ATE307363T1 - Ic-karte und ihre struktur - Google Patents

Ic-karte und ihre struktur

Info

Publication number
ATE307363T1
ATE307363T1 AT99905190T AT99905190T ATE307363T1 AT E307363 T1 ATE307363 T1 AT E307363T1 AT 99905190 T AT99905190 T AT 99905190T AT 99905190 T AT99905190 T AT 99905190T AT E307363 T1 ATE307363 T1 AT E307363T1
Authority
AT
Austria
Prior art keywords
flat coil
semiconductor device
conductor
terminals
press
Prior art date
Application number
AT99905190T
Other languages
English (en)
Inventor
Ikeda Takashi
Akagawa Matatoshi
Ito Daisuke
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3162498A external-priority patent/JP3542266B2/ja
Priority claimed from JP25292098A external-priority patent/JP3542281B2/ja
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Application granted granted Critical
Publication of ATE307363T1 publication Critical patent/ATE307363T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Credit Cards Or The Like (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
AT99905190T 1998-02-13 1999-02-10 Ic-karte und ihre struktur ATE307363T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3162498A JP3542266B2 (ja) 1998-02-13 1998-02-13 Icカード及びフレーム
JP6091698 1998-03-12
JP25292098A JP3542281B2 (ja) 1998-03-12 1998-09-07 Icカード及びicカード用フレーム
PCT/JP1999/000581 WO1999041699A1 (fr) 1998-02-13 1999-02-10 Carte a circuit integre et sa structure

Publications (1)

Publication Number Publication Date
ATE307363T1 true ATE307363T1 (de) 2005-11-15

Family

ID=27287385

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99905190T ATE307363T1 (de) 1998-02-13 1999-02-10 Ic-karte und ihre struktur

Country Status (9)

Country Link
US (2) US6252777B1 (de)
EP (1) EP0996082B1 (de)
KR (1) KR100594829B1 (de)
CN (1) CN1217396C (de)
AT (1) ATE307363T1 (de)
AU (1) AU2546499A (de)
DE (1) DE69927765T2 (de)
NO (1) NO994964D0 (de)
WO (1) WO1999041699A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484356B2 (ja) * 1998-09-28 2004-01-06 新光電気工業株式会社 Icカード及びicカード用アンテナ並びにicカード用アンテナフレーム
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型icカード
JP3809056B2 (ja) * 2000-09-14 2006-08-16 新光電気工業株式会社 Icカード
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
DE10117994A1 (de) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten
DE10122416A1 (de) 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Verfahren und Halbzeug zur Herstellung einer Chipkarte mit Spule
JP4789348B2 (ja) * 2001-05-31 2011-10-12 リンテック株式会社 面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法
WO2003007232A1 (en) * 2001-07-12 2003-01-23 Sokymat S.A. Lead frame antenna
JP4114446B2 (ja) * 2002-09-13 2008-07-09 ソニー株式会社 アンテナ装置及びこれを用いた読み出し書き込み装置、情報処理装置、通信方法並びにアンテナ装置の製造方法
JP4141857B2 (ja) * 2003-02-18 2008-08-27 日立マクセル株式会社 半導体装置
KR101014154B1 (ko) * 2003-08-05 2011-02-14 린텍 가부시키가이샤 플립 칩 실장용 기판
TWI457835B (zh) * 2004-02-04 2014-10-21 Semiconductor Energy Lab 攜帶薄膜積體電路的物品
USD512095S1 (en) * 2004-06-03 2005-11-29 American Express Travel Related Services Company, Inc. Card with an antenna and a blue rectangle
USD508261S1 (en) * 2004-06-03 2005-08-09 American Express Travel Related Services Company, Inc. Transparent card with an antenna and a rectangle
USD507298S1 (en) * 2004-06-03 2005-07-12 American Express Travel Related Services Company, Inc. Card with an antenna and a rectangle
USD510103S1 (en) * 2004-06-03 2005-09-27 American Express Travel Related Services Company, Inc. Transparent card with an antenna
USD507598S1 (en) * 2004-06-03 2005-07-19 American Express Travel Related Services Company, Inc. Transparent card with an antenna and a blue rectangle
US7061769B1 (en) * 2005-03-11 2006-06-13 Jung-Che Chang USB/OTG-interface storage card
KR100956683B1 (ko) * 2007-09-20 2010-05-10 삼성전기주식회사 수소발생장치의 전극연결방법 및 그것을 이용한수소발생장치
JP5248224B2 (ja) * 2008-07-09 2013-07-31 リンテック株式会社 電子回路及びicタグ
CN110033931B (zh) * 2018-01-12 2021-10-29 乾坤科技股份有限公司 电子装置及其制作方法
CN109192470A (zh) * 2018-08-27 2019-01-11 昆山联滔电子有限公司 一种线圈装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62104128A (ja) * 1985-10-31 1987-05-14 Toshiba Corp 位置検出装置
JPS63104128A (ja) 1986-10-21 1988-05-09 Nec Corp 端末装置における画面フオ−マツトデ−タ格納方式
JPH06310324A (ja) 1993-04-21 1994-11-04 Nippon Mektron Ltd 平面コイル
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4431606A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Chipkartenmodul für eine kontaktlose Chipkarte und Verfahren zu deren Herstellung
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
DE4446369A1 (de) * 1994-12-23 1996-06-27 Giesecke & Devrient Gmbh Datenträger mit einem elektronischen Modul
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
JP2814477B2 (ja) 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式icカード及びその製造方法
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
KR19990035991A (ko) * 1995-08-01 1999-05-25 노버트 토마셰크, 요셉 발크너 비접촉 작용 전송 시스템 및 콤포넌트를 구비한 비접촉 작용카드형 데이터 캐리어와 이런 카드형 데이터 캐리어 및 그모듈의 생산 방법
EP0868706A1 (de) 1995-12-22 1998-10-07 Sempac SA Verfahren zur herstellung einer chipkarte für kontaktlosen betrieb
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
US6255725B1 (en) * 1998-05-28 2001-07-03 Shinko Electric Industries Co., Ltd. IC card and plane coil for IC card
DE19923807A1 (de) * 1999-05-19 2000-11-23 Deutsche Telekom Ag Verfahren zur Erhöhung der Sicherheit bei digitalen Unterschriften

Also Published As

Publication number Publication date
AU2546499A (en) 1999-08-30
WO1999041699A1 (fr) 1999-08-19
KR20010006162A (ko) 2001-01-26
US6252777B1 (en) 2001-06-26
KR100594829B1 (ko) 2006-07-03
CN1217396C (zh) 2005-08-31
HK1028660A1 (en) 2001-02-23
DE69927765T2 (de) 2006-07-06
DE69927765D1 (de) 2006-03-02
EP0996082B1 (de) 2005-10-19
US6452806B2 (en) 2002-09-17
EP0996082A4 (de) 2001-10-31
CN1256776A (zh) 2000-06-14
US20010004136A1 (en) 2001-06-21
NO994964D0 (no) 1999-10-12
EP0996082A1 (de) 2000-04-26

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Legal Events

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