ATE308586T1 - Hitzebeständige zusammensetzung - Google Patents

Hitzebeständige zusammensetzung

Info

Publication number: ATE308586T1
Authority: AT; Austria
Prior art keywords: group; compound; oph; cross; phenoxyphosphazene compound
Prior art date: 2001-02-09

Application number

AT02002892T

Other languages

English (en)

Inventor

Toshiyuki Shimizu

Yuji Tada

Kawauchi-Cho Kagasuno

Original Assignee

Toyo Boseki

Otsuka Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-02-09

Filing date

2002-02-08

Publication date

2005-11-15

2002-02-08 Application filed by Toyo Boseki, Otsuka Chemical Co Ltd filed Critical Toyo Boseki

2005-11-15 Application granted granted Critical

2005-11-15 Publication of ATE308586T1 publication Critical patent/ATE308586T1/de

Links

150000001875 compounds Chemical class 0.000 abstract 7
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 5
-1 phosphazene compound Chemical class 0.000 abstract 5
125000004122 cyclic group Chemical group 0.000 abstract 3
239000000126 substance Substances 0.000 abstract 3
238000004132 cross linking Methods 0.000 abstract 2
HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 abstract 2
125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 abstract 1
125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 abstract 1
125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 abstract 1
125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
125000004430 oxygen atom Chemical group O* 0.000 abstract 1
229920001721 polyimide Polymers 0.000 abstract 1
239000009719 polyimide resin Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
- C08G79/02—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing phosphorus
- C08G79/025—Polyphosphazenes
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
- C08L85/02—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers containing phosphorus
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Compositions Of Macromolecular Compounds (AREA)
Adhesive Tapes (AREA)
Inks, Pencil-Leads, Or Crayons (AREA)
Adhesives Or Adhesive Processes (AREA)
Conductive Materials (AREA)
Fireproofing Substances (AREA)
Insulated Conductors (AREA)
Macromonomer-Based Addition Polymer (AREA)

AT02002892T 2001-02-09 2002-02-08 Hitzebeständige zusammensetzung ATE308586T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2001034161A JP5318306B2 (ja)	2001-02-09	2001-02-09	耐熱性組成物

Publications (1)

Publication Number	Publication Date
ATE308586T1 true ATE308586T1 (de)	2005-11-15

Family

ID=18897818

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT02002892T ATE308586T1 (de)	2001-02-09	2002-02-08	Hitzebeständige zusammensetzung

Country Status (8)

Country	Link
US (1)	US6743841B2 (de)
EP (1)	EP1231240B8 (de)
JP (1)	JP5318306B2 (de)
KR (1)	KR100834604B1 (de)
CN (1)	CN1200976C (de)
AT (1)	ATE308586T1 (de)
DE (1)	DE60206980T2 (de)
TW (1)	TW575636B (de)

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WO2004094499A1 (ja) *	2003-04-18	2004-11-04	Kaneka Corporation	熱硬化性樹脂組成物、それを用いてなる積層体、回路基板
JPWO2005007756A1 (ja) *	2003-05-21	2006-08-31	日立化成工業株式会社	プライマ、樹脂付き導体箔、積層板並びに積層板の製造方法
US8063245B2 (en)	2003-06-05	2011-11-22	Kaneka Corporation	Phosphazene compound, photosensitive resin composition and use thereof
JP2005047995A (ja) *	2003-07-30	2005-02-24	Kaneka Corp	難燃性を向上させた耐熱性樹脂組成物およびその利用
EP1731554B1 (de)	2004-03-04	2010-03-03	Hitachi Chemical Co., Ltd.	Prepreg, metallumhülltes laminat und leiterplatte unter verwendung davon
JP4774702B2 (ja) *	2004-03-04	2011-09-14	日立化成工業株式会社	プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板
TW200626659A (en) *	2004-11-05	2006-08-01	Hitachi Chemical Co Ltd	Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same
US20070265422A1 (en) *	2006-05-12	2007-11-15	General Electric Company	Method for making copolymeric polyimide resins
US8633284B2 (en) *	2006-05-12	2014-01-21	General Electric Company	Tailorable polyimide prepolymer blends, crosslinked polymides and articles formed therefrom
US20070265421A1 (en) *	2006-05-12	2007-11-15	General Electric Company	Method for making a prepolymer polyimide resin blend
US20070265416A1 (en) *	2006-05-12	2007-11-15	General Electric Company	Polyimide blend with tailorable properties
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KR101392539B1 (ko) *	2009-11-16	2014-05-07	아사히 가세이 이-매터리얼즈 가부시키가이샤	폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물
KR101738193B1 (ko) *	2009-11-19	2017-05-19	도요보 가부시키가이샤	우레탄 변성 폴리이미드계 난연 수지 조성물
JP5485720B2 (ja) *	2010-01-19	2014-05-07	ソマール株式会社	難燃性粘着剤組成物及びこの組成物を用いた難燃性粘着テープ
JP5920349B2 (ja) *	2011-06-21	2016-05-18	三菱瓦斯化学株式会社	難燃化された脂環式ポリイミド樹脂組成物およびその薄肉成型体
CN103649224B (zh)	2011-07-14	2016-02-10	普立万公司	非卤化阻燃聚碳酸酯复合物
KR20140076784A (ko) *	2012-12-13	2014-06-23	제일모직주식회사	코팅제 조성물, 상기 코팅제 조성물로 형성된 분리막 및 이를 이용한 전지
US10100192B2 (en)	2013-06-13	2018-10-16	Polyone Corporation	Completely non-halogenated flame retardant polycarbonate compounds
US9884961B2 (en)	2013-11-05	2018-02-06	Polyone Corporation	Phosphazene flame retardant polycarbonate compounds
KR101601095B1 (ko)	2013-12-31	2016-03-09	현대자동차 주식회사	단열 코팅 조성물 및 단열 코팅층
KR101684527B1 (ko) *	2015-05-07	2016-12-08	현대자동차 주식회사	엔진용 실린더 블록
KR102355285B1 (ko) *	2017-07-14	2022-01-24	엘지디스플레이 주식회사	접촉 감응 소자 및 이를 포함하는 표시 장치
TWI700332B (zh)	2018-12-06	2020-08-01	台燿科技股份有限公司	無鹵素低介電樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板
CN114316832B (zh) *	2019-07-08	2023-12-08	浙江福莱新材料股份有限公司	广告车身贴膜
WO2022082425A1 (zh)	2020-10-20	2022-04-28	律胜科技股份有限公司	喷墨用硬化性组成物、硬化物及柔性印刷电路板
KR102429087B1 (ko) *	2020-12-02	2022-08-08	한국전자기술연구원	커버레이 필름 제조용 수지 조성물, 이를 이용한 커버레이 필름 및 인쇄회로기판의 제조방법
KR102638448B1 (ko) *	2021-11-26	2024-02-21	한국전자기술연구원	굴곡성 특성이 우수한 필름 대체용 소재

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2001
- 2001-02-09 JP JP2001034161A patent/JP5318306B2/ja not_active Expired - Lifetime
2002
- 2002-02-07 KR KR20020006961A patent/KR100834604B1/ko not_active Expired - Fee Related
- 2002-02-07 CN CNB021035423A patent/CN1200976C/zh not_active Expired - Lifetime
- 2002-02-07 TW TW91102182A patent/TW575636B/zh not_active IP Right Cessation
- 2002-02-08 AT AT02002892T patent/ATE308586T1/de not_active IP Right Cessation
- 2002-02-08 EP EP20020002892 patent/EP1231240B8/de not_active Expired - Lifetime
- 2002-02-08 US US10/071,624 patent/US6743841B2/en not_active Expired - Lifetime
- 2002-02-08 DE DE2002606980 patent/DE60206980T2/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US20020161077A1 (en)	2002-10-31
CN1200976C (zh)	2005-05-11
DE60206980T2 (de)	2006-07-27
KR100834604B1 (ko)	2008-06-02
JP5318306B2 (ja)	2013-10-16
KR20020066189A (ko)	2002-08-14
EP1231240B8 (de)	2006-01-11
TW575636B (en)	2004-02-11
US6743841B2 (en)	2004-06-01
EP1231240A1 (de)	2002-08-14
JP2002235001A (ja)	2002-08-23
EP1231240B1 (de)	2005-11-02
DE60206980D1 (de)	2005-12-08
CN1369526A (zh)	2002-09-18

Legal Events

Date	Code	Title	Description
2006-05-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
DE60206980D1 (de)	2005-12-08	Hitzebeständige Zusammensetzung
KR900004836A (ko)	1990-04-13	수지 조성물 및 이의 경화방법
MY145123A (en)	2011-12-30	Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device
DE60232225D1 (de)	2009-06-18	Bor enthaltende schmierölzusammensetzung mit niedrigem schwefel- und phosphorgehalt
TW200502322A (en)	2005-01-16	RTV heat conductive silicone rubber compositions
BRPI0601311A (pt)	2006-09-19	mercaptosilanos
EP2337810A1 (de)	2011-06-29	Polydialkylsiloxanverbrückte biphotochrome moleküle
DE60201097D1 (de)	2004-10-07	Härtbare Harzzusammensetzung und ihre Verwendung
BR0210737A (pt)	2004-07-20	Composição de organopolissiloxano curável a temperatura ambiente
FR2747122B1 (fr)	2003-01-17	Hydroxyphenyltriazines et compositions de polymeres organiques stabilisees par des hydroxyphenyltriazines
RU2010151565A (ru)	2012-07-27	Отверждаемая органополисилоксановая композиция и полупроводниковое устройство
ES2139022T3 (es)	2000-02-01	Recubrimiento de polisiloxano.
BRPI0719411A8 (pt)	2018-01-02	Aditivo para uma composição de revestimento, método para melhorar o desempenho de uma composição de revestimento, método para revestir um substrato, artigo, composição de revestimento e kit para preparar uma composição de revestimento
TW200636010A (en)	2006-10-16	Silicon-containing curable composition and its cured product
TW200736291A (en)	2007-10-01	Epoxy resin composition for encapsulation and electronic component device
BRPI0518490A2 (pt)	2008-11-25	revestimento com base em polissilazano bem como seu uso para o revestimento de pelÍculas, particularmente pelÍculas polimÉricas
JPS578247A (en)	1982-01-16	Room temperature curable polyorganosiloxane composition
BR0111875A (pt)	2003-06-24	Composição para revestimentos com cura a temperatura ambiente
BR0004777A (pt)	2001-05-29	Composição de resina do tipo poliolefina que retarda a chama, artigo de manufatura, e cabos que retardam a chama
FI102078B (fi)	1998-10-15	Alkoholeja lohkaisemalla elastomeereiksi verkkoutettavat organo(poly)s iloksaanimassat
EP1400513A4 (de)	2005-04-13	Unsymmetrische cyclische diaminverbindung
ATE140019T1 (de)	1996-07-15	Polysiloxan-stabilisatoren mit sterisch gehinderten phenolgruppen und oxamidgruppen
KR900013350A (ko)	1990-09-05	이중음영 경화에 의한 자외선 경화 상사 피복물
BR9912199A (pt)	2001-04-10	Agentes ectoparasiticidas
EP1164170A4 (de)	2002-09-18	Flammhemmende aromatische polyamidharzzusammensetzung und daraus geformter gegenstand