ATE308585T1 - Feuerhemmende phosporenthaltende epoxidharzzusammensetzung - Google Patents

Feuerhemmende phosporenthaltende epoxidharzzusammensetzung

Info

Publication number
ATE308585T1
ATE308585T1 AT00984242T AT00984242T ATE308585T1 AT E308585 T1 ATE308585 T1 AT E308585T1 AT 00984242 T AT00984242 T AT 00984242T AT 00984242 T AT00984242 T AT 00984242T AT E308585 T1 ATE308585 T1 AT E308585T1
Authority
AT
Austria
Prior art keywords
epoxy resin
phosphorus element
halogenated
containing epoxy
resin composition
Prior art date
Application number
AT00984242T
Other languages
English (en)
Inventor
Joseph Gan
Alan Goodson
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Application granted granted Critical
Publication of ATE308585T1 publication Critical patent/ATE308585T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT00984242T 1999-12-13 2000-12-11 Feuerhemmende phosporenthaltende epoxidharzzusammensetzung ATE308585T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17042199P 1999-12-13 1999-12-13
PCT/US2000/033647 WO2001042359A1 (en) 1999-12-13 2000-12-11 Flame retardant phosphorus element-containing epoxy resin compositions

Publications (1)

Publication Number Publication Date
ATE308585T1 true ATE308585T1 (de) 2005-11-15

Family

ID=22619787

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00984242T ATE308585T1 (de) 1999-12-13 2000-12-11 Feuerhemmende phosporenthaltende epoxidharzzusammensetzung

Country Status (10)

Country Link
US (1) US6645631B2 (de)
EP (1) EP1268665B1 (de)
JP (2) JP5485487B2 (de)
KR (1) KR100721697B1 (de)
CN (1) CN1423678B (de)
AT (1) ATE308585T1 (de)
AU (1) AU2089601A (de)
DE (1) DE60023752T2 (de)
TW (1) TWI261059B (de)
WO (1) WO2001042359A1 (de)

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4972247B2 (ja) * 1999-12-28 2012-07-11 日立化成工業株式会社 難燃性熱硬化樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
KR100538176B1 (ko) * 2000-07-18 2005-12-21 교세라 케미카르 가부시키가이샤 할로겐 프리 난연성 에폭시수지조성물, 할로겐 프리빌드업 다층판용 난연성 에폭시수지조성물, 프리프레그,동장 적층판, 프린트배선판, 동박부착 수지필름,캐리어부착 수지필름, 빌드업형 적층판 및 빌드업형 다층판
KR20020047333A (ko) * 2000-09-12 2002-06-21 나까니시 히로유끼 인 함유 에폭시 수지, 그 수지를 함유하는 난연성 고내열에폭시 수지 조성물 및 적층판
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
JP2003040968A (ja) * 2001-07-26 2003-02-13 Toto Kasei Co Ltd 新規含燐エポキシ樹脂及び該エポキシ樹脂を含有する難燃性樹脂組成物
US6887950B2 (en) 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
JP4311938B2 (ja) 2001-02-15 2009-08-12 グレート・レークス・ケミカル・コーポレーション 新規のヒドロキシアリールホスフィンオキシド、グリシジルエーテル、並びにそれらから誘導されるエポキシ組成物、複合材料、及び積層物
US6641923B2 (en) * 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
JP2004051938A (ja) * 2002-05-30 2004-02-19 Sumitomo Chem Co Ltd エポキシ樹脂組成物およびその用途
WO2003102060A1 (en) * 2002-05-30 2003-12-11 Dow Global Technologies, Inc. Halogen free ignition resistant thermoplastic resin compositions
US20040101689A1 (en) * 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
KR20040072440A (ko) * 2003-02-12 2004-08-18 주식회사 금강고려화학 환경친화형 반도체소자 봉지용 에폭시수지 조성물
WO2004092265A1 (ja) * 2003-04-17 2004-10-28 Goo Chemical Co., Ltd. 難燃性エポキシ樹脂組成物、同組成物を含有するプリプレグ、積層板およびプリント配線板
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
WO2004111121A1 (ja) * 2003-06-12 2004-12-23 Fuji Electric Holdings Co., Ltd. 反応性難燃剤及びそれを用いた難燃性樹脂加工品
KR100569759B1 (ko) * 2004-01-16 2006-04-11 주식회사 엘지화학 비할로겐계 난연성 수지 조성물, 이를 이용한 프리프레그및 적층판
CN1922252B (zh) * 2004-02-18 2011-06-15 亨斯迈先进材料（瑞士）有限公司 使用硅氧烷的阻燃剂组合物
EP1731553B1 (de) * 2004-02-27 2019-02-20 Toray Industries, Inc. Epoxidharzzusammensetzung für kohlefaserverstärkten verbundwerkstoff, prepreg, integrierter formkörper, flächengebilde aus faserverstärktem verbundwerkstoff und schrank für elektrische/elektronische geräte
CN102653598B (zh) * 2004-05-28 2015-05-13 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
TWI374137B (en) * 2004-09-28 2012-10-11 Huntsman Adv Mat Switzerland Organic compounds
TW200626659A (en) * 2004-11-05 2006-08-01 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same
JP2008517136A (ja) * 2004-11-26 2008-05-22 エルジー・ケム・リミテッド 非ハロゲン難燃性エポキシ樹脂組成物、ならびにそれを用いたプレプレッグおよび銅クラッドラミネート
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
KR100648463B1 (ko) * 2005-09-26 2006-11-27 삼성전기주식회사 난연성 수지 조성물
JP5502326B2 (ja) * 2005-12-22 2014-05-28 ダウ グローバル テクノロジーズ エルエルシー 硬化性エポキシ樹脂組成物およびそれから作られた積層体
TW200732412A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen composition having phosphor-containing epoxy resin
TW200732448A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen adhesive containing polyphosphate compounds
US7687722B2 (en) * 2006-10-03 2010-03-30 Endicott Interconnect Technologies, Inc. Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
US8840967B2 (en) 2006-10-11 2014-09-23 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing printed circuit board including flame retardant insulation layer
KR100781582B1 (ko) * 2006-10-11 2007-12-05 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물 및 이를 이용한인쇄회로기판
TWI342322B (en) * 2007-03-28 2011-05-21 Grand Tek Advance Material Science Co Ltd Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad laminate
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
KR101026531B1 (ko) 2007-08-30 2011-04-01 한국화학연구원 할로겐프리형 난연성 접착제 조성물
WO2009045817A1 (en) * 2007-09-28 2009-04-09 Dow Global Technologies Inc. Epoxy resin formulations
TWI388621B (zh) * 2008-01-04 2013-03-11 Iteq Corp 樹脂組成物及其應用
JP5603256B2 (ja) 2008-01-23 2014-10-08 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂硬化剤組成物及び前記硬化剤組成物を含むエポキシ樹脂組成物
TWI437037B (zh) * 2008-02-21 2014-05-11 Huntsman Adv Mat Americas Inc 用於高玻璃轉化溫度（ｔｇ）應用之以不含鹵素之苯并為主之可固化組合物
WO2009108453A1 (en) * 2008-02-26 2009-09-03 Dow Global Technologies Inc. Brominated polymers as flame additives and polymer systems containing same
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
TWI381017B (zh) * 2008-06-09 2013-01-01 Taiwan Union Technology Corp Composition and Manufacturing Method of Halogen - free Printed Circuit Board with Low Dielectric Loss
CN101307170B (zh) * 2008-07-10 2011-08-10 天津市凯华绝缘材料有限公司 一种阻燃含磷环氧粉末组合物
US20110201724A1 (en) * 2008-10-29 2011-08-18 Levchik Sergei V Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof
CN101418205B (zh) * 2008-12-10 2012-05-09 华烁科技股份有限公司 一种无卤阻燃胶粘剂及其在半固化片和多层印制板方面的应用
KR101593529B1 (ko) * 2009-01-06 2016-02-16 블루 큐브 아이피 엘엘씨 비브롬화 난연성 에폭시 수지 중 금속 화합물
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
US7842401B2 (en) * 2009-03-24 2010-11-30 Iteq Corporation Halogen-free varnish and prepreg thereof
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
TWI422620B (zh) * 2009-06-18 2014-01-11 Kangnam Chemical Co Ltd 製造阻燃及經磷改質之硬化劑的方法
GB2472423B (en) * 2009-08-05 2012-01-11 Gurit Uk Ltd Fire-retardant composite materials
CN101643570B (zh) * 2009-08-24 2011-08-10 广东生益科技股份有限公司 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板
CN101684191B (zh) * 2009-08-27 2012-03-07 广东生益科技股份有限公司 无卤高频树脂组合物及用其制成的预浸料与层压板
CN101691449B (zh) * 2009-09-04 2011-05-18 广东生益科技股份有限公司 提高苯氧基磷腈化合物阻燃效率的方法及其制成的预浸料、层压板与印制电路用层压板
KR101091305B1 (ko) 2009-10-09 2011-12-07 유니플러스 일렉트로닉스 컴퍼니 리미티드 추가 절연층들을 쌓아 올리기 위한 고열전도도 및 저손실계수를 갖는 점착성 바니시를 마련하는 방법
US8088490B2 (en) * 2009-10-25 2012-01-03 Iteq Corporation Varnish, prepreg, and substrate thereof
CN102695744A (zh) * 2009-11-06 2012-09-26 陶氏环球技术有限责任公司 用于电层合体的存储稳定的环氧树脂组合物
CN102648247B (zh) 2009-12-02 2015-10-14 陶氏环球技术有限责任公司 涂料组合物
US9006312B2 (en) 2009-12-02 2015-04-14 Dow Global Technologies Llc Composite compositions
JP2013512988A (ja) 2009-12-02 2013-04-18 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂組成物
EP2519533B1 (de) 2009-12-30 2016-07-13 Blue Cube IP LLC Wärmehärtende monomere und zusammensetzungen mit phosphor- und cyanatgruppen
US9267030B2 (en) 2010-01-29 2016-02-23 Blue Cube Ip Llc Compositions having phosphorus-containing compounds
EP2528929A1 (de) 2010-01-29 2012-12-05 Dow Global Technologies LLC Wärmehärtende monomere und zusammensetzungen mit phosphor- und cyanatgruppen
WO2011100049A2 (en) * 2010-02-12 2011-08-18 Dow Global Technologies Llc Phosphorus-containing epoxy resin
CN102250447B (zh) * 2010-05-21 2014-10-22 台燿科技股份有限公司 无卤素的阻燃性环氧树脂组合物及由其制成的预浸材和印刷电路板
CN101914265B (zh) * 2010-07-24 2012-08-29 日立化成电子材料（广州）有限公司 一种无卤含磷阻燃高频环氧树脂类组合物及其在粘结片和覆铜板中的应用
CN103249775A (zh) 2010-07-30 2013-08-14 陶氏环球技术有限责任公司 可固化组合物
CN102372903B (zh) * 2010-08-18 2014-04-16 合正科技股份有限公司 无卤无磷热固型树脂组成物
CN101928444A (zh) * 2010-08-20 2010-12-29 广东生益科技股份有限公司 无卤热固性树脂组合物、使用其制作的半固化片及覆金属箔层压板
CN102382420B (zh) * 2010-09-06 2013-01-16 宏昌电子材料股份有限公司 印刷电路覆铜板用高cti环氧树脂组合物
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
TWI418593B (zh) * 2010-11-10 2013-12-11 Iteq Corp 無鹵環氧樹脂組合物及應用該無鹵環氧樹脂組合物所製成之膠片與基板
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
US20120129414A1 (en) * 2010-11-24 2012-05-24 Chung-Hao Chang Thermosetting resin composition and prepreg or laminate using the same
US9333454B2 (en) 2011-01-21 2016-05-10 International Business Machines Corporation Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants
JP2014503029A (ja) 2011-01-21 2014-02-06 ダウ グローバル テクノロジーズ エルエルシー 電気積層板、高密度相互接続および相互接続基材応用に有用な高性能熱硬化性樹脂
JP5552075B2 (ja) * 2011-02-17 2014-07-16 Ｊｆｅケミカル株式会社 熱硬化性樹脂組成物およびその硬化物
CN102134304B (zh) * 2011-03-03 2012-08-29 沈阳化工大学 一种反应型含磷环氧树脂阻燃剂及其制备方法
EP2705090A1 (de) * 2011-05-02 2014-03-12 Dow Global Technologies LLC Trimethylborat in epoxidharzen
US8900491B2 (en) 2011-05-06 2014-12-02 International Business Machines Corporation Flame retardant filler
US9145488B2 (en) 2011-05-19 2015-09-29 Chemtura Corporation Aluminum phosphorus acid salts as epoxy resin cure inhibitors
US9828501B2 (en) * 2011-05-28 2017-11-28 Robert Valentine Kasowski Flame retardant with compositions
CN102250383B (zh) * 2011-06-28 2013-02-13 华南理工大学 含苯并噁嗪的无卤阻燃剂及含无卤阻燃剂的聚合物材料
US9186641B2 (en) 2011-08-05 2015-11-17 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
JP5899497B2 (ja) * 2011-08-31 2016-04-06 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、ワニス、プリプレグ、プリプレグの製造方法、金属張積層板、金属張積層板の製造方法、プリント配線板、及びプリント配線板の製造方法
US8741804B2 (en) 2011-10-28 2014-06-03 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field
TWI421297B (zh) * 2011-11-04 2014-01-01 Elite Material Co Ltd Halogen-free resin composition and its application of copper foil substrate and printed circuit board
CN103131131B (zh) * 2011-11-23 2015-07-15 台光电子材料股份有限公司 无卤素树脂组合物及其应用的铜箔基板及印刷电路板
KR101976890B1 (ko) 2011-12-20 2019-05-09 다우 글로벌 테크놀로지스 엘엘씨 경화된 에폭시 수지 복합체의 제조 방법
CN102775730A (zh) * 2012-02-29 2012-11-14 深圳光启创新技术有限公司 低介电常数低损耗的浸润料及其应用
EP2829568B1 (de) * 2012-03-23 2018-03-14 Mitsubishi Gas Chemical Company, Inc. Prepreg und laminiertes brett
US8859098B2 (en) 2012-05-18 2014-10-14 Lord Corporation Acrylic adhesion promoters
US9716055B2 (en) 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
WO2014165426A1 (en) * 2013-04-01 2014-10-09 Basf Corporation Flame retardant systems
CN103382242B (zh) * 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
JP5967558B2 (ja) * 2013-07-04 2016-08-10 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ及び積層板
US20150148450A1 (en) * 2013-11-24 2015-05-28 Iteq Corporation Halogen-free low-expansion resin composition
CN103724945B (zh) * 2013-12-31 2016-09-07 广东生益科技股份有限公司 一种无卤环氧树脂组合物及其用途
CN103897385B (zh) * 2014-03-21 2016-01-20 华南理工大学 一种阻燃扩链尼龙6组合物及其制备方法
CN104002525A (zh) * 2014-04-18 2014-08-27 南通诺德电子有限公司 高TG无卤LOW Dk/Df覆铜板的制作方法
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
KR102375986B1 (ko) * 2015-03-13 2022-03-17 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 옥사졸리돈 고리 함유 에폭시 수지, 그 제조 방법, 에폭시 수지 조성물, 및 경화물
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
TWI721024B (zh) * 2015-11-13 2021-03-11 美商Ｉｃｌ Ｉｐ美國股份有限公司 用於熱固性樹脂之活性酯類固化劑化合物、包含彼之阻燃劑組成物、及由其所製成之物件
CN105368001B (zh) * 2015-11-27 2017-11-17 南亚新材料科技股份有限公司 一种无卤环氧树脂组合物和制备方法及其应用
CN107227001B (zh) 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
US11365282B2 (en) 2016-07-25 2022-06-21 Isola Usa Corp. SMA resin formulation
CN110337484B (zh) * 2016-12-14 2022-05-24 溴化合物有限公司 不含锑阻燃性环氧树脂组合物
CN106700548B (zh) * 2016-12-30 2019-04-30 广东生益科技股份有限公司 一种含有苯并噁嗪树脂组合物的制备方法及由其制成的预浸料和层压板
CN106832778B (zh) * 2017-02-13 2019-04-02 广州仑利奇合成树脂有限公司 一种无卤阻燃环氧体系及其制备方法
CN108192281B (zh) * 2017-12-27 2020-12-15 江西生益科技有限公司 一种无卤热固性树脂组合物及使用它的预浸料、层压板、覆金属箔层压板和印刷电路板
GB2571786B (en) * 2018-03-09 2021-06-02 Gurit Uk Ltd Manufacture of fire-retardant sandwich panels
GB201809830D0 (en) * 2018-06-15 2018-08-01 Hexcel Composties Ltd Epoxy resin formulations
CN109280456A (zh) * 2018-07-28 2019-01-29 南京艾利克斯电子科技有限公司 一种电子元器件用涂层材料及其制备方法
KR102161362B1 (ko) * 2018-12-24 2020-10-05 주식회사 하이플럭스 내화 조성물
US20220056261A1 (en) * 2019-03-28 2022-02-24 Safran Cabin Inc. Fire retardant epoxy resin
WO2022040633A1 (en) 2020-08-21 2022-02-24 The University Of Southern Mississippi Phenylphosphine oxide and oxygen stable epoxy polymers and methods of synthesis
CN114685800A (zh) * 2020-12-29 2022-07-01 洛阳尖端技术研究院 含磷超支化多元醇、含磷超支化环氧树脂及其制备方法、组合物及氰酸酯树脂
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
CN116554128B (zh) * 2023-05-08 2025-09-05 四川大学 一种自固化、高模高强的本征阻燃磺胺环氧树脂及其制备方法
CN119242057B (zh) * 2024-12-06 2025-03-25 江苏永金新材料有限公司 一种防水母线槽及其制备工艺
CN119823445B (zh) * 2025-01-23 2025-10-14 中国科学院长春应用化学研究所 一种杂多酸化合物-膦酸酯液体阻燃剂、其制备方法及应用
CN121045259B (zh) * 2025-10-31 2026-03-20 中国科学技术大学 一种多价态含磷改性剂及其制备方法和应用

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124399B2 (de) * 1973-03-19 1976-07-23
US4066628A (en) 1976-08-02 1978-01-03 Mitsubishi Chemical Industries Ltd. Oxazolidone catalyst
JPS5933125B2 (ja) 1980-03-17 1984-08-14 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物
JPS61166822A (ja) * 1985-01-19 1986-07-28 Toshiba Chem Corp 封止用樹脂組成物
US5066735A (en) 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
ATE107677T1 (de) 1989-03-03 1994-07-15 Siemens Ag Epoxidharzmischungen.
EP0384939B1 (de) 1989-03-03 1994-06-22 Siemens Aktiengesellschaft Epoxidharz-Formmassen
JPH02240130A (ja) * 1989-03-15 1990-09-25 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
JPH02240131A (ja) * 1989-03-15 1990-09-25 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
US5112931A (en) 1989-07-17 1992-05-12 Miles Inc. Blocked polyisocyanates for the production of powder coatings with flat finishes
FI902943A7 (fi) 1989-07-19 1991-01-20 Siemens Ag Kuumassa kovettuvia reaktiohartsiseoksia
US5086156A (en) 1989-10-06 1992-02-04 Virginia Tech Intellectual Properties, Inc. Novel phosphorus containing epoxy networks based on trihydrocarbyl phosphine oxides having active substituents
US4973631A (en) 1989-10-06 1990-11-27 Virginia Tech Intellectual Properties Inc. Novel phosphorus containing epoxy networks
JPH03177451A (ja) * 1989-12-04 1991-08-01 Toshiba Chem Corp 封止用樹脂組成物および半導体装置
WO1991015495A1 (en) 1990-04-02 1991-10-17 Pfizer Inc. Benzylphosphonic acid tyrosine kinase inhibitors
JP3092009B2 (ja) * 1990-05-01 2000-09-25 東都化成株式会社 難燃剤及び該難燃剤を含有した熱硬化性難燃性樹脂組成物
SG43193A1 (en) 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
DE4308187A1 (de) 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
FR2703689B1 (fr) * 1993-04-09 1995-06-16 Minnesota Mining & Mfg Composition epoxyde ignifuge pratiquement exempte d'halogene.
DE4432188A1 (de) * 1994-09-09 1996-03-14 Siemens Ag Epoxidharzformmassen zur Umhüllung von elektronischen Bauelementen
TW297034B (de) 1994-09-09 1997-02-01 Siemens Ag
TW294694B (de) 1994-09-09 1997-01-01 Siemens Ag
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
EP0763566A4 (de) * 1995-03-10 1997-05-28 Toshiba Chem Corp Halogenfreie flammhemmende epoxidharzzusammensetzung
EP0742261B1 (de) * 1995-04-10 2000-08-02 Shin-Etsu Chemical Co., Ltd. Epoxyharzmassen zur Einkapselung von Halbleitern, deren Herstellung und Verwendung, sowie damit eingekapselte Halbleiterbauteile
JPH08337709A (ja) * 1995-04-10 1996-12-24 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH11508287A (ja) * 1995-05-24 1999-07-21 シーメンス アクチエンゲゼルシヤフト ハロゲン不含の防炎剤を含むエポキシ樹脂成形コンパウンド
EP0795570A4 (de) * 1995-09-29 2001-01-24 Toshiba Chem Corp Halogenfreie flammwidrige epoxidharzzusammensetzung, und diese zusammensetzung enthaltender prepreg und verbundstoff
US6214455B1 (en) * 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
DE19613061C2 (de) * 1996-04-01 1998-07-02 Clariant Gmbh Phosphormodifizierte Epoxidharze aus Epoxidharzen und phosphorhaltigen Verbindungen
DE19613064C2 (de) * 1996-04-01 1998-12-17 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, Verfahren zu ihrer Herstellung und ihre Verwendung
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
US5859097A (en) * 1996-07-11 1999-01-12 Shell Oil Company Epoxy resin compositions containing red phosphorus
JP3440775B2 (ja) * 1996-08-22 2003-08-25 株式会社日立製作所 樹脂封止型半導体装置及びその製造方法
EP0825217A1 (de) 1996-08-23 1998-02-25 Akzo Nobel N.V. Addukt auf der Basis von einer Bisepoxydverbindung und einer P-Guanamineverbindung
WO1998007731A1 (en) 1996-08-23 1998-02-26 Akzo Nobel N.V. Adduct of an epoxy compound and cyclic phosphite
JP3770342B2 (ja) * 1996-11-26 2006-04-26 大日本インキ化学工業株式会社 リン原子含有エポキシ樹脂の製造方法、難燃性エポキシ樹脂組成物及び電気積層板
DE69825561T3 (de) * 1997-01-21 2009-07-09 Dow Global Technologies, Inc., Midland Latente katalysatoren für epoxidharz-härtungssysteme
JPH10330596A (ja) * 1997-05-30 1998-12-15 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
GB9713526D0 (en) * 1997-06-26 1997-09-03 Dow Deutschland Inc Flame retardant laminating formulations
JP3613724B2 (ja) * 1997-09-09 2005-01-26 東都化成株式会社 リン含有エポキシ樹脂組成物
JP3533973B2 (ja) * 1998-01-27 2004-06-07 東都化成株式会社 リン含有エポキシ樹脂組成物
US6297306B1 (en) * 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
US6207786B1 (en) * 1998-11-10 2001-03-27 Edison Polymer Innovation Corporation Ternary systems of benzoxazine, epoxy, and phenolic resins
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
JP2000273222A (ja) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd 難燃性プリプレグ及び積層板
JP2001002960A (ja) * 1999-06-16 2001-01-09 Sumitomo Durez Co Ltd 難燃性エポキシ樹脂粉体塗料
JP3072099B1 (ja) * 1999-08-17 2000-07-31 東芝ケミカル株式会社 封止用樹脂組成物および半導体封止装置
JP4417494B2 (ja) * 1999-09-17 2010-02-17 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および樹脂封止型半導体装置
JP4535214B2 (ja) * 1999-10-08 2010-09-01 新日鐵化学株式会社 難燃性液状エポキシ樹脂組成物
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法

Also Published As

Publication number Publication date
JP5675698B2 (ja) 2015-02-25
DE60023752D1 (de) 2005-12-08
JP2012197441A (ja) 2012-10-18
HK1051702A1 (en) 2003-08-15
KR100721697B1 (ko) 2007-05-28
EP1268665B1 (de) 2005-11-02
WO2001042359A1 (en) 2001-06-14
TWI261059B (en) 2006-09-01
CN1423678A (zh) 2003-06-11
KR20020082834A (ko) 2002-10-31
CN1423678B (zh) 2010-11-10
US20020119317A1 (en) 2002-08-29
US6645631B2 (en) 2003-11-11
EP1268665A1 (de) 2003-01-02
DE60023752T2 (de) 2006-04-20
JP5485487B2 (ja) 2014-05-07
AU2089601A (en) 2001-06-18
JP2003516455A (ja) 2003-05-13

Similar Documents

Publication Publication Date Title
DE60023752D1 (de) Feuerhemmende phosporenthaltende epoxidharzzusammensetzung
WO2001042253A3 (en) Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
DE60133047D1 (de)
DE60126684D1 (de) Flammwidrige thermoplastische harzzusammensetzung
MY115618A (en) Epoxy resin composition and semiconductor device using the same
EP0945478A4 (de) Vernetzte phenoxyphosphazenverbindungen, flammhemmer, flammhemmende harzzusammensetzungen und formteil aus flammhemmenden harzen
DE60200478D1 (de) Flammhemmende Epoxyharze, die mit Phosphor und Silizium modifiziert sind
MY120855A (en) Flame-retardant resin composition, and prepregs and laminates using such composition.
BR0311575A (pt) Composições de resinas termoplásticas resistentes à ignição isentas de halogênios e produtos obtidos destas
ATE264886T1 (de) Epoxyharzzusammensetzung sowie elektronisches teil
ATE350753T1 (de) Dielektrische zusammensetzung
EP0812883A4 (de) Epoxidharzzusammensetzung
ATE277113T1 (de) Halogenfreie flammhemmende zusammensetzung
BR9806743A (pt) Composições de resina de termocura
EP1614713A4 (de) Flammhemmende epoxidharzzusammensetzung, prepregs damit, schichtpressplatten und leiterplatten
JPS5369255A (en) Polyphenylene sulfide resin composition
MY118097A (en) Flame-retardant resin composition and semiconductor sealant using the same.
TW200516126A (en) Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
EP1095975A3 (de) Flammhemmende Adhäsivmaterialien und Elektromaterialien mit ihrer Verwendung
EP0921158A3 (de) Wärmehärtbaren Zusammensetzungen von Poly(phenylenether)
TWI266790B (en) Resin composition for printed wiring board, prepreg, and laminate using the same
WO2001070867A3 (en) Flame retardant epoxy molding compositions
BR0214764A (pt) Composição de resina
DE59402069D1 (de) Halogenfreie harzmischung, ein diese harzmischung enthaltendes, selbstverlöschendes prepreg sowie dessen verwendung
TW200714665A (en) Flame-retarding epoxy resin composition containing no halogen

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1268665

Country of ref document: EP