonia Space Logistics Sa
Application granted granted Critical
Publication of ATE299758T1 publication Critical patent/ATE299758T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laser Beam Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning In General (AREA)
AT01942585T 2000-01-20 2001-01-17 Verfahren zum lokalen entfernen einer beschichtung auf einem transluzenten oder transparenten substrat ATE299758T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2000/0037A BE1013237A3 (fr) 2000-01-20 2000-01-20 Procede d'enlevement local d'un revetement applique sur un substrat translucide ou transparent.
PCT/BE2001/000010 WO2001053011A1 (fr) 2000-01-20 2001-01-17 Procede d'enlevement local d'un revetement applique sur un substrat translucide ou transparent

Publications (1)

Publication Number Publication Date
ATE299758T1 true ATE299758T1 (de) 2005-08-15

Family

ID=3896368

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01942585T ATE299758T1 (de) 2000-01-20 2001-01-17 Verfahren zum lokalen entfernen einer beschichtung auf einem transluzenten oder transparenten substrat

Country Status (10)

Country Link
US (1) US6639178B2 (de)
EP (1) EP1263538B1 (de)
CN (1) CN1220557C (de)
AT (1) ATE299758T1 (de)
AU (1) AU2001228195A1 (de)
BE (1) BE1013237A3 (de)
DE (1) DE60112053T2 (de)
GB (1) GB2375499B (de)
WO (1) WO2001053011A1 (de)
ZA (1) ZA200205667B (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030044582A1 (en) * 2001-08-28 2003-03-06 Sakoske George Emil Screen printing process
NO316113B1 (no) * 2002-01-24 2003-12-15 Proanalysis As Fremgangsmåte, probe og system for laserbasert rensemekanisme
GR1004453B (el) * 2002-03-01 2004-02-17 Ιδρυμαατεχνολογιασακαιαερευνασα}Ι@Τ@Ε@Bαα Μεθοδοσακαιασυστημααγιαατονακαθαρισμοαεπιφανειωναμεατηασυγχρονηαχρησηαπαλμωναlaserαδυοαδιαφορετικωναμηκωνακυματος
US7419887B1 (en) * 2004-07-26 2008-09-02 Quick Nathaniel R Laser assisted nano deposition
GB0500123D0 (en) 2005-01-06 2005-02-09 Pilkington Plc Glazing
US20070130754A1 (en) * 2005-12-14 2007-06-14 Michael Fein Laser ablation prototyping of RFID antennas
JP2007275962A (ja) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置
GB0706287D0 (en) * 2007-03-30 2007-05-09 Powerlase Ltd A laser method and apparatus
DE102007015767A1 (de) * 2007-03-30 2008-10-02 Oerlikon Optics UK Ltd., Yarnton Methode zum Laserritzen von Solarzellen
DE102007058105A1 (de) * 2007-12-03 2009-06-10 Carl Zeiss Smt Ag Vorrichtung und Verfahren zur Bearbeitung von optischen Elementen mittels Laserablation
WO2009136107A1 (fr) * 2008-04-18 2009-11-12 Shiseido International France Procede de decoration de flacon de verre
FR2930121B1 (fr) * 2008-04-18 2010-05-21 Shiseido Int France Flacon de parfum
FR2933635B1 (fr) * 2008-07-11 2010-09-03 Shiseido Int France Procede de decoration de flacon de verre
DE102008038118A1 (de) * 2008-08-17 2010-02-18 Du, Keming, Dr. Verfahren und Anlagen zum Entschichten mit Laserstrahlen
US8518277B2 (en) * 2009-02-12 2013-08-27 Tpk Touch Solutions Inc. Plastic capacitive touch screen and method of manufacturing same
JP2013505837A (ja) * 2009-09-24 2013-02-21 イ−エスアイ−パイロフォトニクス レーザーズ インコーポレイテッド 有益なパルス形状を有するレーザパルスのバーストを使用して薄膜材料にラインをスクライブする方法及び装置
FR2957848A1 (fr) * 2010-03-25 2011-09-30 Lotoise D Evaporation Solev Soc Corps creux tel qu'un flacon pour la parfumerie ou la cosmetique ayant un motif par enlevement localise d'un revetement.
FR2958661B1 (fr) * 2010-04-09 2014-07-18 Lotoise D Evaporation Solev Soc Contenant comprenant une couche de revetement de metallisation d'epaisseur controlee.
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
CN102097529A (zh) * 2010-11-05 2011-06-15 张立国 一种紫外激光薄膜太阳能电池清边方法
US9895771B2 (en) * 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
BR112014017114B1 (pt) * 2012-03-05 2018-10-16 Saint Gobain processo para produzir um painel de vidro laminado e dispositivo para tratar a laser um filme de polímero revestido
US9308616B2 (en) 2013-01-21 2016-04-12 Innovative Finishes LLC Refurbished component, electronic device including the same, and method of refurbishing a component of an electronic device
EP3174662B1 (de) * 2014-07-29 2021-10-20 Gentex Corporation Verfahren zur laserablation mit reduzierten visuellen effekten
US9895772B2 (en) 2014-10-03 2018-02-20 Gentex Corporation Second surface laser ablation
CN108351564B (zh) 2015-06-19 2020-10-09 金泰克斯公司 第二表面激光烧蚀
CN105030168B (zh) * 2015-06-25 2017-11-10 武汉大学 基于飞秒激光的室内清洁外部玻璃机器人及方法
US11009760B2 (en) 2017-05-05 2021-05-18 Gentex Corporation Interleaving laser ablation
DE102018005010A1 (de) * 2017-07-13 2019-01-17 Wika Alexander Wiegand Se & Co. Kg Transfer und Aufschmelzen von Schichten
FR3073156B1 (fr) * 2017-11-06 2019-10-18 Compagnie Plastic Omnium Traitement laser des lisieres de marouflage
CN108499984A (zh) * 2018-04-24 2018-09-07 西南交通大学 一种铝合金氧化膜的激光清洗方法
CN108907468B (zh) * 2018-09-26 2021-04-20 武汉华工激光工程有限责任公司 一种激光去除玻璃表面多层涂层的工艺方法
CN109877461A (zh) * 2019-01-30 2019-06-14 大族激光科技产业集团股份有限公司 一种透光底片制作方法及装置
US11421857B2 (en) * 2020-03-31 2022-08-23 One Offs Plus, LLC Methods for decorating a translucent container
CN111893453B (zh) * 2020-07-21 2021-10-22 四川大学 一种在尖锥形陶瓷腔体内壁制备微细金属涂层图案的方法
WO2022066435A1 (en) 2020-09-28 2022-03-31 Corning Incorporated Methods for adjusting beam properties for laser processing coated substrates
CN112570386B (zh) * 2020-12-09 2022-05-24 云南电网有限责任公司临沧供电局 一种微重力环境无尘激光清洗装置和方法
CN114710891A (zh) * 2022-04-02 2022-07-05 中国科学院福建物质结构研究所 一种在透明材料上打印电路的设备和方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235154A (en) * 1992-04-28 1993-08-10 International Business Machines Corporation Laser removal of metal interconnects
TW284907B (en) * 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
FR2760986A1 (fr) * 1997-03-24 1998-09-25 Centre Nat Rech Scient Procede pour le controle d'un processus d'ablation laser, applications d'un tel procede et equipement pour la mise en oeuvre de ce procede
US5986234A (en) * 1997-03-28 1999-11-16 The Regents Of The University Of California High removal rate laser-based coating removal system
DE19715702A1 (de) * 1997-04-15 1998-10-22 Fraunhofer Ges Forschung Verfahren zum selektiven Abtragen einer oder mehrerer Schichten

Also Published As

Publication number Publication date
DE60112053T2 (de) 2006-04-27
WO2001053011A1 (fr) 2001-07-26
AU2001228195A1 (en) 2001-07-31
GB0218941D0 (en) 2002-09-25
BE1013237A3 (fr) 2001-11-06
US6639178B2 (en) 2003-10-28
EP1263538B1 (de) 2005-07-20
DE60112053D1 (de) 2005-08-25
CN1220557C (zh) 2005-09-28
EP1263538A1 (de) 2002-12-11
US20030075531A1 (en) 2003-04-24
GB2375499A (en) 2002-11-20
ZA200205667B (en) 2003-08-18
HK1051832A1 (en) 2003-08-22
GB2375499B (en) 2004-01-14
CN1395514A (zh) 2003-02-05

Similar Documents

Publication Publication Date Title
ATE299758T1 (de) Verfahren zum lokalen entfernen einer beschichtung auf einem transluzenten oder transparenten substrat
ATE186857T1 (de) Vorrichtung zum härten einer schicht auf einem substrat
DE68923135D1 (de) Verfahren zur Herstellung einer elektro-optischen Vorrichtung mit einem umgekehrten durchsichtigen Substrat.
DE69416012D1 (de) Verfahren zum Herstellen einer lichtemittierenden Diode mit transparentem Substrat
ATE244150T1 (de) Laserbeschriftungsverfahren
ATE162231T1 (de) Verfahren zur herstellung einer gradientenschicht
DE69711017D1 (de) Co2 lasermarkierung beschichteter oberflächen zur produktidentifikation
WO2005072437A3 (en) Systems and methods for laser texturing of surfaces
DE3676128D1 (de) Verfahren zur herstellung von leiterplatten mit darin verlegten draehten und damit hergestellte artikel.
DE59810353D1 (de) II-VI-HALBLEITERBAUELEMENT MIT MINDESTENS EINEM ÜBERGANG VON EINER Se-ENTHALTENDEN SCHICHT AUF EINE BeTe-ENTHALTENDE SCHICHT UND VERFAHREN ZUM HERSTELLEN DES ÜBERGANGES
KR101881549B1 (ko) 절단방법, 가공대상물 절단방법 및 광투과성재료 절단방법
JPS5890390A (ja) 脆性材製物品の非接触式表面加工方法及びその装置
DE59508233D1 (de) Verfahren zur herstellung eines datenträgers
ATE516598T1 (de) Verfahren zur steuerung des herstellungsprozesses einer photoelektrischen wandlervorrichtung
BR8103496A (pt) Metodo para a produacao de cohidrolisado aquoso adaptado pra adesao a um substrato plastico composicao aquosa de revestimento para uso como revestimento de topo para substrats plasticos artigos compreendendo o dito substrato e processo para a formacao de revestimento resistente a abrasao sobre o dito substrato nao aperelhado
DE69334180D1 (de) Verfahren zur herstellung eines halbleiterbauelements mit mindestens einem chip und entsprechendes bauelement.
ATE519136T1 (de) Laser-oberflächenbehandlung
DE68905556D1 (de) Verfahren zur herstellung einer transparenten schicht.
DE59107376D1 (de) Verfahren und Vorrichtung zur Herstellung von Mikrostrukturen auf einem lichtempfindlich beschichteten Substrat durch fokussierte Laserstrahlung
KR930001142A (ko) 광학 판독 데이타 메모리에 정보를 메모리시키는 방법
DE59904194D1 (de) Verfahren und vorrichtung zum positionieren von kanten, insbesondere beim rohrschweissen
DE50107357D1 (de) Mit einem laserstrahl beschriftetes etikett, sowie verfahren und vorrichtung zu seiner herstellung
DE59104278D1 (de) Verfahren zur Vorbereitung einer Substratoberfläche für die Verklebung mit ativierbaren Klebstoffen durch Aufbringen einer einen Aktivator enthaltenden Schicht auf die Substatoberfläche.
ATE203214T1 (de) Ein metallischer gegenstand mit visuell kontrastierenden oberflächenbereichen
Gaspar et al. A study of the effect of the wavelength in the Q-switched Nd: YAG laser cleaning of gilded wood

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties