ATE307363T1 - Ic-karte und ihre struktur - Google Patents
Ic-karte und ihre strukturInfo
- Publication number
- ATE307363T1 ATE307363T1 AT99905190T AT99905190T ATE307363T1 AT E307363 T1 ATE307363 T1 AT E307363T1 AT 99905190 T AT99905190 T AT 99905190T AT 99905190 T AT99905190 T AT 99905190T AT E307363 T1 ATE307363 T1 AT E307363T1
- Authority
- AT
- Austria
- Prior art keywords
- flat coil
- semiconductor device
- conductor
- terminals
- press
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Credit Cards Or The Like (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3162498A JP3542266B2 (ja) | 1998-02-13 | 1998-02-13 | Icカード及びフレーム |
| JP6091698 | 1998-03-12 | ||
| JP25292098A JP3542281B2 (ja) | 1998-03-12 | 1998-09-07 | Icカード及びicカード用フレーム |
| PCT/JP1999/000581 WO1999041699A1 (fr) | 1998-02-13 | 1999-02-10 | Carte a circuit integre et sa structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE307363T1 true ATE307363T1 (de) | 2005-11-15 |
Family
ID=27287385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99905190T ATE307363T1 (de) | 1998-02-13 | 1999-02-10 | Ic-karte und ihre struktur |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6252777B1 (de) |
| EP (1) | EP0996082B1 (de) |
| KR (1) | KR100594829B1 (de) |
| CN (1) | CN1217396C (de) |
| AT (1) | ATE307363T1 (de) |
| AU (1) | AU2546499A (de) |
| DE (1) | DE69927765T2 (de) |
| NO (1) | NO994964D0 (de) |
| WO (1) | WO1999041699A1 (de) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3484356B2 (ja) * | 1998-09-28 | 2004-01-06 | 新光電気工業株式会社 | Icカード及びicカード用アンテナ並びにicカード用アンテナフレーム |
| JP2001188891A (ja) * | 2000-01-05 | 2001-07-10 | Shinko Electric Ind Co Ltd | 非接触型icカード |
| JP3809056B2 (ja) * | 2000-09-14 | 2006-08-16 | 新光電気工業株式会社 | Icカード |
| JP2002319011A (ja) * | 2001-01-31 | 2002-10-31 | Canon Inc | 半導体装置、半導体装置の製造方法及び電子写真装置 |
| DE10117994A1 (de) * | 2001-04-10 | 2002-10-24 | Orga Kartensysteme Gmbh | Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten |
| DE10122416A1 (de) | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Verfahren und Halbzeug zur Herstellung einer Chipkarte mit Spule |
| JP4789348B2 (ja) * | 2001-05-31 | 2011-10-12 | リンテック株式会社 | 面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法 |
| WO2003007232A1 (en) * | 2001-07-12 | 2003-01-23 | Sokymat S.A. | Lead frame antenna |
| JP4114446B2 (ja) * | 2002-09-13 | 2008-07-09 | ソニー株式会社 | アンテナ装置及びこれを用いた読み出し書き込み装置、情報処理装置、通信方法並びにアンテナ装置の製造方法 |
| JP4141857B2 (ja) * | 2003-02-18 | 2008-08-27 | 日立マクセル株式会社 | 半導体装置 |
| KR101014154B1 (ko) * | 2003-08-05 | 2011-02-14 | 린텍 가부시키가이샤 | 플립 칩 실장용 기판 |
| TWI457835B (zh) * | 2004-02-04 | 2014-10-21 | Semiconductor Energy Lab | 攜帶薄膜積體電路的物品 |
| USD512095S1 (en) * | 2004-06-03 | 2005-11-29 | American Express Travel Related Services Company, Inc. | Card with an antenna and a blue rectangle |
| USD508261S1 (en) * | 2004-06-03 | 2005-08-09 | American Express Travel Related Services Company, Inc. | Transparent card with an antenna and a rectangle |
| USD507298S1 (en) * | 2004-06-03 | 2005-07-12 | American Express Travel Related Services Company, Inc. | Card with an antenna and a rectangle |
| USD510103S1 (en) * | 2004-06-03 | 2005-09-27 | American Express Travel Related Services Company, Inc. | Transparent card with an antenna |
| USD507598S1 (en) * | 2004-06-03 | 2005-07-19 | American Express Travel Related Services Company, Inc. | Transparent card with an antenna and a blue rectangle |
| US7061769B1 (en) * | 2005-03-11 | 2006-06-13 | Jung-Che Chang | USB/OTG-interface storage card |
| KR100956683B1 (ko) * | 2007-09-20 | 2010-05-10 | 삼성전기주식회사 | 수소발생장치의 전극연결방법 및 그것을 이용한수소발생장치 |
| JP5248224B2 (ja) * | 2008-07-09 | 2013-07-31 | リンテック株式会社 | 電子回路及びicタグ |
| CN110033931B (zh) * | 2018-01-12 | 2021-10-29 | 乾坤科技股份有限公司 | 电子装置及其制作方法 |
| CN109192470A (zh) * | 2018-08-27 | 2019-01-11 | 昆山联滔电子有限公司 | 一种线圈装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62104128A (ja) * | 1985-10-31 | 1987-05-14 | Toshiba Corp | 位置検出装置 |
| JPS63104128A (ja) | 1986-10-21 | 1988-05-09 | Nec Corp | 端末装置における画面フオ−マツトデ−タ格納方式 |
| JPH06310324A (ja) | 1993-04-21 | 1994-11-04 | Nippon Mektron Ltd | 平面コイル |
| FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
| DE4431606A1 (de) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Chipkartenmodul für eine kontaktlose Chipkarte und Verfahren zu deren Herstellung |
| DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
| DE4446369A1 (de) * | 1994-12-23 | 1996-06-27 | Giesecke & Devrient Gmbh | Datenträger mit einem elektronischen Modul |
| US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
| JP2814477B2 (ja) | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
| DE19527359A1 (de) * | 1995-07-26 | 1997-02-13 | Giesecke & Devrient Gmbh | Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit |
| KR19990035991A (ko) * | 1995-08-01 | 1999-05-25 | 노버트 토마셰크, 요셉 발크너 | 비접촉 작용 전송 시스템 및 콤포넌트를 구비한 비접촉 작용카드형 데이터 캐리어와 이런 카드형 데이터 캐리어 및 그모듈의 생산 방법 |
| EP0868706A1 (de) | 1995-12-22 | 1998-10-07 | Sempac SA | Verfahren zur herstellung einer chipkarte für kontaktlosen betrieb |
| DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
| US6255725B1 (en) * | 1998-05-28 | 2001-07-03 | Shinko Electric Industries Co., Ltd. | IC card and plane coil for IC card |
| DE19923807A1 (de) * | 1999-05-19 | 2000-11-23 | Deutsche Telekom Ag | Verfahren zur Erhöhung der Sicherheit bei digitalen Unterschriften |
-
1999
- 1999-02-10 CN CN998001341A patent/CN1217396C/zh not_active Expired - Fee Related
- 1999-02-10 EP EP99905190A patent/EP0996082B1/de not_active Expired - Lifetime
- 1999-02-10 KR KR1019997009241A patent/KR100594829B1/ko not_active Expired - Fee Related
- 1999-02-10 US US09/402,946 patent/US6252777B1/en not_active Expired - Fee Related
- 1999-02-10 DE DE69927765T patent/DE69927765T2/de not_active Expired - Fee Related
- 1999-02-10 AU AU25464/99A patent/AU2546499A/en not_active Abandoned
- 1999-02-10 AT AT99905190T patent/ATE307363T1/de not_active IP Right Cessation
- 1999-02-10 WO PCT/JP1999/000581 patent/WO1999041699A1/ja not_active Ceased
- 1999-10-12 NO NO994964A patent/NO994964D0/no unknown
-
2001
- 2001-01-25 US US09/768,607 patent/US6452806B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU2546499A (en) | 1999-08-30 |
| WO1999041699A1 (fr) | 1999-08-19 |
| KR20010006162A (ko) | 2001-01-26 |
| US6252777B1 (en) | 2001-06-26 |
| KR100594829B1 (ko) | 2006-07-03 |
| CN1217396C (zh) | 2005-08-31 |
| HK1028660A1 (en) | 2001-02-23 |
| DE69927765T2 (de) | 2006-07-06 |
| DE69927765D1 (de) | 2006-03-02 |
| EP0996082B1 (de) | 2005-10-19 |
| US6452806B2 (en) | 2002-09-17 |
| EP0996082A4 (de) | 2001-10-31 |
| CN1256776A (zh) | 2000-06-14 |
| US20010004136A1 (en) | 2001-06-21 |
| NO994964D0 (no) | 1999-10-12 |
| EP0996082A1 (de) | 2000-04-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |