ATE302997T1 - Verfahren zur unterbrechung von metalldrähten - Google Patents

Verfahren zur unterbrechung von metalldrähten

Info

Publication number
ATE302997T1
ATE302997T1 AT99913015T AT99913015T ATE302997T1 AT E302997 T1 ATE302997 T1 AT E302997T1 AT 99913015 T AT99913015 T AT 99913015T AT 99913015 T AT99913015 T AT 99913015T AT E302997 T1 ATE302997 T1 AT E302997T1
Authority
AT
Austria
Prior art keywords
metal
hole
ablated
metal wires
pulsed
Prior art date
Application number
AT99913015T
Other languages
English (en)
Inventor
Paul Alan Basore
Neil Barrett
Trevor Young
Original Assignee
Csg Solar Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Csg Solar Ag filed Critical Csg Solar Ag
Application granted granted Critical
Publication of ATE302997T1 publication Critical patent/ATE302997T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Separation By Low-Temperature Treatments (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photovoltaic Devices (AREA)
AT99913015T 1998-04-09 1999-04-09 Verfahren zur unterbrechung von metalldrähten ATE302997T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPP2903A AUPP290398A0 (en) 1998-04-09 1998-04-09 Aluminium film interrupting process
PCT/AU1999/000268 WO1999053554A1 (en) 1998-04-09 1999-04-09 Metal film interrupting process

Publications (1)

Publication Number Publication Date
ATE302997T1 true ATE302997T1 (de) 2005-09-15

Family

ID=3807162

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99913015T ATE302997T1 (de) 1998-04-09 1999-04-09 Verfahren zur unterbrechung von metalldrähten

Country Status (6)

Country Link
EP (1) EP1090430B1 (de)
AT (1) ATE302997T1 (de)
AU (1) AUPP290398A0 (de)
DE (1) DE69926891T2 (de)
ES (1) ES2244184T3 (de)
WO (1) WO1999053554A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPQ385899A0 (en) 1999-11-04 1999-11-25 Pacific Solar Pty Limited Formation of contacts on thin films
ES2522582T3 (es) * 2007-08-31 2014-11-17 Aperam Alloys Imphy Sustrato metálico texturizado cristalográficamente, dispositivo texturizado cristalográficamente, célula y módulo fotovoltaico que comprenden un dispositivo de este tipo, y procedimiento de depósito de capas finas

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783421A (en) * 1985-04-15 1988-11-08 Solarex Corporation Method for manufacturing electrical contacts for a thin-film semiconductor device
DE3514824A1 (de) * 1985-04-24 1986-11-06 Siemens Ag Verfahren zur bildung von schmalen, metallfreien streifen in der metallschicht von kunststoffolien
DE3705500A1 (de) * 1987-02-20 1988-09-01 Siemens Ag Verfahren zur strukturierung von solarzellen mit hilfe eines lasers im pulsbetrieb
NL8801553A (nl) * 1988-06-17 1990-01-16 Tno Werkwijze voor het, onder toepassing van een laserbundel, micro-bewerken van het oppervlak van een werkstuk.
JP3150322B2 (ja) * 1990-05-18 2001-03-26 株式会社日立製作所 レーザによる配線切断加工方法及びレーザ加工装置
AUPN736195A0 (en) * 1995-12-29 1996-01-25 Pacific Solar Pty Limited Improved laser grooving method

Also Published As

Publication number Publication date
ES2244184T3 (es) 2005-12-01
DE69926891D1 (de) 2005-09-29
EP1090430A1 (de) 2001-04-11
EP1090430A4 (de) 2004-05-26
WO1999053554A1 (en) 1999-10-21
AUPP290398A0 (en) 1998-05-07
EP1090430B1 (de) 2005-08-24
DE69926891T2 (de) 2006-06-14

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties