ATE308111T1 - Elektromechanische vorrichtung für montage auf leiterplattenunterseite - Google Patents

Elektromechanische vorrichtung für montage auf leiterplattenunterseite

Info

Publication number
ATE308111T1
ATE308111T1 AT01935293T AT01935293T ATE308111T1 AT E308111 T1 ATE308111 T1 AT E308111T1 AT 01935293 T AT01935293 T AT 01935293T AT 01935293 T AT01935293 T AT 01935293T AT E308111 T1 ATE308111 T1 AT E308111T1
Authority
AT
Austria
Prior art keywords
relay
reed relay
circuit board
traces
signal
Prior art date
Application number
AT01935293T
Other languages
English (en)
Inventor
Mark E Martich
Original Assignee
Kearney National Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kearney National Inc filed Critical Kearney National Inc
Application granted granted Critical
Publication of ATE308111T1 publication Critical patent/ATE308111T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H2001/5888—Terminals of surface mounted devices [SMD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Telephone Function (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Paper (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Structure Of Printed Boards (AREA)
AT01935293T 2000-07-21 2001-05-10 Elektromechanische vorrichtung für montage auf leiterplattenunterseite ATE308111T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21981700P 2000-07-21 2000-07-21
US09/833,867 US6294971B1 (en) 2000-07-21 2001-04-12 Inverted board mounted electromechanical device
PCT/US2001/015159 WO2002009133A1 (en) 2000-07-21 2001-05-10 Inverted board mounted electromechanical device

Publications (1)

Publication Number Publication Date
ATE308111T1 true ATE308111T1 (de) 2005-11-15

Family

ID=26914279

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01935293T ATE308111T1 (de) 2000-07-21 2001-05-10 Elektromechanische vorrichtung für montage auf leiterplattenunterseite

Country Status (10)

Country Link
US (1) US6294971B1 (de)
EP (1) EP1269505B1 (de)
JP (1) JP3961947B2 (de)
KR (1) KR100418293B1 (de)
AT (1) ATE308111T1 (de)
AU (1) AU2001261401A1 (de)
CA (1) CA2370086C (de)
DE (1) DE60114390T2 (de)
TW (1) TW492023B (de)
WO (1) WO2002009133A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004509434A (ja) * 2000-09-18 2004-03-25 ミーダー・エレクトロニック リード片を用いない表面実装用リードリレー
US6954362B2 (en) * 2001-08-31 2005-10-11 Kyocera Wireless Corp. System and method for reducing apparent height of a board system
DE60316412T2 (de) * 2002-03-08 2008-11-20 Kearney-National, Inc. Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
USD509472S1 (en) 2002-11-25 2005-09-13 Vlt Corporation Power converter
USD506438S1 (en) 2002-11-25 2005-06-21 Vlt, Inc. Power converter body
USD505114S1 (en) 2003-04-22 2005-05-17 Vlt, Inc. Ball grid array
US7042702B2 (en) * 2003-12-15 2006-05-09 Intel Corporation Wound capacitor
SE527101C2 (sv) * 2004-05-19 2005-12-20 Volvo Lastvagnar Ab Magnetbrytararrangemang och förfarande för att erhålla en differentialmagnetbrytare
KR20100101688A (ko) * 2008-04-15 2010-09-17 코토 테크놀로지 인코퍼레이티드 개선된 ｃ형 릴레이 및 그것을 이용한 패키지
CN101576524B (zh) * 2008-05-06 2013-05-29 冉芸华 一种磁簧管动态接触阻抗检测装置及其检测方法
CN104658815A (zh) * 2013-11-19 2015-05-27 珠海格力电器股份有限公司 液位开关
US11079253B2 (en) * 2018-04-16 2021-08-03 Avago Technologies International Sales Pte. Limited Wiegand module and methods of forming the same
US10945336B2 (en) * 2018-06-13 2021-03-09 Te Connectivity Corporation Electronic device with relay mounted to substrate
JP2021132075A (ja) * 2020-02-18 2021-09-09 Tdk株式会社 コイル部品を備える回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286241A (en) * 1979-04-30 1981-08-25 Motorola Inc. Apparatus for mounting a reed switch
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment

Also Published As

Publication number Publication date
DE60114390D1 (de) 2005-12-01
KR20020059252A (ko) 2002-07-12
CA2370086A1 (en) 2002-01-31
JP2004505409A (ja) 2004-02-19
KR100418293B1 (ko) 2004-02-14
US6294971B1 (en) 2001-09-25
EP1269505B1 (de) 2005-10-26
CA2370086C (en) 2004-12-14
EP1269505A1 (de) 2003-01-02
AU2001261401A1 (en) 2002-02-05
DE60114390T2 (de) 2006-07-27
JP3961947B2 (ja) 2007-08-22
TW492023B (en) 2002-06-21
EP1269505A4 (de) 2003-05-28
WO2002009133A1 (en) 2002-01-31

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties