ATE309310T1 - Elektrisch leitfähige polysiloxan- schmelzklebstoffzusammensetzung - Google Patents
Elektrisch leitfähige polysiloxan- schmelzklebstoffzusammensetzungInfo
- Publication number
- ATE309310T1 ATE309310T1 AT01119482T AT01119482T ATE309310T1 AT E309310 T1 ATE309310 T1 AT E309310T1 AT 01119482 T AT01119482 T AT 01119482T AT 01119482 T AT01119482 T AT 01119482T AT E309310 T1 ATE309310 T1 AT E309310T1
- Authority
- AT
- Austria
- Prior art keywords
- hot
- electrically conductive
- adhesive composition
- composition
- conductive polysiloxane
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000004822 Hot adhesive Substances 0.000 title 1
- -1 POLYSILOXANE Polymers 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- 239000012943 hotmelt Substances 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 239000013464 silicone adhesive Substances 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000011231 conductive filler Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/661,416 US6433055B1 (en) | 2000-09-13 | 2000-09-13 | Electrically conductive hot-melt silicone adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE309310T1 true ATE309310T1 (de) | 2005-11-15 |
Family
ID=24653504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01119482T ATE309310T1 (de) | 2000-09-13 | 2001-08-14 | Elektrisch leitfähige polysiloxan- schmelzklebstoffzusammensetzung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6433055B1 (de) |
| EP (1) | EP1188810B1 (de) |
| JP (1) | JP5230047B2 (de) |
| KR (1) | KR100776117B1 (de) |
| AT (1) | ATE309310T1 (de) |
| DE (1) | DE60114738T2 (de) |
| TW (1) | TW567218B (de) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3106399B2 (ja) | 1989-10-23 | 2000-11-06 | ヤマハ発動機株式会社 | 自動二輪車 |
| US20030164220A1 (en) * | 1997-02-06 | 2003-09-04 | Downs John P. | Stand and pneumatic actuator for adhesive segment applicator apparatus |
| US20030118771A1 (en) * | 1997-02-06 | 2003-06-26 | Downs John P. | Roll of adhesive segments for use in an adhesive segment applicator apparatus and method of making the same |
| US7195049B2 (en) * | 1997-02-06 | 2007-03-27 | Glue Dots International, Llc | Handheld mechanical adhesive segment applicator apparatus and method |
| US7837815B2 (en) * | 1997-02-06 | 2010-11-23 | Glue Dots International Llc | Adhesive segment indexing method and apparatus and roll of adhesive segments for use therewith |
| US5935670A (en) * | 1997-02-06 | 1999-08-10 | All-Pak Sales, Inc. | Thermoplastic adhesive dispensing method and apparatus |
| US20030168731A1 (en) * | 2002-03-11 | 2003-09-11 | Matayabas James Christopher | Thermal interface material and method of fabricating the same |
| US6815486B2 (en) * | 2002-04-12 | 2004-11-09 | Dow Corning Corporation | Thermally conductive phase change materials and methods for their preparation and use |
| JP3846575B2 (ja) * | 2002-06-27 | 2006-11-15 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
| US7210227B2 (en) * | 2002-11-26 | 2007-05-01 | Intel Corporation | Decreasing thermal contact resistance at a material interface |
| JP2005076023A (ja) * | 2003-09-04 | 2005-03-24 | Hitachi Chem Co Ltd | 低弾性接着剤並びにこの接着剤を用いた積層物、接着剤付き放熱板、接着剤付き金属箔 |
| JP4219793B2 (ja) * | 2003-11-25 | 2009-02-04 | 信越化学工業株式会社 | 放熱用シリコーングリース組成物 |
| KR20060126674A (ko) * | 2003-11-27 | 2006-12-08 | 제이에스알 가부시끼가이샤 | 핫멜트형 접착제 조성물 |
| US20080017323A1 (en) * | 2003-12-09 | 2008-01-24 | Peterson Burton J | Handheld adhesive applicator |
| US20050126692A1 (en) * | 2003-12-09 | 2005-06-16 | Hajny Roger V. | System and method for advancing thermoplastic adhesive segment dispensing tape and applying adhesive segments thereby |
| US8006734B2 (en) * | 2003-12-09 | 2011-08-30 | Glue Dots International Llc | System and method for advancing thermoplastic adhesive segment dispensing tape and applying adhesive segments thereby |
| US20050255275A1 (en) * | 2004-05-14 | 2005-11-17 | Downs John P | Adhesive dispensing tape including a transparent carrier material |
| US20050084641A1 (en) * | 2004-05-14 | 2005-04-21 | Glue Dots International, Llc | Perforated adhesive dispensing sheets |
| EP1833918B1 (de) | 2004-12-23 | 2011-09-28 | Dow Corning Corporation | Vernetzbare saccharid-siloxan-zusammensetzungen und daraus gebildete netzwerke, überzüge und artikel |
| CN101228311A (zh) * | 2005-05-23 | 2008-07-23 | 陶氏康宁公司 | 含糖-硅氧烷共聚物的表面处理组合物 |
| JP5122444B2 (ja) * | 2005-05-23 | 2013-01-16 | ダウ・コーニング・コーポレイション | サッカリド−シロキサンコポリマーを含むパーソナルケア組成物 |
| US7886813B2 (en) * | 2005-06-29 | 2011-02-15 | Intel Corporation | Thermal interface material with carbon nanotubes and particles |
| EP2019678A4 (de) | 2006-05-23 | 2012-05-02 | Dow Corning | Neuartige silikonfilmformer zur verabreichung von wirkstoffen |
| JP5197631B2 (ja) * | 2007-02-20 | 2013-05-15 | ダウ コーニング コーポレーション | 水素結合性ポリオルガノシロキサンベースの充填材処理剤 |
| US9212300B2 (en) * | 2007-08-10 | 2015-12-15 | Henkel Ag & Co. Kgaa | Reactive hot melt adhesive |
| US20090111925A1 (en) * | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| EP2291482A1 (de) * | 2008-06-24 | 2011-03-09 | Dow Corning Corporation | Heissschmelzende haftmittelzusammensetzungen sowie verfahren zu ihrer herstellung und verwendung |
| US20090321922A1 (en) * | 2008-06-30 | 2009-12-31 | Ravi Shankar | Self-healing thermal interface materials for semiconductor packages |
| US8101276B2 (en) | 2008-09-16 | 2012-01-24 | Henkel Corporation | Pressure sensitive adhesive compositions and articles prepared using such compositions |
| US8440304B2 (en) | 2008-09-16 | 2013-05-14 | Henkel Corporation | Acrylic pressure sensitive adhesive formulation and articles comprising same |
| JP5375357B2 (ja) * | 2009-06-18 | 2013-12-25 | 横浜ゴム株式会社 | 反応性ホットメルト接着剤組成物 |
| WO2011087741A2 (en) | 2009-12-22 | 2011-07-21 | Henkel Corporation | Moisture cure hot melt adhesives |
| US8853372B2 (en) | 2010-08-23 | 2014-10-07 | Dow Corning Corporation | Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes |
| JP2011094147A (ja) * | 2010-11-30 | 2011-05-12 | Hitachi Chem Co Ltd | 低弾性接着剤並びにこの接着剤を用いた積層物、接着剤付き放熱板、接着剤付き金属箔 |
| DE102011001962A1 (de) | 2011-04-11 | 2012-10-11 | Thyssenkrupp Uhde Gmbh | Verfahren und Anlage zur biologischen Reinigung von Kokereiabwasser |
| USD708666S1 (en) | 2011-11-18 | 2014-07-08 | Glue Dots International, Llc | Dispenser |
| JP2013170264A (ja) * | 2012-02-23 | 2013-09-02 | Shinshu Univ | シリコーン系接着剤組成物およびその硬化体 |
| US9365751B2 (en) | 2012-07-24 | 2016-06-14 | Henkel IP & Holding GmbH | Reactive hot melt adhesive |
| JP5849036B2 (ja) * | 2012-09-27 | 2016-01-27 | 富士フイルム株式会社 | 導電ペースト、プリント配線基板 |
| CN104981527B (zh) | 2013-01-24 | 2018-02-23 | 汉高知识产权控股有限责任公司 | 反应性热熔性粘合剂 |
| ES2691483T3 (es) | 2014-01-14 | 2018-11-27 | Henkel IP & Holding GmbH | Adhesivos reactivos de fusión en caliente con adherencia mejorada |
| DE102015007157A1 (de) | 2015-06-03 | 2016-12-08 | imbut GmbH | Flächige elektrische Kontaktierung und Verfahren zu deren Herstellung |
| US9725577B1 (en) | 2016-08-30 | 2017-08-08 | International Business Machines Corporation | Self-healing thermal interface materials |
| JP6823177B2 (ja) | 2016-12-15 | 2021-01-27 | ダウ シリコーンズ コーポレーション | 縮合硬化性導電性シリコーン接着剤組成物 |
| JP7419251B2 (ja) | 2018-10-30 | 2024-01-22 | ダウ・東レ株式会社 | 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途 |
| JP7456938B2 (ja) | 2018-12-27 | 2024-03-27 | ダウ・東レ株式会社 | ホットメルト性を有する硬化性シリコーンシートの製造方法 |
| WO2020138410A1 (ja) | 2018-12-27 | 2020-07-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| US12173157B2 (en) | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Curable silicone composition, cured product thereof, and method for producing same |
| JP6959950B2 (ja) * | 2019-03-04 | 2021-11-05 | 信越化学工業株式会社 | 非硬化型熱伝導性シリコーン組成物 |
| JP7560442B2 (ja) * | 2019-03-29 | 2024-10-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| EP3950844B1 (de) | 2019-03-29 | 2026-03-11 | Dow Toray Co., Ltd. | Härtbare silikonzusammensetzung, gehärtetes produkt daraus und verfahren zur herstellung davon |
| KR102952088B1 (ko) * | 2019-03-29 | 2026-04-15 | 다우 도레이 캄파니 리미티드 | 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법 |
| CN113728401B (zh) | 2019-04-26 | 2023-08-29 | 花王株式会社 | 导电性构件的制造方法 |
| EP4083140A4 (de) | 2019-12-27 | 2024-01-10 | Dow Toray Co., Ltd. | Härtbare, heissschmelzende silikonzusammensetzung, gehärtetes material daraus und laminat mit härtbarer heissschmelzender silikonzusammensetzung oder gehärtetem material daraus |
| WO2021148916A1 (en) * | 2020-01-22 | 2021-07-29 | 3M Innovative Properties Company | Electrically conductive adhesive layer |
| US12581949B2 (en) * | 2020-01-22 | 2026-03-17 | 3M Innovative Properties Company | Thermal interface layer |
| GB2635132A (en) * | 2023-10-30 | 2025-05-07 | Occam Bci Inc | A wearable sensor having dry electrodes, and a manufacturing method |
| WO2026020412A1 (en) | 2024-07-25 | 2026-01-29 | Dow Silicones Corporation | Curable silicone composition |
| WO2026020411A1 (en) | 2024-07-25 | 2026-01-29 | Dow Silicones Corporation | Curable silicone composition |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3888815A (en) | 1973-08-20 | 1975-06-10 | Gen Electric | Self-bonding two-package room temperature vulcanizable silicone rubber compositions |
| FR2605326A1 (fr) * | 1986-10-20 | 1988-04-22 | Rhone Poulenc Multi Tech | Composition potentiellement adhesive electriquement conductrice. |
| FR2606784B1 (fr) | 1986-11-14 | 1989-03-03 | Rhone Poulenc Multi Tech | Composition potentiellement adhesive electriquement conductrice |
| US4865920A (en) | 1988-09-20 | 1989-09-12 | Dow Corning Corporation | Hot-melt pressure sensitive adhesive article and method of making |
| JP2835527B2 (ja) | 1989-10-13 | 1998-12-14 | 東レ・ダウコーニング・シリコーン株式会社 | 電気接点の導電障害非招来性シリコーン組成物及び導電障害防止方法 |
| US5246997A (en) | 1990-02-21 | 1993-09-21 | Dow Corning Corporation | Method of making a hot-melt silicone pressure sensitive adhesive-coated substrate |
| US5147916A (en) | 1990-02-21 | 1992-09-15 | Dow Corning Corporation | Hot-melt silicone pressure sensitive adhesive composition and related methods and articles |
| US5162410A (en) | 1990-04-13 | 1992-11-10 | Dow Corning Corporation | Hot-melt silicon pressure sensitive adhesives with phenyl-containing siloxane fluid additive and related methods and articles |
| JPH086036B2 (ja) * | 1990-08-10 | 1996-01-24 | 信越化学工業株式会社 | 導電性室温硬化性オルガノポリシロキサン組成物及びその硬化物 |
| US5300299A (en) | 1991-07-22 | 1994-04-05 | Dow Corning Corporation | Silicone pressure sensitive adhesive containing alkylmethylsiloxane wax and related methods and devices |
| US5328696A (en) | 1991-07-22 | 1994-07-12 | Dow Corning Corporation | Devices using silicone pressure sensitive adhesives containing organic wax |
| US5340887A (en) | 1993-06-11 | 1994-08-23 | Dow Corning Corporation | Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives |
| US5302671A (en) | 1993-06-11 | 1994-04-12 | Dow Corning Corporation | Moisture-curable compositions containing aminoalkoxy-functional silicone |
| US5905123A (en) | 1993-06-11 | 1999-05-18 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitive adhesives |
| ES2113023T3 (es) * | 1993-10-06 | 1998-04-16 | Dow Corning Toray Silicone | Composiciones organosiloxanos electroconductoras cargadas de plata. |
| US5482988A (en) | 1994-01-14 | 1996-01-09 | Dow Corning Corporation | Hot-melt silicone pressure sensitive adhesive with siloxylated polyether waxes as additives |
| US5371128A (en) | 1994-01-14 | 1994-12-06 | Dow Corning Corporation | Hot-melt silicone pressure sensitive adhesive with siloxylated allyloxypropane diol copolymers as additives |
| US5473026A (en) | 1994-06-20 | 1995-12-05 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitive adhesives |
| US5508360A (en) | 1995-03-31 | 1996-04-16 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitive adhesives |
| US6010646A (en) * | 1997-04-11 | 2000-01-04 | Potters Industries, Inc. | Electroconductive composition and methods for producing such composition |
| US6017587A (en) * | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
| US6361716B1 (en) * | 2000-07-20 | 2002-03-26 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
| US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
| US6465550B1 (en) * | 2000-08-08 | 2002-10-15 | Dow Corning Corporation | Silicone composition and electrically conductive, cured silicone product |
-
2000
- 2000-09-13 US US09/661,416 patent/US6433055B1/en not_active Expired - Fee Related
-
2001
- 2001-06-27 TW TW090115605A patent/TW567218B/zh not_active IP Right Cessation
- 2001-08-14 EP EP01119482A patent/EP1188810B1/de not_active Expired - Lifetime
- 2001-08-14 AT AT01119482T patent/ATE309310T1/de not_active IP Right Cessation
- 2001-08-14 DE DE60114738T patent/DE60114738T2/de not_active Expired - Lifetime
- 2001-09-12 KR KR1020010056253A patent/KR100776117B1/ko not_active Expired - Fee Related
- 2001-09-13 JP JP2001278813A patent/JP5230047B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100776117B1 (ko) | 2007-11-16 |
| EP1188810A2 (de) | 2002-03-20 |
| JP2002155261A (ja) | 2002-05-28 |
| EP1188810B1 (de) | 2005-11-09 |
| EP1188810A3 (de) | 2003-10-22 |
| DE60114738D1 (de) | 2005-12-15 |
| KR20020021068A (ko) | 2002-03-18 |
| US6433055B1 (en) | 2002-08-13 |
| JP5230047B2 (ja) | 2013-07-10 |
| TW567218B (en) | 2003-12-21 |
| DE60114738T2 (de) | 2006-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |